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  • Radomes
    Radomes, also known as RADAR domes, are protective dielectric coatings or a dielectric shells that encloses an antenna or array. The principal purpose of a radome is to shield the antenna and associated equipment from the environment. Panel or sector antennas are usually enclosed within a radome
  • Medical Device Link .
    introductions are profiled in the accompanying descriptions. Process Overcomes Traditional LCP Production Hurdles Flexible circuits based on liquid-crystal polymer (LCP) dielectric film feature properties superior to more commonly used polyimide-based
  • New Flame-Retardant Structural Adhesive
    (14 CFR 25.853/25.885), and the solvent-free formulation has very low VOC emissions. Once cured, 10 Minute Epoxy FR provides typical peel strength of 25 pli, impact resistance of 10 ft-lbs/in , dielectric strength of 800 volts/mil, and adhesive tensile lap shear strength of up to 2900 psi
  • Product Technology News
    ceiling module, or as an air supply module for a minienvironment. The lightweight hood incorporates an acoustically decoupled fan with stepless variable solid-state speed control. The low-profile filter is sealed with a dielectric gel. The Prometrix UV-1280SE thin-film measurement system combines
  • MICRO: The Hot Button
    as the necessity of porosity in lower-k-value films, the challenges of etching new materials, the extension of PVD and eventual transition to ALD, and some intriguing research on planarizing and cleaning fragile low-k structures. FARHAD MOGHADAM (vice president, dielectric systems and modules, Applied
  • MICRO: Products
    , nondestructive Pulse technology, providing metrology for all stages of copper integration, including yield-critical dense narrow-line-array structures in low-k and ultra-low-k interlayer dielectric materials. The system operates on the Vanguard-II platform, which offers high throughput
  • MICRO: The Hot Button
    ? Will future CMP tools minimize dishing and erosion adequately without damaging or degrading the mechanical strength and properties of porous low-k and ultra-low-k dielectric materials? Is electro-chemical-mechanical polishing (ECMP) a legitimate mainstream contender, and if so, when
  • MICRO: Industry News
    chipmakers and suppliers searching from the front to the back end for the right surface-preparation answers. That search presents many difficulties. The growing use of high- and low-k dielectric materials as well as the parallel emergence of new gate-stack metals in place of polysilicon in order

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