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  • Dielectric Materials for Use in Radomes
    to eliminate dielectric framework scattering and wall insertion loss. [5]. Fabrication of such radomes generally involves layup or prepreg methods where a resin reinforced laminate material is bound to low or medium density polyurethane foam. Choice of layup or prepreg materials can vary depending
  • MICRO: Materials Integration
    cleaning tool on porous SiLK dielectric resin films manufactured by Dow Chemical (Midland, MI). The article focuses on the relationship between different chemical process approaches and the resulting electrical characteristics of cleaned structures. The electrical test characterization results
  • MICRO: Industry News: Breakout II 2001 (April 2001)
    Chemical claims that a major research breakthrough with its SiLK resin means chipmakers can continue to extend their processes into the sub 100-nm device regime. The Michigan-based company says it is the first supplier of low-k dielectric materials to offer an organic material with a dielectric
  • Laser Direct Structuring LCP for Mobile Antenna Applications
    The rapid growth and global demand for wireless. communication and increasing need for more functionality in smart phones have created a need for advanced engineering resin to meet new antenna requirements for mobile devices. This paper discusses performance of new laser direct structuring LCP
  • Silicone Based Insulation Material for High Speed/Voltage Rotating Machines
    . However, many medium and high voltage rotating machinery applications do not utilize resin rich silicone based insulation because of concerns about dielectric integrity and voltage endurance, especially with highly thermally conductive designs. Arlon has recently developed improvements in highly
  • Silicone Based Electrical Insulation Material for High Speed/Voltage Rotating Machines
    . However, many medium and high voltage rotating machinery applications do not utilize resin rich silicone based insulation because of concerns about dielectric integrity and voltage endurance, especially with highly thermally conductive designs. Arlon has recently developed improvements in highly
  • Polyetherimide
    Polyetherimide (PEI) is an amorphous engineering thermoplastic characterized by high heat resistance, high strength and modLilus, excellent electrical properties that remain stable over a wide range of temperatures and frequencies, and excellent processibility. Unmodified PEI resin is transparent
  • Medical Device Link .
    was well developed, processing the resin into extruded or molded forms was significantly more challenging. Extruded grades of PTFE were first used in the wire and cable industry in the 1950s, where the good dielectric properties of the material proved

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