Products & Services

See also: Categories | Featured Products | Technical Articles | More Information
Page: 1 2 Next

Conduct Research Top

  • Can A New Lead Drug Be Developed? Ask Manufacturing, Early and Ofte
    important questions: Is the lead with the highest biological potency now ready to be developed? Should additional studies be conducted, and if so, which experiments should be run and by whom? But the chemical properties of new leads should also be evaluated early in the selection process. Manufacturing
  • Tech Transfer: Don't Fumble the Hand Off
    . An incomplete or incoherent commercialization path, and lack of predefined success criteria can strain relationships between tech transfer partners. For example, a great chemical process can be a non-starter when ramped up to a larger scale. Something as simple as an excipient s not being
  • Measuring Residual Stress In Transparent Plastics
    manufacturing, optical components, and others. Residual stresses are introduced by nearly all techniques used for polymer manufacturing. They form as a result of extrusion, stretching, drawing, molding, casting, joining, or other strain-inducing processes. Strains can be introduced by differential
  • Carbon Steel
    . Then, the metal is reheated and hot rolled into the finished, wrought form. Hot-rolled steel is characterized by a scaled surface and a decarburized skin. Hot-rolled bars may be subsequently finished in a two-part process. First, acid pickling or shot blasting removes scale. Then, cold drawing through a die
  • Steels for strength and machinability
    stress-corrosion cracking better than other high-strength PH alloys. Its chemical composition is: carbon 0.02% max, manganese 0.25% max, phosphorus 0.015% max, sulfur 0.01% max, silicon 0.25% max, chromium 11 to 12.5%, nickel 10.75 to 11.25%, titanium 1.5 to 1.8%, molybdenum 0.75 to 1.25%
  • MICRO:Archives of 1997 Back Issues
    deep-UV unit for Applied minifab; W-J CVD tool going to UMC; CFM scores Taiwanese order; MR head maker likes Veeco; Moto goes for Electroglas probers Applied plasma clean process KO's PFCs; USDC aligns with Elsicon; IES becomes IEST; updated EE text published IEDM, ISS 98, FID, 3C '98, and more

More Information Top

Lock Indicates content that may require registration and/or purchase. Powered by IHS Goldfire