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Parts by Number Top

Part # Distributor Manufacturer Product Category Description
275447-1 Digi-Key TE Connectivity Tapes, Adhesives SEALING & DIELECTRIC COMPOUND

Conduct Research Top

  • Dielectric Properties of Epoxies
    barrier between two conductors (as in cross over and multi-layered. circuits) and for encapsulating circuits. Dielectric properties, specifically for epoxy adhesives, refer to the electrical properties of a material.
  • Using Mold Release Agents with Epoxy Adhesives
    . – Increasing the dielectric performance of the circuit. – Thermal management and general heat dissipation. Casting usually refers to epoxy potted electronics that are removed or recovered. from a mold. They can also be described as “casted electronics” or “casted. electronic components”. Conversely, when
  • The Adhesive Alternative and Advantage (.pdf)
    and to low-surface energy (LSE) substrates; maintain adhesion at temperatures. in excess of 500ºF; resist “out gassing;” respond to low frequency AC; resist dielectric breakdown; act as a. thermal insulator, or facilitate heat transfer; and survive the strict requirements for loss of coolant accidents
  • New Flame-Retardant Structural Adhesive
    (14 CFR 25.853/25.885), and the solvent-free formulation has very low VOC emissions. Once cured, 10 Minute Epoxy FR provides typical peel strength of 25 pli, impact resistance of 10 ft-lbs/in , dielectric strength of 800 volts/mil, and adhesive tensile lap shear strength of up to 2900 psi
  • Application Note - Effect of Solder Reflow on Secure(R) Adhesive
    expansion between the different substrates cause stress within the adhesive layer. The ability of Secure TM 1500FG to deal with this stress is determined as the difference in before and after values of adhesion strength, thermal impedance, and dielectric breakdown strength. It is shown that Secure TM
  • Medical Device Link .
    , but retains thermal stability to 325 C. When cured fully, it provides a lap shear strength of 1800 psi. Other product features include a dielectric constant of 4.1 and a dissipation factor of 0.027. The material has a shelf life of two weeks when stored at a temperature of 25 C. One-part adhesive offers
  • Silicone Rubber Thermal Interface Materials: Applications and Performance Considerations
    Simple composits of silicone rubber, extending filler, and fiberglass offer an attractive combination of thermal, physical, and electric properties that make these materials an ideal choice for use as thermal interface materials. Good dielectric strength and low thermal impedance that is relatively
  • Medical Device Link .
    environmental contamination and adhesive waste. A company uses double-effect processing, and hot- and cold-isostatic pressing to form advanced ceramic parts from alumina and zirconia. Suitable for applications requiring durability, dielectric strength, and. Products: Showcase. Skip to : [Content] [Navigation
  • FLEXcon's Performance Products for Vibration Damping (.pdf)
    . • are designed to form a bond in sub-zero cold, or to maintain adhesion. at temperatures in excess of 500ºF (260ºC). • bond to low surface energy substrates. • resist “out gassing”. • respond to low frequency AC. • greatly resist dielectric breakdown. • act as a thermal insulator, or facilitate heat
  • Medical Device Link .
    Company develops viable method for fabrication of LCP flexible circuits Flexible circuits based on liquid-crystal polymer (LCP) dielectric film feature properties superior to more commonly used polyimide-based components, but they have had limited acceptance. LCP is difficult to process, which has

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