Dielectric Strength Encapsulant

Description: ENCAPSULANT, EPOXY, 250G

• Form / Function: Encapsulant / Potting Compound
• Chemical / Polymer System Type: Epoxy (EP)

Description: Thermal/mechanical shock and vibration damping, excellent dielectric properties, flexible cure schedule, reversion resistant, thick section cure, compatible with automated dispensing equipment, and physical and electrical stability over a wide temperature. 36.2 kg kit (2 pails). Documentation: Dow

• Compound Type: Encapsulating / Potting
• Industry: Electronics
• Form / Function: Encapsulant / Potting Compound
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)

Description: 9001-E-V3 Series encapsulants are performance upgrade of the flexible instant curing Dymax 9001 UV/visible light curing encapsulant, with improved moisture, thermal cycle resistance and adhesion to various component substrates.

• Material Form: Potting Compound
• Compound Type: Electrical Insulation / Dielectric
• Form / Function: Encapsulant / Potting Compound
• Industry Applications: OEM / Industrial

Description: Sauereisen Electric Insulating Cement No. 12 is an inorganic cement used for applications requiring high dielectric strength and volume resistivity through 2200oF. No. 12 offers low shrinkage and coefficient of thermal expansion making it an excellent cement for bonding or potting high-alumina

• Material Type: Die Bonding Adhesive / Compound
• Industry: Electronics, Electrical Power / HV
• Features: Electrical Insulation / Dielectric
• Composition: Unfilled

Description: Envirogel™ 5 is an excellent sealant for use in many industrial, mechanical and electronic applications. Its shock dampening characteristics, as well as its dielectric and self healing properties make it perfect for use in hostile surroundings. It forms an environmental shield around anything

• Material Form: Coating, Dielectric Coating (Encapsulant, Conformal, etc.), Gap Filling Sealant / Gasket, Polymer (Plastic / Elastomer), Potting Compound
• Features: Electronics / Semiconductors
• Substrate / Material Compatibility: Ceramic / Glass, Composites, Metal, Plastic
• Industry: Electronics, OEM / Industrial

Description: Device Technologies, Inc. has been designing and manufacturing high performance wire protection, cable management, and other specialty fasteners for over two decades. It’s standard products include Spring-Fast ® Wire Protection Grommet Edging, Trim-Fast™ Edge Trim, Seal-Fast ™

• Use: Conformal Coating
• Form: Powder, Specialty / Other
• Chemical / Polymer System Type: Epoxy (EP), Polyamide, Polyester (PET), Specialty / Other
• Cure Type / Technology: UV / Radiation Cured (also EB, Light), Specialty / Other

Description: Potting, encapsulant elastomer Properties Viscosity 3500 Hardness Sha 48 Description a quick curing two-component silicone elastomer which cures at room temperature, cure can be acceleration by the application of heat. BLUESIL™ ESA 7252 QC A & B is supplied as a viscous

• Material Form: Coating, Dielectric Coating (Encapsulant, Conformal, etc.), Potting Compound
• Features: Electronics / Semiconductors, Electrical Power / HV
• Compound Type: Encapsulating / Potting
• Cure Type / Technology: Two Component System, RTV / Room Temperature Curing

Description: CONATHANE EN-11 is Part B of a two component, highly flexible, liquid polyurethane system. Has superior hydrolytic stability, excellent flexibility, low dielectric constant, low viscosity, and exceptionally high dielectric strength. Gallon. Required Base

• Applications: Electronics / Semiconductors, Other

Description: PTS-46323™ is a two-component ONE TO ONE MIX RATIO silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible

• Compound Type: Encapsulating / Potting
• Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic
• Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
• Features: Electrical Insulation / Dielectric Material, Filled, Flame Retardant (e.g. UL 94 Rated), Flexible / Dampening, Thermal / Heat Insulating

Description: • Ideal for bonding a variety of substrates such as metal, glass and plastic. • Potting and encapsulation • Excellent chemical resistance, mechanical strengths and electrical properties. • Meets General Electric (GE) Specification number M-2820-CR

• Use: Encapsulant / Potting Compound
• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Room Temp. Cure / Vulcanizing
• Industry: Optoelectronics / Photonics

Description: PNU-46204™ is two-component polyurethane adhesive with high strength and high temperature resistance. PNU-46204™ is designed for the encapsulation circuit boards, circuit board components, and for screw-thread sealing. The cured materials provide long-term circuit protection and bond

• Substrate / Material Compatibility: Ceramic / Glass, Metal, Paper / Paperboard, Plastic
• Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging
• Chemical / Polymer System Type: Polyurethane (PU, PUR)
• Filled / Reinforced: Yes

Description: Economical, high performance insulator

• Compound Type: Leveling / Filling Compound, Thermal Compound / Heat Conductive
• Substrate / Material Compatibility: Ceramic / Glass, Composites, Metal, Plastic
• Cure Type / Technology: Thermosetting / Crosslinking, Contact / Pressure Sensitive (PSA)
• Features: Electrically Conductive, Electrical Insulation / Dielectric Material, Filled

Description: Non-corrosive, single component silicone coating & encapsulating compound

• Coating Type: Electrical Insulation / Dielectric
• Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Single Component System
• Industry Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors), OEM / Industrial
• Chemical / Polymer System Type: Silicone

Description: PNU-46202™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection and

• Substrate / Material Compatibility: Ceramic / Glass, Metal, Paper / Paperboard, Plastic
• Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
• Features: Electrical Insulation / Dielectric Material
• Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging

Description: Meets JEDEC level testing requirements, compatible with lead free testing

• Material Form: Adhesive, Coating, Composite, Dielectric Coating (Encapsulant, Conformal, etc.), Polymer (Plastic / Elastomer), Potting Compound
• Features: Electronics / Semiconductors
• Coating Type: Electrical Insulation / Dielectric
• Cure Type / Technology: Thermosetting / Crosslinking, Single Component System

Description: PTS-46303 A/B™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include

• Use: Die Bonding Adhesive / Compound, Conformal Coating, Encapsulant / Potting Compound
• Form: Gel
• Chemical / Polymer System Type: Silicone
• Cure Type / Technology: Thermosetting / Crosslinking

Description: SEMICOSIL® 925 is a high purity, one-component addition curing RTV-2 silicone gel. Special features Low ion content Low volatile content Low viscosity Good mechanical damping properties Application SEMICOSIL® 925 is a dielectric gel especially designed to seal, protect

• Material Form: Polymer (Plastic / Elastomer), Potting Compound
• Features: Electronics / Semiconductors
• Industry: Electronics
• Chemical / Polymer System Type: Silicone

Description: . OMEGABOND and OMEGATHERM products are compounded and packaged for convenient, easy mixing and application. Each formulation exhibits important characteristics necessary for accurate, fast, reliable temperature measurement. These are: good adhesion and strength, high temperature rating, high thermal

• Chemical / Polymer System Type: Silicone
• Cure Type / Technology: Air Setting / Film Drying, Single Component System
• Features: Thermal / Heat Conductive, Electrically Insulating / Dielectric, Encapsulating / Potting
• Compound Type: Encapsulating / Potting, Thermal Compound / Heat Conductive

Description: ELC-2900 is a flexible conformal coating for PCB's and provides a flexible, reworkable finish for components and various substrates.

• Use: Conformal Coating, Encapsulant / Potting Compound
• Form: Liquid
• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: UV / Radiation Cured (also EB, Light)

Description: Self-leveling, one-step cure, meets JEDEC requirements

• Use: Conformal Coating, Encapsulant / Potting Compound
• Form: Liquid
• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Thermosetting / Crosslinking