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Supplier: Epoxy Technology
Description: , or a thermal potting compound. It is a NASA approved, low outgassing epoxy.
- Material Form: Composite, Grease / Gel, Polymer (Plastic / Elastomer), Potting Compound
- Substrate / Material Compatibility: Metal, Plastic
- Chemical / Polymer System Type: Epoxy (EP)
- Filled / Reinforced: Yes
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Supplier: BJB Enterprises, Inc.
Description: TC-1606 is a very low viscosity, black epoxy-potting compound. It has a long work life, excellent bubble release properties and can be injected through a small diameter tube such as a hypodermic needle. Thermal shock resistance is another advantage of TC-1606
- Material Type / Grade: Elastomer / Rubber
- Chemical / Polymer System Type: Polyurethane
- Filler Material: Unfilled
- Industry: Aerospace, Automotive, Marine, Industrial, Building / Construction, Tooling / Molds
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Supplier: Sauereisen, Inc.
Description: Sauereisen Thermal Potting Cement No. 11 is primarily used where high electrical insulation and thermal conductivity are desired. No. 11 is a chemical-setting cement ideal for potting applications subject to high temperature and thermal shock. Thermal Potting Cement No. 11 is formulated
- Material Form: Adhesive, Potting Compound, Powder / Grain
- Features: Electronics / Semiconductors, Electrical Power / HV
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Form / Function: Die Bonding Adhesive / Compound, Encapsulant / Potting Compound
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Supplier: Allied Electronics, Inc.
Description: 3M Scotch-Weld™ Epoxy Potting Compound-Adhesives Black opaque highly filled epoxy used for potting and encapsulating electronic circuits. Use to environmentally protect or conceal circuits. This product is excellent when used with GC Chassis Boxes. Working Time (Pott Life): 1 hour. Mix Ratio
- Features: Encapsulating / Potting
- Form / Function: Die Bonding Adhesive / Compound, Encapsulant / Potting Compound
- Chemical / Polymer System Type: Epoxy (EP)
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Supplier: Farnell Europe
Description: ENCAPSULANT, EPOXY, 250G
- Form / Function: Encapsulant / Potting Compound
- Chemical / Polymer System Type: Epoxy (EP)
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Supplier: Glotrax Polymers Inc.
Description: Envirogel 5 is an excellent sealant for use in many industrial, mechanical and electronic applications. Its shock dampening characteristics, as well as its dielectric and self healing properties make it perfect for use in hostile surroundings. It forms an environmental shield around anything
- Material Form: Coating, Dielectric Coating (Encapsulant, Conformal, etc.), Gap Filling Sealant / Gasket, Polymer (Plastic / Elastomer), Potting Compound
- Features: Electronics / Semiconductors
- Use: Conformal Coating, Encapsulant / Potting Compound, Gap Filling Compound
- Form: Gel
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Supplier: Novagard Solutions
Description: Non-corrosive, single component silicone coating & encapsulating compound
- Material Form: Coating, Dielectric Coating (Encapsulant, Conformal, etc.), Polymer (Plastic / Elastomer), Potting Compound
- Use: Conformal Coating, Encapsulant / Potting Compound
- Form: Liquid
- Chemical / Polymer System Type: Silicone
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Supplier: Device Technologies, Inc.
Description: Device Technologies, Inc. has been designing and manufacturing high performance wire protection, cable management, and other specialty fasteners for over two decades. It’s standard products include Spring-Fast ® Wire Protection Grommet Edging, Trim-Fast™ Edge Trim, Seal-Fast ™
- Use: Conformal Coating
- Form: Powder, Specialty / Other
- Chemical / Polymer System Type: Epoxy (EP), Polyamide, Polyester (PET), Specialty / Other
- Cure Type / Technology: UV / Radiation Cured (also EB, Light), Specialty / Other
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Description: INSULCAST 42 is a low viscosity unique silicone-epoxy co-polymer formulated to withstand severe thermal shock, low moisture absorption and excellent dielectric insulation. INSULCAST 42 bonds well to most metals and plastics.
- Material Form: Grease / Gel, Potting Compound
- Compound Type: Electrical Insulation / Dielectric
- Form / Function: Encapsulant / Potting Compound
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Bluestar Silicones USA Corp.
Description: Potting, encapsulant elastomer Properties Viscosity 3500 Hardness Sha 48 Description a quick curing two-component silicone elastomer which cures at room temperature, cure can be acceleration by the application of heat. BLUESIL™ ESA 7252 QC A & B is supplied as a viscous liquid which
- Material Form: Coating, Dielectric Coating (Encapsulant, Conformal, etc.), Potting Compound
- Use: Conformal Coating, Encapsulant / Potting Compound
- Form: Liquid
- Chemical / Polymer System Type: Silicone
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Supplier: Electro-Lite Corporation
Description: ELC-2500 clear is a standard potting and encapsulating material. Also used to adhere and fixture. The adhesive is clear an enables the identification of specific board populations.
- Cure Type / Technology: UV / Radiation Cured (also EB, Light)
- Industry Applications: Electronics (PCB / SMT Assembly), OEM / Industrial
- Chemical / Polymer System Type: Epoxy (EP)
- Substrate / Material Compatibility: Ceramic / Glass, Composites, Metal, Plastic, Rubber / Elastomer
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Supplier: Hapco, Inc.
Description: Heat cure epoxy powder that is lightweght and passes 94 V-0 testing.
- Material Form: Potting Compound
- Features: Electronics / Semiconductors
- Compound Type: Electrical Insulation / Dielectric
- Form / Function: Encapsulant / Potting Compound
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Supplier: Quist Electronics
Description: Bonded laminate, copper shield between layers or Sil-Pad
- Type / Form: Adhesive, Thermal Compound / Interface
- Electrical Insulating / Dielectric: Yes
- Material Type: Elastomer / Rubber
- Form: Specialty / Other
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Supplier: Henkel Corporation - Electronics
Description: Self-leveling, one-step cure, meets JEDEC requirements
- Material Form: Coating, Composite, Dielectric Coating (Encapsulant, Conformal, etc.), Polymer (Plastic / Elastomer), Potting Compound
- Features: Electronics / Semiconductors
- Coating Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
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Supplier: Wacker Chemical Corp.
Description: SEMICOSIL® 925 is a high purity, one-component addition curing RTV-2 silicone gel. Special features Low ion content Low volatile content Low viscosity Good mechanical damping properties Application SEMICOSIL® 925 is a dielectric gel especially designed to seal, protect and preserve
- Material Form: Polymer (Plastic / Elastomer), Potting Compound
- Use: Encapsulant / Potting Compound
- Form: Liquid
- Chemical / Polymer System Type: Silicone
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Supplier: Andover Corporation
Description: • Ideal for bonding a variety of substrates such as metal, glass and plastic. • Potting and encapsulation • Excellent chemical resistance, mechanical strengths and electrical properties. • Meets General Electric (GE) Specification number M-2820-CR
- Form / Function: Encapsulant / Potting Compound
- Electrical / Electronics Applications: Optoelectronics / Photonics
- Industry Applications: Optical Grade / Material
- Chemical / Polymer System Type: Epoxy (EP)
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Supplier: Protavic America, Inc.
Description: A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals.
- Material Form: Coating, Dielectric Coating (Encapsulant, Conformal, etc.), Polymer (Plastic / Elastomer), Potting Compound
- Material Type: Conformal / Encapsulating Coating
- Industry: Electronics, Electrical Power / HV, Semiconductors / IC Packaging, OEM / Industrial
- Features: Electrical Insulation / Dielectric
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Supplier: Master Bond, Inc.
Description: Master Bond Master Sil 803 is a ready-to-use, one component high performance silicone elastomer compound for bonding, sealing, protective coatings and formed-in-place gaskets. This material is a clear noncorrosive flowable compound which can be easily handled and processes readily. It cures
- Material Form: Coating, Dielectric Coating (Encapsulant, Conformal, etc.), Grease / Gel, Polymer (Plastic / Elastomer), Potting Compound
- Chemical / Polymer System Type: Silicone
- Features: Electrical Insulation / Dielectric Material, Encapsulanting / Potting, Flexible / Dampening, Non-corrosive Cure
- Industry: Electronics
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Supplier: Hapco, Inc.
Description: Low cost, easy to use, potting compounds with fast cycle times. Available in 3 speeds.
- Material Type / Grade: Thermoset
- Filler Material: Unfilled
- Industry: Electronics
- Compound Type: Liquid
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Supplier: Allied Electronics, Inc.
Description: Chemical Zinc Oxide⁄Non Hazardous, Non Silicone Heat Transfer Compound Lubricant Type Ideal for aggressive chemical environments. Urethane conformal coating is a durable finish product that provides a protective coating for printed circuit boards against moisture, corrosion and thermal shock
- Form / Function: Conformal / Encapsulating Coating
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Supplier: R. S. Hughes Company, Inc.
Description: RTV6428 - Dark Gray (10 g). RTV6428 silicone rubber compound is a very fast curing, two-component, low viscosity, RTV silicone material formulated for encapsulation and potting applications. It is well suited for providing protection of electronic components and assemblies against thermal shock
- Form / Function: Encapsulant / Potting Compound
- Cure Type / Technology: Two Component System
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Description: INSULCAST 116 FR-FC is a one to one ratio (weight or volume) epoxy potting and casting compound designed for production use. The convenient mixing ratio makes it ideal for production line mixing as well as automatic dispensing. The INSULCAST 116 FR-FC is among the safest epoxy compounds available
- Material Form: Coating, Dielectric Coating (Encapsulant, Conformal, etc.), Polymer (Plastic / Elastomer), Potting Compound
- Features: Electronics / Semiconductors, UL Approved
- Use: Conformal Coating, Encapsulant / Potting Compound
- Form: Gel
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Description: INSULCAST 116 FR-FC is a one to one ratio (weight or volume) epoxy potting and casting compound designed for production use. The convenient mixing ratio makes it ideal for production line mixing as well as automatic dispensing. The INSULCAST 116 FR-FC is among the safest epoxy compounds available
- Form / Function: Die Bonding Adhesive / Compound, Encapsulant / Potting Compound
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors)
- Industry Applications: Aerospace, Automotive, Military / Government (MIL-SPEC / GG), OEM / Industrial, Other
- Chemical / Polymer System Type: Epoxy (EP)
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Supplier: OMEGA Engineering, Inc.
Description: OMEGATHERM thermal conducting paste is a high temperature and high thermally conductive paste product. They are specially formulated for permanent and temporary bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics,
- Material Form: Grease / Gel, Polymer (Plastic / Elastomer), Potting Compound
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Form / Function: Encapsulant / Potting Compound
- Chemical / Polymer System Type: Silicone
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Description: INSULCAST 116 FR-FC-FS is a one to one ratio (weight or volume) epoxy potting and casting compound designed for production use. The convenient mixing ratio makes it ideal for production line mixing as well as automatic dispensing. The INSULCAST 116 FR-FC-FS is among the safest epoxy compounds
- Material Type / Grade: Elastomer / Rubber, Thermoset
- Chemical / Polymer System Type: Epoxy
- Compound Type: Liquid
- Features: Thermally Conductive
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Supplier: Hapco, Inc.
Description: Low cost, easy to use, potting compounds with fast cycle times. Available in 3 speeds.
- Material Form: Potting Compound
- Use: Encapsulant / Potting Compound
- Form: Liquid
- Cure Type / Technology: Thermosetting / Crosslinking
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Description: RRTVS 42 CURTIS II is a low viscosity unique silicone-epoxy co-polymer formulated to withstand severe thermal shock, low moisture absorption and excellent dielectric insulation. RTVS 42 CURTIS II contains silane adhesion promoters that enable it to bond well to most metals and plastics. Its unique
- Material Type / Grade: Elastomer / Rubber, Thermoset
- Chemical / Polymer System Type: Epoxy, Silicone
- Features: Flame Retardant (e.g. UL 94 Rated), Thermally Conductive
- Industry: Aerospace, Automotive, Electronics, Military / Government (MIL-SPEC), Industrial, Building / Construction, Other
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Supplier: Hapco, Inc.
Description: Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame
- Material Form: Potting Compound
- Features: Electronics / Semiconductors, UL Approved
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Form / Function: Encapsulant / Potting Compound
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Description: RTVS 27 LV is a low viscosity, general purpose, reversion resistant RTV Silicone Compound. RTVS 27 LV finds use in commercial potting/casting application. RTVS 27 LV's one-to-one ratio by weight or volume makes it ideal for dispensing equipment or unskilled labor. With the ability to cure rapidly
- Material Form: Coating, Dielectric Coating (Encapsulant, Conformal, etc.), Polymer (Plastic / Elastomer), Potting Compound, Varnish / Impregnating Resin
- Use: Conformal Coating, Encapsulant / Potting Compound, Impregnating Resin
- Form: Gel
- Chemical / Polymer System Type: Silicone
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP30M3LVR is a low viscosity, two component epoxy compound for high performance, chemical resistant casting and potting applications, formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a convenient two (2) to one (1) mix ratio
- Material Type / Grade: Thermoset
- Chemical / Polymer System Type: Epoxy
- Industry: Aerospace, Automotive, Electronics, Electric Power, Semiconductor / IC's, Composite Structures, Marine, Industrial, Building / Construction, Tooling / Molds, Other
- Resins & Compounds: Liquid
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Supplier: Allied Electronics, Inc.
Description: Potting⁄Encapsulating Compound, 1.00 Specific Gravity, 20.0% Elongation Offering higher performance qualities over conventional RTV silicones. MG Chemicals sealants will bond to many clean surfaces without the aid of primers. Many of these one-part RTV silicone adhesive sealants are suitable
- Compound Type: Encapsulating / Potting
- Form / Function: Encapsulant / Potting Compound
- Chemical / Polymer System Type: Silicone
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Supplier: Bluestar Silicones USA Corp.
Description: 20 durometer, designed for use in special effects applications, skin contact grade Properties Viscosity 50000 Hardness Sha 25 Description Bluesil V-1022 is a medium hardness, self-bonding, room temperature curing silicone rubber compound. It is designed as a potting and encapsulating material
- Compound Type: Molding Resin
- Material Form: Liquid
- Chemical / Polymer System Type: Silicone
- Filler Material: Unfilled
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Supplier: Ellsworth Adhesives
Description: Two-parts, clear dielectric gel with a room temperature or heat cure. Available Applicators and Mix Nozzle. Documentation: Dow Corning MSDS/TDS
- Form / Function: Encapsulant / Potting Compound
- Chemical / Polymer System Type: Silicone, Specialty / Other
- Cure Type / Technology: Specialty / Other
- Compound Type: Encapsulating / Potting
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Featured Products for Dielectric Potting Compound Top
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Sauereisen, Inc.
Electrotemp Cement No. 8
Sauereisen No. 8 is a zircon-filled, phosphate-bonded potting material for demanding applications such as igniters, resistors, heating elements, thermocouples and lamps. (read more)
Browse Encapsulants and Potting Compounds Datasheets for Sauereisen, Inc. -
Hapco, Inc.
Di-Pak Potting & Encapsulating Materials
Electrical Insulating Compounds for Potting, Encapsulating, and Coatings. 1. Di-Pak - Elastomeric - High quality, impact resistant materials for potting, encapsulating, insulation, and components. 2. Di-Pak - Rigid - Production grade dielectric materials for potting, encapsulating, insulation, coatings, and components. Full Brochure (read more)
Browse Electrical and Electronic Resins Datasheets for Hapco, Inc.
Conduct Research Top
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AN0016 Micro-sectioning of Multilayer Ceramic Capacitors
Components are normally applied to a double sided sticky tape, in the orientation appropriate for examination. Components should be separated from one another by a reasonable gap to allow potting compound to surround each component. If components are too close, they can be poorly supported by resin
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AN0001 Polymer Termination
to Syfer for failure investigation: Yellow potting compound. Black areas are damaged. sections within the. Electrodes. capacitor caused during. the electrical failure. Standard termination. material (not FlexiCapTM). White lines are thermal. cracks created during the. Mechanical crack (caused. electrical
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AN0005 Mechanical Cracking
. Mechanical Crack. Example of capacitors issued by customers to Syfer for failure investigation: Yellow potting compound. Black areas are damaged. sections within the. Electrodes. capacitor caused during. the electrical failure. Standard termination. material (not polymer). White lines are thermal. cracks
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AN0008 Restricted Substances and Lead-free Soldering
of 13. Substances Issue 1. Example of capacitor issued by customers to Syfer for failure investigation: Yellow potting compound. Black areas are damaged. sections within the. Electrodes. capacitor caused during. the electrical failure. Standard termination. material (not polymer). White lines
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Design Practices for Low-Power External Oscillators (.pdf)
it is. negative resistance testing. Negative resistance testing. usually a recommendation for a specific solvent. can also be performed via the methods detailed in. The other option for harsh wet environments is to use a. application note AN943, "Practical PICmicro®. potting compound to seal
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TriggerBond - The Pre-mixed Epoxy Solution (Case Study)
to seal in the. Chartienitz, "Before TriggerBond, we would. electronic circuitry. have to purchase large quantities of epoxy. epoxy potting & encapsulating compound. We now order just what we need. The cost. This is an electronic grade epoxy engineered. However, using epoxies can pose difficulties
Engineering Web Search: Dielectric Potting Compound Top
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Encapsulating / Potting Compound Industrial Sealants...
Home > Datasheets > Industrial Sealants > Encapsulating / Potting Compound
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Potting Compound withstands temperature extremes., Master...
Potting Compound withstands temperature extremes. Potting Compound withstands temperature extremes.
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Current and reliable Adhesives & Sealants news stories
Potting and Encapsulating Compound is FDA compliant.
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Epoxy potting compound
Epoxy potting compound 11-Jun-2011 18:11 GMT Epoxy Inc.???s 20-3652 epoxy potting compound meets NASA???s low outgassing requirements.
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Potting Compounds Review - Engineers Edge
Potting compounds maybe used to provide an environmental barrier, dielectric protection and characteristics, thermal conduction path, and
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CPCL, CPCC, CPCP, CPCF Vishay Dale Wirewound/Metal Film...
EIA Standard RS-344 ? High power to size ratio ? Special inorganic potting compound and ceramic case provide high thermal conductivity in a fireproof