Products & Services
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Description: 3M™ Thermally Conductive Epoxy Adhesive TC-2707 is an aluminum metal filled, two-part, thermally conductive epoxy adhesive.
- Compound Type: Thermally Conductive
- Cure Type / Technology: Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Chemical / Polymer System Type: Epoxy (EP)
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Supplier: Saint-Gobain Plastic Films and Tapes
Description: electrical properties, dielectric strength and dielectric constant in continuous operating temperatures from -100°F to 350°F (-73°C to 177°C). Applications include transformer and capacitor wrapping, printed circuit board fabrication, splicing tapes, composite bonding protection
- Material Form: Polymer (Plastic / Elastomer), Tape
- Features: Electrical Power / HV
- Type: Single-Sided
- Backing: Plastic / Polymer, PET / Polyester
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Supplier: Ellsworth Adhesives
Description: Resinlab™ EP750HV is a two part unfilled epoxy structural adhesive.
- Industry: OEM / Industrial
- Cure Type / Technology: Two Component System, Room Temperature Curing
- Chemical / Polymer System Type: Epoxy (EP)
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Supplier: Ellsworth Adhesives
Description: Sold as a pack (100/pk). FUSION 508 is an extremely high viscosity, medium fixturing, single component, industrial quality instant adhesive. 20 gram tube.
- Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic
- Industry: Other
- Chemical / Polymer System Type: Cyanoacrylate
- Cure Type / Technology: Air Setting / Film Drying, Single Component System
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Supplier: Saint-Gobain Oil & Gas
Description: electrical properties, dielectric strength and dielectric constant in continuous operating temperatures from -100°F to 350°F (-73°C to 177°C). Applications include transformer and capacitor wrapping, printed circuit board fabrication, splicing tapes, composite bonding protection
- Material Form: Polymer (Plastic / Elastomer), Tape
- Features: Electrical Power / HV
- Type: Single-Sided
- Backing: Plastic / Polymer, PET / Polyester
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Supplier: Protavic America, Inc.
Description: Clear unfilled epoxy also available in a one-part system. Use life is over three days after mixing at room temperature. Excellent for ferrite and optical bonding applications. Requires heat assist to cure.
- Material Form: Adhesive, Coating, Dielectric Coating (Encapsulant, Conformal, etc.), Polymer (Plastic / Elastomer)
- Features: Electronics / Semiconductors, Electrical Power / HV
- Coating Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Specialty / Other
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Supplier: SuperLogics, Inc.
Description: 4 ox. 2300°F adhesive and sealant putty dispenser
- Substrate / Material Compatibility: Ceramic / Glass, Metal
- Industry: OEM / Industrial
- Chemical / Polymer System Type: Specialty / Other
- Cure Type / Technology: Air Setting / Film Drying
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Supplier: Quist Electronics
Description: Withstands high voltages, high dielectric strength, very durable
- Form: Film / Sheet
- Chemical / Polymer System Type: Specialty / Other
- Cure Type / Technology: Contact / Pressure Sensitive (PSA)
- Industry: Semiconductors / IC Packaging, Electronics
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Supplier: Sauereisen, Inc.
Description: Sauereisen Aluseal Adhesive Cement No. 2 is a ceramic cement paste offering good bond strength and thermal shock resistant properties for assembling, sealing and cementing porcelain, glass, metal and other materials. Its fine particle size and excellent flow characteristics make No. 2 a good
- Material Form: Adhesive, Grease / Gel
- Material Type: Grease / Paste, Die Bonding Adhesive / Compound
- Industry: OEM / Industrial, Other
- Features: Electrical Insulation / Dielectric, Flexible / Dampening
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Description: INSULCAST 961 FR is a low density, flame retardant epoxy casting system. INSULCAST 961 FR finds use in airborne or light weight equipment where thermal insulation or a low dielectric constant is required.
- Substrate / Material Compatibility: Plastic
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Military / Government (MIL-SPEC / GG), OEM / Industrial, Building / Construction, Other
- Chemical / Polymer System Type: Epoxy (EP)
- Filled / Reinforced: Yes
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Supplier: Hi-Tech Seals, Inc.
Description: HERNON® offers a complete line of structural acrylic adhesives. These systems are two-part, no mix, and reactive adhesives. Each acrylic adhesive has two components: the adhesive base or resin, and the Activator. Structural acrylic adhesives are termed “reactive” cure systems
- Compound Type: Thermally Conductive
- Material Form: Grease / Paste
- Cure Type / Technology: Reactive / Moisture Cured, Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Shin-Etsu Silicones of America
Description: Non-sag thixotropic paste
- Industry: Aerospace, Electronics, Other
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Air Setting / Film Drying
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Description: RTVS 46 is a pourable RTV Silicone sealing/potting compound which cures to a flexible syntactic foam. RTVS 46 finds use in applications involving air-bourne or "man-pack" equipment. RTVS 46 is suggested for use in circuitry requiring low capacitance, low dielectric constant and low dissipation.
- Compound Type: Encapsulating / Potting
- Substrate / Material Compatibility: Plastic
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, RTV / Room Temperature Curing
- Features: Filled
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Supplier: Ellsworth Adhesives
Description: STYCAST 4640 is a RTV condensation cure, silicone rubber syntactic foam. It yields a flexible, low density material having a low dielectric constant and dissipation factor. STYCAST 4640 is readily pourable and is room temperature curable. Sold as a pack (4/pk).
- Cure Type / Technology: RTV / Room Temperature Curing
- Industry: OEM / Industrial
- Industry Applications: OEM / Industrial
- Chemical / Polymer System Type: Silicone
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Supplier: DeWAL Industries, Inc.
Description: D/W 350CL is an un-pigmented PTFE coated foil that features uniform thickness throughout and combine the properties of PTFE such as chemical resistance, wide operating temperatures, low coefficient of friction and low dielectric constant with the foil. APPLICATION INFORMATION D/W 350CL
- Materials of Construction: Metal Foil / Sheet, Plastic / Polymer, Fluoropolymer, Specialty / Other
- Coating Type: Single-Sided
- Adhesive Type: Non-adhesive
- Type: Single-Sided
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Supplier: Ellsworth Adhesives
Description: CONATHANE EN-11 is Part B of a two component, highly flexible, liquid polyurethane system. Has superior hydrolytic stability, excellent flexibility, low dielectric constant, low viscosity, and exceptionally high dielectric strength. Gallon. Required Base
- Applications: Electronics / Semiconductors, Other
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Supplier: Epoxy Technology
Description: A single component, thixotropic, electrically and thermally insulating epoxy adhesive designed for bonding SMDs to the PCB. It can be used for electronic assembly in many devices including consumer electronics, cell phone, telecommunications, medical, automotive, and scientific/OEM. It is a blue
- Material Form: Grease / Gel, Polymer (Plastic / Elastomer)
- Features: Electronics / Semiconductors
- Substrate / Material Compatibility: Metal, Plastic
- Industry: Electronics
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Supplier: Master Bond, Inc.
Description: Master Bond MB318 is a one component bonding adhesive. This 2400 cps black advanced formula is designed to polymerize at a slower pace by absorbing surface moisture. The product's performance has been tested with a variety of materials, and is recommended for a multitude of applications. The slow
- Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic, Rubber / Elastomer
- Chemical / Polymer System Type: Cyanoacrylate
- Cure Type / Technology: Reactive / Moisture Cured, Single Component System
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Supplier: Wacker Chemical Corp.
Description: SEMICOSIL® 971 TC is a non-slump, thermally curable, addition-curing, one part silicone adhesive with excellent thermal conductivity. Special characteristics Ready-to-use, one-part system High thermal conductivity Thixotropic Rapid heat cure Primerless adhesion to many substrates
- Material Form: Polymer (Plastic / Elastomer)
- Features: Electronics / Semiconductors
- Compound Type: Thermal Compound / Heat Conductive
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
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Supplier: Master Bond, Inc.
Description: a high bonding strength of more than 3000 psi at room temperature which unlike that of many other epoxy adhesives, is relatively insensitive to mixing ratio or substrate cleaning procedures. Master Bond Polymer Adhesive EP21LF can be applied readily after simple mixing of the two components on many
- Material Form: Adhesive, Polymer (Plastic / Elastomer)
- Features: Electronics / Semiconductors, Electrical Power / HV
- Substrate / Material Compatibility: Composites, Plastic, Porous Surfaces
- Dissimilar Substrates: Yes
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Supplier: Epoxy Technology
Description: A single component, thermally conductive and electrically insulating epoxy-adhesive. It was designed for high temperature hybrid micro-electronic packaging. It may be used for die attach, heat sinking, or ceramic substrate attach. Its low modulus allows for low-stress adhesive applications.
- Material Form: Composite, Grease / Gel, Polymer (Plastic / Elastomer)
- Features: Electronics / Semiconductors
- Material Type: Grease / Paste
- Industry: Electronics
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Supplier: Hi-Tech Seals, Inc.
Description: Classic cyanoacrylates are represented by the ethyl and methyl chemistries. Generally, the methyls offer better bond strengths on metals, the ethyls providing better strengths on everything else. Substrate selection and bond line configuration directly influence adhesive performance.
- Use: Gap Filling Compound
- Form: Liquid
- Chemical / Polymer System Type: Cyanoacrylate
- Cure Type / Technology: Room Temp. Cure / Vulcanizing
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Supplier: Applied Industrial Technologies
Description: No Description Provided
- Substrate / Material Compatibility: Metal, Plastic, Rubber / Elastomer
- Industry: OEM / Industrial
- Cure Type / Technology: Reactive / Moisture Cured, Single Component System
- Chemical / Polymer System Type: Cyanoacrylate
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Supplier: Henkel Corporation - Electronics
Description: Designed for high speed printing and dispensing
- Filled / Reinforced: Yes
- Features: Thermal Insulation / Heat Insulating
- Industry: Electronics
- Use: Die Bonding Adhesive / Compound
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Supplier: Allied Electronics, Inc.
Description: Ratio: 1 to 1. Temperature Range: –40° to 300°F. Electrical Properties. Volume Resistivity: 8.3 × 10(14) ohm-cm. Dielectric Constant: 3.5 (104 CPS at 77°F). Dissipation Factor: 0.014 (104 CPS at 77°F). Potting epoxy resin is a adhesive product, mixture of chemical
- Chemical / Polymer System Type: Epoxy (EP)
- Features: Encapsulating / Potting
- Form / Function: Die Bonding Adhesive / Compound, Encapsulant / Potting Compound
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Supplier: Glotrax Polymers Inc.
Description: Envirogel™ 7 is an excellent sealant for use in many industrial, mechanical and electronic applications. Its shock dampening characteristics, as well as its dielectric and self healing properties make it perfect for use in hostile surroundings. It forms an environmental shield around anything
- Material Form: Coating, Dielectric Coating (Encapsulant, Conformal, etc.), Gap Filling Sealant / Gasket, Polymer (Plastic / Elastomer), Potting Compound
- Features: Electronics / Semiconductors
- Use: Conformal Coating, Encapsulant / Potting Compound, Gap Filling Compound
- Form: Gel
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Supplier: Andover Corporation
Description: Fuller Epolite FH-5313 is a 100% solid, room temperature curing, electrical grade, epoxy adhesive that has proven to be an excellent bonding agent for ferrite pot cures. This system is designed for continuous operation at temperatures up to 200°F and is available in premeasured kits. USES
- Use: Encapsulant / Potting Compound
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Room Temp. Cure / Vulcanizing
- Industry: Optoelectronics / Photonics
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Supplier: Hapco, Inc.
Description: . This unique polymer adhesive lends itself to outdoor applications year round; patching tanks, repairing valves and shafts, repairing cement or brick, caulking, sealing, and all types of adhesive applications. The decreased cure time also makes HAPWELD™ 39 ideally suited for faster, in line
- Substrate / Material Compatibility: Metal, Plastic, Textiles / Fabrics
- Cure Type / Technology: Two Component System
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Polysulphide Adhesives and Sealants - Silver Filled, Electrically Conductive Adhesive Film -- FL901SSupplier: Master Bond, Inc.
Description: Master Bond FL901S Polymer System is a high performance silver filled unsupported epoxy resin based adhesive film which offers outstanding performance characteristics and does not require refrigerated storage although refrigeration is recommended to maximize the shelf life. This specially developed
- Material Form: Adhesive, Polymer (Plastic / Elastomer)
- Features: Electronics / Semiconductors, Electrical Power / HV
- Substrate / Material Compatibility: Composites, Plastic, Porous Surfaces
- Dissimilar Substrates: Yes
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Electrical Insulation and Dielectric Materials - Dymax UV Curing Adhesive -- 9-20557 30ML MR SYRINGESupplier: Ellsworth Adhesives
Description: Dymax Multi-Cure 9-20557 foams a tough clear circuit encapsulant upon exposure to long-wave UV light or visible light. Coating resists yellowing, vibration, impact and thermal shock. Sold as a pack (10/pk). NOTICE As of August 1, 2010 Dymax will be transitioning from the EFD Ultra syringe barrel
- Material Form: Coating, Dielectric Coating (Encapsulant, Conformal, etc.), Polymer (Plastic / Elastomer)
- Features: Electronics / Semiconductors
- Coating Type: Electrical Insulation / Dielectric
- Cure Type / Technology: UV / Radiation Cured (also EB, Light), Single Component System
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Supplier: Applied Industrial Technologies
Description: 1 lb kit, use to make repairs that can be precision machined
- Substrate / Material Compatibility: Concrete / Masonry, Metal, Plastic, Porous Surfaces
- Industry: OEM / Industrial, Building / Construction, Tooling / Mold Material
- Chemical / Polymer System Type: Epoxy (EP)
- Filled / Reinforced: Yes
Find Suppliers by Category Top
Featured Products for Dielectric Constant Adhesive Top
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Master Bond, Inc.
Toughened Structural Adhesive
high performance bonds boasting a shear strength over 2,500 psi, a tensile shear strength greater than 7,500 psi and a T-peel strength exceeding 15 pli. With a volume resistivity of 1014 ohm-cm, a dielectric strength over 400 volts/mil, and a dielectric constant of 3.8 at 75°F, Supreme 33 is an outstanding electrical insulator that is widely used in the electronic, electrical, aerospace and OEM industries. Supreme 33 is also available in a non-drip version called Supreme 33ND. (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
Master Bond, Inc.
New Epoxy Serviceable At Cryogenic Temperatures
a tensile strength of 6,500 psi and a tensile modulus of >375,000 psi. When cured, EP29LPSP is a superior electrical insulator. Its volume resistivity is >1015 ohm-cm and its dielectric constant is 3.6. It has a Shore D hardness of 80. Master Bond EP29LPSP is optically clear. It is available for use in pint, quart, gallon and 5 gallon kits. It is also available in syringe applicators. (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
ITW Polymer Technologies - Insulcast Division
Highly Thermally Conductive RTVS 3-95-2 Compound
. HARDNESS, DUROMETER (Shore A): 85 ASTM D 2240. TENSILE STRENGTH, psi: 400 ASTM D 412. TENSILE ELONGATION, %: 17 ASTM D 412. TEAR STRENGTH, Die B lb/in : 5 ASTM D 624. COEFFICIENT OF THERMAL EXPANSION, °C: 15.0 x 10-5. THERMAL CONDUCTIVITY, W/m °K: 1.44 ASTM D5470. CAL-CM/(CM2)(SEC)(oC): 0.005. SERVICE TEMPERATURE, °C: -55 to 260. Electrical Properties. DIELECTRIC STRENGTH, volts/mil: 425 ASTM D 149. DIELECTRIC CONSTANT, 1 KHz: 5.0 ASTM D 150. DISSIPATION FACTOR, 1 KHz: 0.005 ASTM D... (read more)
Browse Silicone Adhesives and Sealants Datasheets for ITW Polymer Technologies - Insulcast Division -
Master Bond, Inc.
UV Curable Epoxy Is NASA Low Outgassing Approved
to cool to room temperature. Particularly noteworthy is its superior electrical insulation properties. It has a volume resistivity that exceeds 1014 ohm cm and a dielectric constant of 3.6 at 60Hz. UV10TKLO-2 has a service temperature range of -60°F to 300°F. It is available for use in half pint, pint, quart and gallon containers. Shelf life in original unopened containers is 6 months at 75°F. (read more)
Browse Specialty Adhesives, Sealants, and Compounds Datasheets for Master Bond, Inc.
Conduct Research Top
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FLEXcon's Performance Products for Vibration Damping (.pdf)
, and security requirements. · are designed to form a bond in sub-zero cold, or to maintain adhesion. at temperatures in excess of 500ºF (260ºC). · bond to low surface energy substrates. · resist "out gassing". · respond to low frequency AC. · greatly resist dielectric breakdown. · act as a thermal
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Layout and Physical Design Guidelines for Capacitive Sensing
of material given identical testing condi- ? ? A o r C = tions. This is because the dielectric constant of window d glass is higher than the dielectric of acrylics. Numerous specifications for a particular acrylic or type of glass Another related concern is the proximity of a button to exist
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Comparing the Performance Characteristics of DuraSurf UHMW-PE to Other Materials
". PROPERTIES!. !. TEST!. !. METRIC (US). Volume Resistivity. D357. Ohms/cm. 5.9544x107. 1.4516x107. >2.000x1013. Dielectric Strength. D150. KV/cm (V/mil). *. *. 142. Dielectric Constant. D150. 2.481. 2.454. 2.542. Surface Resistivity. 1% Carbon Black. D257. Ohms. 103. 103. 103. Static Decay. 1%
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Polyetherimide
is 47%, one of the highest among the engineering thermoplastics. Smoke evolution, as measured in the NBS chamber test (ASTM E662), is low. Dielectric constant of PEI remains virtually unchanged between frequencies of 60 10° Hz and temperatures
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PTFE And Hybrid Multilayer Bonding And Fabrication
, to decrease overall printed circuit board (PCB) size. Third to provide additional thermal paths and increase the rigidity of the final assembly. There are basically two types of PTFE multilayers. One is an all PTFE substrate multilayer board (MLB) which is typically bonded with a low dielectric constant
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Balancing the Electrical and Mechanical Requirements of Flexible Circuits (.pdf)
or delamination. 4. Dimensional stability - The circuit must be dimensionally stable enough to support required surface. mount components. 5. Dielectric properties - Materials used for insulation must withstand very high voltages with minimal. thickness. Typical dielectric strength of materials used in flex
Engineering Web Search: Dielectric Constant Adhesive Top
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ASTM D1000 - 10 Standard Test Methods for Pressure Sensitive...
ASTM D1000 - 10 Standard Test Methods for Pressure-Sensitive Adhesive-Coated Tapes Used for Electrical and Electronic Applications
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ASTM D2305 - 10 Standard Test Methods for Polymeric Films Used...
D149 Test Method for Dielectric Breakdown Voltage and Dielectric Strength of Solid Electrical Insulating Materials at Commercial Power Frequencies
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DuPontTM Pyralux? LF Sheet Adhesive flexible composites...
Dielectric Constant, max. (at 1 MHz) 4.0 3.6?4.0 Table 1 Dissipation Factor, max. (at 1 MHz) 0.05 0.02?0.03 Bond Ply Product Codes Dielectric
- General Information Vishay BCcomponents Ceramic Disc, RFI and...
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Micro Guide Vishay Sprague Guide for MicroTan? Capacitors...
shows the appropriate choice for today's surface mount assembly dielectric constant ranges of the various materials used in technology.
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Van der Waals force - Wikipedia, the free encyclopedia
The London-van der Waals forces are related to the Casimir effect for dielectric media, the former being the microscopic description of the latter
- Friction - Wikipedia, the free encyclopedia
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MEMS and 3D Integration
Dielectric Constant High Frequency Thermal & Mechanical Properties
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3M??? Scotch-Weld??? Epoxy Adhesive Electrical Properties 2216 Gray 2216 Translucent Arc Resistance 130 seconds Dielectric Strength 408 volts/mil 630
