Page: 1 2 3 Next

Parts by Number Top

Part # Distributor Manufacturer Product Category Description
PIC 500-625 PEI-Genesis Pico Corp. Not Provided SPRING FOR 500 DIE SET 4PCS
1-23847-0 Powell Electronics, Inc. TE Connectivity Not Provided SPRING,DIE
803036-1 Powell Electronics, Inc. TE Connectivity Not Provided SPRING, COMP. (DIE)
TP19927A01 Digi-Key Panduit Corp Tools SPRING DIE
0637003407 Digi-Key Molex Inc Tools DIE SPRING
More >>

Conduct Research Top

  • Sensoring for In-Die Tapping Applications
    All commercially-available In Die Tapping (IDT) designs today utilize some sort of spring-loaded misfeed protection system which is intended to protect the tap and, most importantly, the tapping device itself in the event of a: * No-hole condition due to a short feed of the material strip
  • Sensor Film Shows Assembly Clamp Needs a Redesign
    , Meiselbach used the film to monitor clamp pressures during the redesign of several clamps that now employ silicone die springs to regulate pressure more precisely. "A sample pack of Pressurex with films that revealed different surface pressure ranges allowed production to continue, " says Meiselbach
  • Proximity sensors for stamping dies
    into the dies. Cylindrical sensors in spring-loaded lifters make sure materials are in proper position before dies close. With some die operations approaching 1,500 strokes/min, it is even more critical to ensure proper sensor placement and operation. Sensors monitor critical points in progressive
  • MICRO: EDITOR'S PAGE
    ucked away on a Cambridge side street in the midst of the MIT campus sits one of the largest dedicated MEMS fabs on the planet. The building that once housed a Polaroid R &D facility now produces about a million die a week for Analog Devices' micromachined products division. When I visited
  • FEA For The Shop Floor
    rolling, hydroforming, and stretchforming. Stretchforming and hydroforming can be simulated to accurately predict spring-back before building a die. In stretchforming, panels are stretched over a mandrel and then released, whereupon they spring back. These simulations allow properly forming panels
  • Characterizing a rapid thermal annealing process to improve sensor yield
    . In the acceleration sensor manufactured by Motorola's MEMS-1 die manufacturing group, three polysilicon plates are fabricated parallel to one another to form a dual, differential capacitive element (see Figure 1). The top and bottom plates are stationary, while the middle plate can move in the direction
  • Application Overview: Wire Drawing
    The process of wire drawing has in effect changed very little over the years. It uses a combination of a die and/or a series of dies to draw wire to a selected gauge. Drawn wire is in many applications beyond what we normally would think like electrical wire and TV cables. For example, springs
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    AMD confirms Athlon XP 3200+ is same die as predecessor Advanced Micro Devices Inc. has confirmed that the latest version of its Athlon

More Information Top

Lock Indicates content that may require registration and/or purchase. Powered by IHS Goldfire