• Description: Master Bond Polymer System EP19HT is a storage stable one component liquid epoxy resin system for durable, high performance adhesive/sealants, impregnants and liners. It features remarkably long shelf life and excellent storage characteristics at ambient temperatures yet cures readily at elevated

    • Substrate / Material Compatibility: Metal, Porous Surfaces
    • Chemical / Polymer System Type: Epoxy (EP), Specialty / Other
    • Features: Electrical Insulation / Dielectric Material, Encapsulanting / Potting
    • Industry: Electronics, Electrical Power / HV

  • Description: . EPO-TEK® H70E-175 Advantages & Application Notes:  Semiconductor: die attaching chips to lead-frames or ceramic microcircuit substrates  Hybrid packaging: dielectric and thermal adhesive for microwave and military circuits; reinforcing capacitor and resistor SMD attach

    • Substrate / Material Compatibility: Metal, Plastic
    • Chemical / Polymer System Type: Epoxy (EP)
    • Filled / Reinforced: Yes
    • Features: Thermal Compound / Interface (Thermally Conductive), Electrical Insulation / Dielectric Material

  • Description: One-part; non-corrosive, rapid heat cure; non-flow; self-priming adhesion; contains UV indicator for automated inspection. 305 ml cartridge. Documentation: Dow Corning MSDS/TDS This item does not ship on Fridays!

    • Chemical / Polymer System Type: Silicone
    • Dielectric Strength: 2.11E7 V/m

  • Description: ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire

    • Dissimilar Substrates: Yes
    • Chemical / Polymer System Type: Epoxy (EP)
    • Filled / Reinforced: Yes
    • Features: Electrical Insulation / Dielectric Material, Laminating / Composites, Non-corrosive Cure

  • Description: SEMICOSIL® 988/1K is a non-slump, thermally curable, addition-curing, one-part silicone rubber. Special characteristics Ready-to-use, one-part system Thixotropic Transparent Medium hardness High flexibility (low-stress adhesive) Rapid heat cure Excellent primerless adhesive to many

    • Chemical / Polymer System Type: Silicone, Rubber Based / Elastomeric
    • Features: Electrical Insulation / Dielectric Material, Flexible / Dampening
    • Industry: Electronics
    • Viscosity: 30000 to 450000 cps

  • Description: . EP30AOSP is also an excellent adhesive/sealant forming durable, rigid bonds that are resistant to thermal cycling and chemicals including water, oil and most organic solvents, over the wide temperature range of -60°F to 250°F. The thermal expansion coefficient is desirably low. Color of part

    • Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Composites, Metal, Plastic, Porous Surfaces, Rubber / Elastomer, Wood / Wood Product
    • Dissimilar Substrates: Yes
    • Chemical / Polymer System Type: Epoxy (EP)
    • Filled / Reinforced: Yes

  • Description: excellent reversion stability electrically insulating Application General-purpose adhesive for the PV industry, e.g. for frame sealing or bonding of junction boxes.

    • Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic
    • Chemical / Polymer System Type: Silicone, Rubber Based / Elastomeric
    • Features: Electrical Insulation / Dielectric Material
    • Industry: OEM / Industrial, Other

  • Description: Resinlab® EP 950G is a high temperature, heat curing, aluminum filled rubber modified epoxy. 12 ounce.

    • Chemical / Polymer System Type: Epoxy (EP), Rubber Based / Elastomeric
    • Industry: Aerospace, Automotive, Electronics, Marine, Medical / Food (Sanitary / FDA), Military / Government (MIL-SPEC / GG), OEM / Industrial, Optical Grade / Material, Photonics / Optoelectronics
    • Use Temperature: -40 to 302 F
    • Thermal Conductivity: 0.5000 W/m-K

  • Description: General type, insulative conductivity, oven, snap cure method

    • Substrate / Material Compatibility: Metal, Plastic
    • Chemical / Polymer System Type: Epoxy (EP)
    • Features: Thermal Insulation / Heat Insulating, Electrical Insulation / Dielectric Material
    • Industry: Electronics

  • Description: Master Bond UV15DC80 is a very special dual cured (UV/heat) curable system featuring the capacity to cure in shadowed out of areas by supplementary heat curing at 80°C for 15-30 minutes. In addition, UV15DC80 has outstanding physical properties including superb physical strength characteristics

    • Substrate / Material Compatibility: Ceramic / Glass, Metal, Paper / Paperboard, Plastic, Porous Surfaces, Rubber / Elastomer, Wood / Wood Product, Other
    • Dissimilar Substrates: Yes
    • Chemical / Polymer System Type: Polyurethane (PU, PUR)
    • Features: Thermal Insulation / Heat Insulating, Electrical Insulation / Dielectric Material, Encapsulanting / Potting, Laminating / Composites, Leveling / Filling Compound, Non-corrosive Cure

  • Description: temperature range of -75°F to +400°F. It is available as a translucent clear as well as other colors. It also has superb weatherability and moisture resistance. MasterSil 410 silicone adhesive/sealant is widely employed for its reliable and high quality performance for bonding, and sealing metal

    • Chemical / Polymer System Type: Silicone
    • Industry: Medical / Food (Sanitary / FDA), Military / Government (MIL-SPEC / GG)
    • Use Temperature: -75 to 400 F
    • Tensile Strength (Break): 400 psi

  • Description: Master Bond Polymer System EP30LTE-LO is a recently developed thermal shock resistant epoxy resin system with uniquely low thermal expansion properties and unmatched dimensional stability for high performance bonding, sealing and casting. This new two component epoxy resin compound which cures

    • Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Composites, Metal, Plastic, Porous Surfaces, Rubber / Elastomer, Wood / Wood Product
    • Dissimilar Substrates: Yes
    • Chemical / Polymer System Type: Epoxy (EP)
    • Filled / Reinforced: Yes

  • Description: Trickle resin system for impregnation or protective overcoat

    • Substrate / Material Compatibility: Metal, Paper / Paperboard, Plastic
    • Dissimilar Substrates: Yes
    • Chemical / Polymer System Type: Epoxy (EP)
    • Features: UL Approved, Electrical Insulation / Dielectric Material

  • Description: Master Bond Master Sil 702 is ready-to-use, one component high performance silicone elastomer compound for bonding and sealing which fully meets MIL-A-46146 Type I specification. Master Sil 702 is heat resistant to 450°F. It is supplied as an easy to apply paste and reacts with moisture in the

    • Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic, Rubber / Elastomer
    • Chemical / Polymer System Type: Silicone
    • Features: Electrical Insulation / Dielectric Material, Non-corrosive Cure
    • Industry: Electronics, Military / Government (MIL-SPEC / GG)

  • Description: No Description Provided

    • Substrate / Material Compatibility: Concrete / Masonry, Metal, Plastic, Porous Surfaces
    • Chemical / Polymer System Type: Epoxy (EP)
    • Filled / Reinforced: Yes
    • Features: Leveling / Filling Compound

  • Description: OMEGA's THERMCOAT KIT is used for cementing fine-gage thermocouples in place on metal, plastic and ceramic surfaces and for assembling and installing thermopiles, temperature probes and thermocouple bolometers. THERMCOAT CO and THERMCOAT COL This is a fast-setting two-part cement which should be

    • Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic
    • Chemical / Polymer System Type: Ceramic / Inorganic Cement
    • Features: Thermal Compound / Interface (Thermally Conductive)
    • Viscosity: 110 cps

  • Description: EPO-TEK® 353ND is a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications. It is one of the most popular EPO-TEK® brand products, and is known throughout the world for its performance and reliability. Also available in a single

    • Substrate / Material Compatibility: Ceramic / Glass
    • Chemical / Polymer System Type: Epoxy (EP)
    • Industry: Aerospace, Medical / Food (Sanitary / FDA), Optical Grade / Material, Photonics / Optoelectronics, Semiconductors / IC Packaging
    • Viscosity: 3000 to 5000 cps

  • Description: No Description Provided

    • Filled / Reinforced: Yes
    • Features: Thermal Compound / Interface (Thermally Conductive), Electrical Insulation / Dielectric Material
    • Industry: Electronics

  • Description: 10-3785 is a one component (no mixing necessary) epoxy adhesive. This product maintains exceptionally strong structural bonds over a wide temperature range (-55°C to 150°C). A unique and popular feature of the 10-3785 is its’ ability to cure at temperatures as low as 93°C (200°

    • Chemical / Polymer System Type: Epoxy (EP)
    • Features: Electrical Insulation / Dielectric Material
    • Industry: Aerospace, Electronics, OEM / Industrial
    • Use Temperature: -67 to 302 F

  • Description: PNU-46202™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection

    • Substrate / Material Compatibility: Ceramic / Glass, Metal, Paper / Paperboard, Plastic
    • Chemical / Polymer System Type: Polyurethane (PU, PUR)
    • Features: Electrical Insulation / Dielectric Material
    • Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging

  • Description: Dielectric, moisture resistant, thermocouples

    • Substrate / Material Compatibility: Ceramic / Glass
    • Chemical / Polymer System Type: Ceramic / Inorganic Cement
    • Filled / Reinforced: Yes
    • Features: Thermal Compound / Interface (Thermally Conductive), Thread Locker / Retainer, Electrical Insulation / Dielectric Material

  • Description: 10-3018 is a two component epoxy adhesive and sealant. This two component system has excellent chemical and heat resistance. 10-3018 is widely used as a stencil and screen adhesive due to its bonding strength and toughness.

    • Chemical / Polymer System Type: Epoxy (EP)
    • Features: Electrical Insulation / Dielectric Material
    • Industry: OEM / Industrial
    • Viscosity: 95000 to 350000 cps

  • Description: 10-3213 is a new two part epoxy adhesive system which exhibits high bond strength and outstanding thermal shock resistance. The 10-3213 has proven to be an excellent quick set patch and repair adhesive with excellent sealant capabilities.

    • Chemical / Polymer System Type: Epoxy (EP)
    • Features: Electrical Insulation / Dielectric Material
    • Industry: Building / Construction
    • Use Temperature: -76 to 392 F

  • Description: 20-3068 is a room temperature curing, two component, epoxy potting compound, adhesive, and coating system. The 20-3068 meets the Food and Drug Administration (FDA) regulations permitting use in food contact applications. When properly cured, these products comply with the FDA regulations of Title

    • Chemical / Polymer System Type: Epoxy (EP)
    • Features: Electrical Insulation / Dielectric Material, Encapsulanting / Potting
    • Industry: Medical / Food (Sanitary / FDA)
    • Viscosity: 6400 cps

  • Description: Hernon® Fusionbond® engineered structural adhesive offers bonds stronger than steel. Fusionbond® is a two-component, methacrylate adhesive that is specially formulated to bond many diverse substrates and offer unparalleled chemical resistance. It is also resistant to fatigue

    • Substrate / Material Compatibility: Ceramic / Glass, Composites, Metal, Plastic, Porous Surfaces, Rubber / Elastomer, Wood / Wood Product
    • Dissimilar Substrates: Yes
    • Chemical / Polymer System Type: Acrylic / Polyacrylate
    • Features: Electrical Insulation / Dielectric Material, Laminating / Composites, Non-corrosive Cure, Phase Change

  • Description: A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals.

    • Substrate / Material Compatibility: Ceramic / Glass, Metal
    • Chemical / Polymer System Type: Epoxy (EP)
    • Features: Thermal Compound / Interface (Thermally Conductive), Electrical Insulation / Dielectric Material, Encapsulanting / Potting
    • Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging

  • Description: Tuffbond„¢ epoxies offer substantial moisture, chemical, and heat resistance. Use for bonding: wood, metal, ceramic, glass, plastic, masonry, stone, concrete, rubber, etc. Provides high shear strength for tough and durable bonds. Surfaces to be bonded must be clean and free of oil.

    • Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Composites, Metal, Plastic, Porous Surfaces, Rubber / Elastomer, Wood / Wood Product
    • Dissimilar Substrates: Yes
    • Chemical / Polymer System Type: Epoxy (EP)
    • Features: Electrical Insulation / Dielectric Material, Encapsulanting / Potting, Laminating / Composites, Non-corrosive Cure, Phase Change

  • Description: Glass fiber- and kevlar-reinforced, epoxy-novolac, high strength

    • Chemical / Polymer System Type: Epoxy (EP)
    • Filled / Reinforced: Yes
    • Features: Electrical Insulation / Dielectric Material, Encapsulanting / Potting, Leveling / Filling Compound
    • Industry: Electronics, OEM / Industrial

  • Description: 10-3003 NS is a new high bond strength epoxy adhesive formulated for ease in handling and convenience for the end user. This system has a non critical mix ratio and adjustable flexibility. 10-3003 NS is also very safe to use due to the absence of harmful solvents and toxic chemicals

    • Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic, Rubber / Elastomer
    • Chemical / Polymer System Type: Epoxy (EP)
    • Features: Thermal Compound / Interface (Thermally Conductive)
    • Industry: OEM / Industrial

  • Description: A rapid room-temperature curing, two-part epoxy adhesive for use in bonding many metals, wood, and a variety of plastics. Equal parts by volume are easily mixed to produce strong, impact resistant bonds.

    • Substrate / Material Compatibility: Metal, Plastic, Wood / Wood Product
    • Chemical / Polymer System Type: Epoxy (EP)
    • Industry: Aerospace, OEM / Industrial
    • Viscosity: 1.00E6 cps

  • Description: Cylinlock® Retaining Compounds are highly engineered, 100% active, high strength anaerobic liquids that cure to a tough plastic when air is excluded. The plastic shim formed when Cylinlock® cures fills the voids present in even the best shrink or press fits. These compounds also find utility

    • Substrate / Material Compatibility: Metal
    • Dissimilar Substrates: Yes
    • Chemical / Polymer System Type: Acrylic / Polyacrylate, Specialty / Other
    • Features: Thermal Insulation / Heat Insulating, Thread Locker / Retainer, Electrical Insulation / Dielectric Material, Non-corrosive Cure, Phase Change

  • Description: Cylinlock® 821 is an advanced retaining compound that features anaerobic and ultraviolet light cure. Fixture strength develops in fifteen seconds by exposing the edge fillet of a joint to a high intensity long wavelength ultraviolet light (365 nm). The hidden portion of the assembly will cure

    • Substrate / Material Compatibility: Metal
    • Dissimilar Substrates: Yes
    • Chemical / Polymer System Type: Acrylic / Polyacrylate, Specialty / Other
    • Features: Thermal Compound / Interface (Thermally Conductive), Thermal Insulation / Heat Insulating, Thread Locker / Retainer, Electrical Insulation / Dielectric Material, Non-corrosive Cure, Phase Change

  • Description: " This item can not be exported outside the United States"

    • Substrate / Material Compatibility: Concrete / Masonry, Metal, Plastic, Porous Surfaces
    • Chemical / Polymer System Type: Epoxy (EP)
    • Filled / Reinforced: Yes
    • Features: Leveling / Filling Compound

  • Description: Fluid UV resin for fill application.

    • Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic
    • Chemical / Polymer System Type: Specialty / Other
    • Features: Thermal Compound / Interface (Thermally Conductive), Electrical Insulation / Dielectric Material
    • Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging

  • Description: Rubber-toughened, high viscosity, structural adhesive with superior impact, peel and fatigue resistance. It is non-shrinking and has high dielectric strength and excellent durability and flexibility. Bonds metals, thermoset plastics and structural parts.

    • Industry: OEM / Industrial
    • Use Temperature: 40 to 200 F
    • Dielectric Strength: 2.17E7 V/m

Page: 1 2 3 Next

Parts by Number Top

Part # Distributor Manufacturer Product Category Description
275447-1 Digi-Key TE Connectivity Tapes, Adhesives SEALING & DIELECTRIC COMPOUND

Conduct Research Top

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