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Protecting the Die and Press - White Paper
those decisions. n The right control package is key for a good die protection. 7. Reduce costs and loss of. program. Defining the control system that receives the. business associated with. information from the sensors is also a critical part of the process. stamping process delays. How many inputs...
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Sorting out vacuum-pump technology
, it's ironic that so many processes rely heavily on low-pressure solutions. Vacuum systems are frequently the method of choice for keeping products moving and plants and equipment running efficiently. These operations require vacuum pumps. But within the vacuum-pump arena are. Sorting out vacuum-pump...
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MICRO: Product Tech News
the depth and surface planarity of critical front-end structures at the 90- and 65-nm nodes and below. The tool provides direct, non-destructive, within-die measurements at production-level throughputs. Key features include an automated tip exchange for improved ease of use, an advanced...
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MICRO:Product Technology News (July '99)
contamination, improves storage density, minimizes problems associated with wafer sorting, and prevents exposure to airborne molecular contamination when moving wafers within the fab as well as between test and manufacturing facilities. The module is made from a noncontaminating polycarbonate-based material...
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Product Technology News
finding in two cassettes, batch noncontact wafer ID reading with software, single wafer sorting, and batch wafer transfers. A cleanroom table is a standard feature of the user-friendly system. Back-to-back, face-to-face wafer-loading is an option. Footprint is 38 x 20 in. (Semicon/Europa, Booth 1451...
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Application 013: Warehouse & Logistics Gilmer, Georgia/USA
cans. Pallets are simply loaded using forklifts and flow smoothly through the storage system on three-segment roller tracks at a 4% angle of incline. Pallets are placed onto extremely durable die-cast aluminium rollers. All intermediate flow system modules are fitted with polycarbonate rollers...
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Product Technology News
analysis software locates and precisely aligns wafers before steps such as metrology, probing, and inspection. The high-throughput program accurately locates wafer and die patterns in spite of variances caused by CMP and other process steps. The program also recognizes missing and extraneous pieces...
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MICRO: Product Technology News (January 2001)
, the high-throughput tool can detect defects 100 nm. The system's beam-splitting technology makes possible multibeam UV inspection, and its image computer supports the use of proprietary algorithms for high-sensitivity die-to-die pattern inspection. The tool can search for both contamination...
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MICRO:Product Technology News (Jan '2000)
laminated to a membrane that is then attached to any standard dicing frame, the carrier is compatible with die-sorting and die-bonding equipment. The frame can be configured to release a die by means of standard pin ejection with reduced force or via the manufacturer's vacuum release technology...
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Wide Variety Small Volume Production
designs in regard to "Wide Variety Small Volume" production lines. We'll begin with sorting of the design process and a flow. [see Fig. 1] "Designing" is a process of decision making (on LCA performance, manufacturing drawings, and information on how to operate) to create "Something" when a need...