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  • Comprehensive Methodology to Characterize and Mitigate BGA Pad Cratering in Printed Circuit Boards
    tin-lead solder joints, and some lead-free compatible PCB dielectric materials are more brittle than conventional tin-lead compatible PCB materials. These two factors, coupled with the higher peak reflow temperatures for lead-free assembly, could transfer more strain to the PCB dielectric structure
  • Application Note - Effect of Solder Reflow on Secure(R) Adhesive
    expansion between the different substrates cause stress within the adhesive layer. The ability of Secure TM 1500FG to deal with this stress is determined as the difference in before and after values of adhesion strength, thermal impedance, and dielectric breakdown strength. It is shown that Secure TM
  • RF Characterisation of No-clean Solder Flux Residues
    , the corresponding change in effective dielectric constant of microstrip boards is measured, and can be used to predict residue effects on RF circuit performance. Residues deposited from five no-clean solder pastes are tested and compared, using microstrip resonator structures designed. for operation over
  • Peter Cochrane
    was working against us - printed circuit dielectric properties, device physics and topology. In one of those rare flashes of inspiration, a solution emerged. Instead of using laminated or ceramic substrates, why not use glass with optical
  • Internal Antennas
    internally on the printed circuit board within the radio transmitter, receiver or transceiver product. Internal antennas are also known as embedded antennas, integral antennas, chip dielectric antennas or chip multiplayer antennas.
  • Microstrip Antennas
    . Microstrips built using special dielectric materials, smaller than natural antennas, can be used to fit small packages. Microstrip antennas are also known as "band-aid", stripline, wrap-around, microstrip arrays, and patches or patch arrays.
  • PCB Coatings
    PCB coatings are designed to deposit coatings such as printed circuit board (PCB, PWB), flexible circuits, silicon wafers, semiconductors or IC chips, IC packages, and reel-to-reel connectors or lead frames. For example, the equipment may apply a dielectric conformal coating to insulate and protect
  • FlexiCap TM - Reducing Mechanical Cracking on PCBs
    range of Multilayer Capacitors to permit greater degrees of board bending without damage to capacitors. The multilayer ceramic chip capacitor is the capacitor of choice for surface mount applications. There are generally three dielectric categories available; C0G [NP0], X7R and Y5V. Sizes usually range
  • Critical Coating Machines
    apply a dielectric conformal coating to insulate and protect the PCB or flexible circuit. Other PCB coating equipment can selectively apply conductive metal pastes or solders to form circuitry or aid in forming soldered connections. Thick film and thin film circuits are also formed using coating
  • PWB Solutions for High Speed Systems
    The authors of this paper will describe a method to assist system designers of High Speed Systems in the selection of PWB design / build attributes. The attributes that will be covered are; dielectric material, circuit trace width and thickness, PWB thickness, copper surface roughness, and Plated

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