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  • Dielectric Materials for Use in Radomes
    Polyurethane Foam: Dielectric Materials for Use in Radomes and Other Applications. Many polyurethane foams offer a wide variety of physical properties, as well as desirable dielectric properties for applications requiring minimal dielectric constant and loss tangent. In many such applications
  • Medical Device Link .
    introductions are profiled in the accompanying descriptions. Process Overcomes Traditional LCP Production Hurdles Flexible circuits based on liquid-crystal polymer (LCP) dielectric film feature properties superior to more commonly used polyimide-based
  • New Flame-Retardant Structural Adhesive
    (14 CFR 25.853/25.885), and the solvent-free formulation has very low VOC emissions. Once cured, 10 Minute Epoxy FR provides typical peel strength of 25 pli, impact resistance of 10 ft-lbs/in , dielectric strength of 800 volts/mil, and adhesive tensile lap shear strength of up to 2900 psi
  • Product Technology News
    ceiling module, or as an air supply module for a minienvironment. The lightweight hood incorporates an acoustically decoupled fan with stepless variable solid-state speed control. The low-profile filter is sealed with a dielectric gel. The Prometrix UV-1280SE thin-film measurement system combines
  • MICRO: The Hot Button
    as the necessity of porosity in lower-k-value films, the challenges of etching new materials, the extension of PVD and eventual transition to ALD, and some intriguing research on planarizing and cleaning fragile low-k structures. FARHAD MOGHADAM (vice president, dielectric systems and modules, Applied
  • MICRO: Products
    , nondestructive Pulse technology, providing metrology for all stages of copper integration, including yield-critical dense narrow-line-array structures in low-k and ultra-low-k interlayer dielectric materials. The system operates on the Vanguard-II platform, which offers high throughput
  • MICRO: The Hot Button
    ? Will future CMP tools minimize dishing and erosion adequately without damaging or degrading the mechanical strength and properties of porous low-k and ultra-low-k dielectric materials? Is electro-chemical-mechanical polishing (ECMP) a legitimate mainstream contender, and if so, when
  • MICRO: Hot Button
    , and hit their cleanliness specs? What combination of wet and dry photoresist strips will work best to maintain dose levels and leave ever-thinner feature structures intact? How difficult will high-k dielectric materials be to clean and prepare? Can megasonics be improved and extended

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