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  • The Anisotropy of Dielectric Constant in TLY-5A Material
    Dielectric Division or Industry Peers. Contact us for more information. Taconic ADD publishes technical articles in trade magazines and presents technical papers at microwave conferences. We also receive technical articles from our customers and leading OEMs. We would like to make them available to our
  • Comprehensive Methodology to Characterize and Mitigate BGA Pad Cratering in Printed Circuit Boards
    tin-lead solder joints, and some lead-free compatible PCB dielectric materials are more brittle than conventional tin-lead compatible PCB materials. These two factors, coupled with the higher peak reflow temperatures for lead-free assembly, could transfer more strain to the PCB dielectric structure
  • Krytar Directional Coupler 2 - 50 GHz (.pdf)
    etched on opposite sides of a thin center board that is in turn sandwiched between two dielectric boards of. equal thickness. The design was accomplished with Krytar's proprietary CAD program and features State-of-the-art flat. Microwave performance. The coupler's frequency sensitivity or coupling
  • FlexiCapTM - Reducing Mechanical Cracking on PCBs
    range of Multilayer Capacitors to permit greater degrees of board bending without damage to capacitors. The multilayer ceramic chip capacitor is the capacitor of choice for surface mount applications. There are generally three dielectric categories available; C0G [NP0], X7R and Y5V. Sizes usually range
  • Krytar 3 dB 90 Degree Hybrids. Covers 0.5 - 40 GHz (.pdf)
    between. two equal thickness dielectric boards. The tight 3 dB coupling is realized by using a non-uniform. tapered line design synthesized with a CAD program developed at Krytar. Typical amplitude and phase imbalance performance is shown in figure 3 for model 3100400 which. covers 10 ­ 40 GHz
  • Multilayer Lamination Methods for PTFE-Based PCBs
    will be reviewed: · Single lamination, all PTFE based laminates · Single lamination, mixed dielectrics · Sequential lamination, all PTFE based laminates · Sequential lamination, mixed dielectrics. Technical Articles written by Taconic Advanced Dielectric Division or Industry Peers. Contact us for more
  • Laser Scribing Thin Silicon Nitride Films
    conductive. Thin films of SiN refractory material are used to provide diffusion barriers, as a dielectric layer or for producing stable, electrically conductive metal contact layers. Many films are essential in both silicon based and thin film solar cell fabrication. In striving to reduce costs
  • Proper Stack-Up in a Multilayer PCB to Reduce Noise Coupling and Improve EMI
    , which is a typical value used. in the stack-up one next to the other. for PI analysis. The small difference. TEsT sTRUCTURE ANd MOdEL. and separated by a 0.72 mm dielectric. in the amplitude of the measured and. TO HARdWARE VALIdATION. thickness. S-parameters are measured. simulated S. The test board

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