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  • Comprehensive Methodology to Characterize and Mitigate BGA Pad Cratering in Printed Circuit Boards
    tin-lead solder joints, and some lead-free compatible PCB dielectric materials are more brittle than conventional tin-lead compatible PCB materials. These two factors, coupled with the higher peak reflow temperatures for lead-free assembly, could transfer more strain to the PCB dielectric structure
  • Application Note - Effect of Solder Reflow on Secure(R) Adhesive
    expansion between the different substrates cause stress within the adhesive layer. The ability of Secure TM 1500FG to deal with this stress is determined as the difference in before and after values of adhesion strength, thermal impedance, and dielectric breakdown strength. It is shown that Secure TM
  • RF Characterisation of No-clean Solder Flux Residues
    , the corresponding change in effective dielectric constant of microstrip boards is measured, and can be used to predict residue effects on RF circuit performance. Residues deposited from five no-clean solder pastes are tested and compared, using microstrip resonator structures designed. for operation over
  • Peter Cochrane
    was working against us - printed circuit dielectric properties, device physics and topology. In one of those rare flashes of inspiration, a solution emerged. Instead of using laminated or ceramic substrates, why not use glass with optical
  • FlexiCap TM - Reducing Mechanical Cracking on PCBs
    range of Multilayer Capacitors to permit greater degrees of board bending without damage to capacitors. The multilayer ceramic chip capacitor is the capacitor of choice for surface mount applications. There are generally three dielectric categories available; C0G [NP0], X7R and Y5V. Sizes usually range
  • PWB Solutions for High Speed Systems
    The authors of this paper will describe a method to assist system designers of High Speed Systems in the selection of PWB design / build attributes. The attributes that will be covered are; dielectric material, circuit trace width and thickness, PWB thickness, copper surface roughness, and Plated
  • AN0005 Mechanical Cracking
    dielectric breakdown leading to capacitor failure in service. Mechanical cracks are created by excessive mechanical stress after the capacitors have been soldered onto the substrate. Excessive mechanical stress can be the result of the following: *?Exceptional Circumstances _ Interference fit
  • AN0022 Open Mode Capacitors
    assembly test. Over time, moisture penetration into the crack can cause a reduction in insulation resistance and eventual dielectric breakdown leading to capacitor failure in service.
  • | Electronics Industry News for EEs & Engineering Managers
    semiconductor industry in April, according to the Semiconductor Industry Association (SIA) Friday (May 30). Intel, Sony, TSMC, Toshiba to show low-k roadmaps Frustrated with the integration issues of low-k dielectric materials, chip makers next week will present several novel approaches
  • Medical Device Link .
    a current path is created between the electrode and the workpiece through a water or oil dielectric fluid. Unlike other machining methods, the EDM tool itself --the electrode --does not contact the piece being machined. Because a series of small, high-energy, controlled sparks are doing the actual work

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