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  • FlexiCap TM - Reducing Mechanical Cracking on PCBs
    range of Multilayer Capacitors to permit greater degrees of board bending without damage to capacitors. The multilayer ceramic chip capacitor is the capacitor of choice for surface mount applications. There are generally three dielectric categories available; C0G [NP0], X7R and Y5V. Sizes usually range
  • PWB Solutions for High Speed Systems
    layer registration capabilities. The system requirements may drive design attributes such as low loss dielectrics, subcomposites, microvias, buried vias, and/or back drilling. Such complex board designs will limit the number of capable suppliers that can be quoted so unnecessary complexity needs
  • Application Note - Effect of Solder Reflow on Secure(R) Adhesive
    and aluminum to simulated the bonding of an electronic printed circuit board to a heat sink. The assemblies are then subjected to solder reflow conditions by submerging them into a bath of molten solder at 288oC for 10 seconds. The high temperature of solder reflow and the mismatched coefficients of thermal
  • AN0005 Mechanical Cracking
    Due to its brittle nature, multilayer ceramic capacitors are more prone to excesses of mechanical stress than other components used in surface mounting. One of the most common causes of capacitor failures is directly attributable to bending of the printed circuit board (PCB) after solder attachment
  • AN0022 Open Mode Capacitors
    Open mode Capacitors have been designed specifically for use in applications where mechanical cracking is a severe problem and short circuits due to cracking are unacceptable. Open mode capacitors use inset electrode margins, which prevent any mechanical cracks which may form during board assembly
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    No shortages seen in NOR flash The NOR flash memory market in 2003 remains in a state of oversupply, apparently belying earlier forecasts that anticipated shortages would begin sending prices higher this year. Ex-Intel technology guru joins NuTool's board Gerald Marcyk, formerly director
  • AN0001 Polymer Termination
    Due to its brittle nature, multilayer ceramic capacitors are more prone to excesses of mechanical stress than other components used in surface mounting. One of the most common causes of capacitor failures is directly attributable to bending of the printed circuit board (PCB) after solder attachment
  • Sensors take the heat
    typically see temperatures that vary from -40 to 180 C. The high temperatures of these extreme environments can induce myriad failures in electronic systems that rely on organic printed-circuit-board (PCB) material. Standard silicon (Si) semiconductor devices break down as temperature climbs because
  • MICRO:Industry News: Lead Story (March 2001)
    immediately received about a half dozen phone calls from people asking, 'What the heck is a compound semiconductor?' " Davis's experience is an extreme example of an industry adjusting to the introduction of new materials, new device structures, and new processes. Mike Zimmerman, a member of SSA's board

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