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Find parts, products, suppliers, datasheets, and more for:
Dry Polishing Compound
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Abrasive compounds and abrasive slurries are used to improve surface finish or flatness. They often consist of fine abrasives in slurry, bar, powder or paste forms.
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Supplier: DME CompanyDescription: Quality of mold or die finish is frequently an important factor in how a mold or die operates. D-M-E Diamond Compound is proven to produce the finest quality finish with considerable savings in time and labor. D-M-E Diamond Compound contains no adulterants, nor non-graded
- Type: Polishing
- Products / Materials Finished: Specialty / Other
- Form: Liquid / Dispersion
- Abrasive Grain Type: Diamond
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Supplier: CS UNITECDescription: Made of merino felt with buttonhole fastening system for polishing work on open and closed pipe constructions and handrails. The polishing belt can be opened and closed as often as necessary. For use with grinding belt rollers and our polishing compounds and creams. Use a separate felt belt
- Applications: Dry Grinding, Bench / Backstand
- Products / Materials Abraded: Metalworking
- Features: Closed Coat
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Supplier: New Pig CorporationDescription: or residue Perfect for removing wax and polishing compounds without scratching surfaces, for wiping away fingerprints and smudges from freshly milled parts or for prepping products for paint
- Material / Backing: Synthetic / Polyester
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Supplier: C & M ToplineDescription: , Chemical and compound mixing, industries are just a few. This barrel is designed for wet or dry process. This is ideal for combining dry powders, ball mill, and chemical mixing, remove burrs, deflashing, ball milling, obtain a uniform appearance, and polishing. Many labs use glass jars to tumble lenses
- Type: Rotary Barrel / Tumbler
- Mounting: Bench
- Driver Technology: Electric Motor / Vibrator
- Motor Voltage and Phase: 115 / 120 V 60 Hz, 50 Hz / International Power, Other
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Supplier: MicroGroupDescription: Produced from the leaf of the Mexican Agave plant, which has a soft to medium texture with good durability. Used in power brushes with and without compounds, resulting in somewhat finer finishes. Tampico used to be the standard in the polishing trade. A fibre from a cactus type plant that grows
- Brush Filament Type: Natural Bristle / Hair
- Applications: Polishing / Lapping (Extra Fine Grits / Filaments)
- Products / Materials Worked: Metalworking
- Mounting: Bore / Center Mount
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Supplier: CS UNITECDescription: Made of merino felt with buttonhole fastening system for polishing work on open and closed pipe constructions and handrails. The polishing belt can be opened and closed as often as necessary. For use with grinding belt rollers and our polishing compounds and creams. Use a separate felt belt
- Applications: Dry Grinding, Bench / Backstand
- Products / Materials Abraded: Metalworking
- Features: Closed Coat
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Supplier: MicroGroupDescription: Produced from the leaf of the Mexican Agave plant, which has a soft to medium texture with good durability. Used in power brushes with and without compounds, resulting in somewhat finer finishes. Tampico used to be the standard in the polishing trade. A fibre from a cactus type plant that grows
- Brush Filament Type: Natural Bristle / Hair
- Applications: Polishing / Lapping (Extra Fine Grits / Filaments)
- Products / Materials Worked: Metalworking
- Mounting: Bore / Center Mount
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Featured Products for Dry Polishing Compound Top
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All synthetic, natural, polycrystalline diamond and CBN powders can be utilized in the manufacturing of compounds. Compound (bases) are typically supplied as "WS" (water soluble), "OS" (oil soluble), or "UN" (universally soluble). However, many additional compound formulations are available for specific applications. Amplex lapping and polishing compounds are excellent for mold, die and tool polishing, polishing to final tolerance of ceramic parts, initial charging of lapping plates and discs... (read more)Browse Abrasive Compounds and Abrasive Slurries Datasheets for Saint-Gobain Surface Conditioning Group -
Oil-soluble compounds with extra-heavy concentration of 100% virgin synthetic diamond for sharp, even cutting action on aluminum. Graded to closer tolerances than those dictated by nationally recognized standards. Provide much faster stock removal than traditional diamond compounds. Formulated not to break down under heat or pressure. Sold in 5-gram Precision Applikator ™ which affords finer control than ordinary syringes. The coarser grades of diamond compound are usually applied... (read more) -
its effectiveness in the newest generation of automotive clear coat finishing. These highly engineered particles are designed to be compatible with most water/oil based compound chemistries, which makes them very user friendly and adaptable to complex slurries and polishing conditions. 9246 particles provide multiple cutting edges to rapidly fill in light scratches and swirl marks. It has successfully demonstrated that it can reduce haze values, while maximizing gloss readings in clear coat... (read more)Browse Abrasive Compounds and Abrasive Slurries Datasheets for Saint-Gobain Surface Conditioning Group -
Saint-Gobain Ceramic Materials' Specialty Abrasives group has launched a new line of plastic lens polishing compounds for the ophthalmic industry to polish MR lens, polyurethane lens and polycarbonate lens. Our patented plastic lens slurries were first proven to be effective on conventional polishing machines that rotated in symmetrical and spherical motion until the desired optical surfaces were achieved. We have also developed a line of polishing compounds suitable for Freeform optical... (read more)Browse Abrasive Compounds and Abrasive Slurries Datasheets for Saint-Gobain Surface Conditioning Group -
IO-2030 pads are used for sapphire polishing -- for use with Saint-Gobain's 92400.20MIC12 Polycrystalline Alumina Slurry on C plane sapphire wafers. IO-2030 is similar to IO-2000, but with additional surface treatment to provide aggressive cutting action while achieving Angstrom finishes. The relatively stiff, dimensionally stable polishing surface with open pore structure and reduced compressibility (3-5% maximum) promotes good flatness. The synthetic fiber construction is effective even under... (read more)Browse Abrasive Compounds and Abrasive Slurries Datasheets for Saint-Gobain Surface Conditioning Group -
IO-6000 pads are used with Saint-Gobain's 92400.20MIC12 Polycrystalline Alumina Slurry on C plane sapphire wafers. The IO-6000 pad is a polyester fiber based and resin treated (polyurethane) pad with a nominal finished thickness of 0.05 inches and is designed to accommodate diverse polishing applications and surfaces. The fiber material has an excellent interconnecting cellular structure which makes the pad highly durable and dimensionally stable. A wetted pad can expand up to 10% in thickness... (read more)Browse Abrasive Compounds and Abrasive Slurries Datasheets for Saint-Gobain Surface Conditioning Group -
Saint-Gobain's 92400.20MIC12 Polycrystalline Alumina Slurry for C plane sapphire wafer polishing is a truly remarkable product. It replaces colloidal silica, SiO2, the traditional final polishing slurry used for many years on C plane sapphire wafers. This slurry can polish the sapphire wafers 2 - 3 times faster than colloidal SiO2, and it doesn't scratch the sapphire wafers, is much more easily cleaned from the wafers and the polishing machinery. Product Benefits. High purity alpha A12O3... (read more)Browse Abrasive Compounds and Abrasive Slurries Datasheets for Saint-Gobain Surface Conditioning Group -
ZIRPOL ™ zirconium oxide powders and slurries have been developed for the critical finishing and polishing of glass substrates. Cerium oxide, increasingly in short supply and escalating in price, is making traditional optical glass polishing operations non-economical. ZIRPOL grains synthesized by Saint-Gobain Ceramic Materials in the USA, France & China are available, globally, in powder and slurry form for the most demanding glass polishing processes. ZIRPOL comes in five powder... (read more)Browse Abrasive Compounds and Abrasive Slurries Datasheets for Saint-Gobain Surface Conditioning Group -
Chemical Mechanical Planarization (CMP) has become one of the vital processes in the production of semiconductor devices which use slurries and pads to polish/planarize the surface of wafers to near defect free surfaces. Saint-Gobain's Polycrystalline Alumina Polishing Slurries are extremely fine particle/slurries intended for semiconductor and electronic materials CMP processes. Products are designated Gen 2, Gen 3, Gen 4, and Gen 5 Polycrystalline Alumina. (read more)Browse Abrasive Compounds and Abrasive Slurries Datasheets for Saint-Gobain Surface Conditioning Group -
polishing in one package. The MF utilizes a high-efficiency microprocessor to deliver power to ultrasonic, brushless DC, and brush-type DC handpieces. Includes H26 Ultrasonic Handpiece with 36W of continuously variable power for precision reciprocating action. The DC output provides exceptional power to any of the Gesswein Power Hand rotary, reciprocating, side-to-side, or belt sander handpieces. The BLDC1 output provides high speed and high torque power to the optional Gesswein BH-60 brushless type... (read more)
Conduct Research Top
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Comparing cleanroom wipers with a dry abrasion resistance test
equipment are being cleaned after sputtering, etching, chemical vapor deposition, or chemical-mechanical polishing. The goal of the study reported in this article, therefore, was to develop a dry test that would allow comparison of wipers on the basis of particle release caused by. MICRO:October...
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MICRO:Top 40 (Nov '00)
planarization (CMP) system combines rotational and orbital technologies, providing the stability of an advanced solid polishing platen with the flexibility of orbital system architecture. Designed for logic and ASIC applications, the Momentum dry-in/dry-out wafer processing system integrates four...
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MICRO:Top 40 (Nov '00)
planarization (CMP) system combines rotational and orbital technologies, providing the stability of an advanced solid polishing platen with the flexibility of orbital system architecture. Designed for logic and ASIC applications, the Momentum dry-in/dry-out wafer processing system integrates four...
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MICRO: Products
The LuminaCu RL-CMP, a 300-mm system for copper planarization processes at the 90-nm technology node and below, is a single-wafer processing tool for polishing copper on soft ultra-low-k dielectrics. Combining a high-linear-velocity component that provides high polishing rates with a low-downforce...
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MICRO: Products
backside that come to the surface during backside polishing pose a risk of yield losses. Such defects cause front-surface distortion during lithography exposure and can migrate between processes. The BSIM applies the Surfscan SP1 platform to detect and classify a wide range of defect types and decreases...
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Using surfactants in iron-based CMP slurries to minimize residual particles
During recent years, the use of chemical-mechanical planarization (CMP) to remove excess coating material from wafer surfaces has increased dramatically, as has the literature on CMP research. Basically, the CMP process involves polishing wafers using a slurry that combines a chemical component...
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MICRO:Building Copperopolis (Jan '99)
chemical-mechanical planarization (CMP) of dual-damascene copper structures therefore will require highly efficient removal of both the copper and barrier layers. But achieving this goal is a challenge because the barrier materials are typically more difficult than copper to planarize using standard polishing...
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MICRO:Product News
as seals in wet and dry process environments. The Kalrez UltraPure compounds offer long-term seal integrity for aggressive fab processes. Kalrez Sahara Plasma 8575 resists O2, fluorine plasma, and chlorinated sealing gases, and is suitable for dry plasma CVD and thermal systems. Kalrez 6375UP resists...
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MICRO:Product Technology News (July '99)
The PEP Iridia can perform both photoresist and residue removal operations in a single chamber without damaging chips or leaving residue. The dry-plasma process offers a lower cost of ownership than wet chemistries for such applications as postimplant resist and postetch residue removal. Using...
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MICRO: Products
levels of precision control in the planarization, delayering, and polishing of advanced materials and substrates for compound semiconductors. For use in R&D, prototype, and small-volume applications, the tool delayers and planarizes SiO2 and metallized depositions. It provides six-sigma capability...
Engineering Web Search: Dry Polishing Compound Top
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Mica - Wikipedia, the free encyclopedia The leading use of dry-ground mica in the US was in joint compound for filling and finishing seams and blemishes in gypsum wallboard (drywall). The |
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Copper - Wikipedia, the free encyclopedia |
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Silverhawks' Diamond Pacific lapidary tool catalog. Titan,... You save time, labor and compound. Vibra-Dry compounds are formulated for pre-polishing and final polishing only. |
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EBARA Technologies, Inc. Compound Semiconductor Solar / Photovoltaic Chemical Mechanical Polishing Systems FREX200 See EBARA Technologies, Inc. Information |
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Society of Manufacturing Engineers What is greaseless polishing compound? Application and use of greaseless compound |
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Current and reliable Adhesives & Sealants news stories Potting and Encapsulating Compound is FDA compliant. |
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Jiangsu Fengmang Compound Material Science & Tech Group... Jiangsu Fengmang Compound Material Science & Tech Group Co., Ltd. |
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ChromaSystemTM Technical Manual ChromaClear? G2-4700STM... Technical Manual ChromaClear? G2-4700STM Clearcoat (Hyper CureTM - Air Dry and Express Bake) Description ChromaClear? G2-4700STM is an express bake See DuPont Performance Coatings Profile & Catalog |
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Low VOC ChromaSystemTM Technical Manual DuPontTM ChromaClear?... Clear Description ChromaClear? 2400STM is a 2.1 VOC, two-component force dry clearcoat for use on spot, multipanel and overall repairs of OEM See DuPont Performance Coatings Profile & Catalog |
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Thermal transfer compound comparison Thermal transfer compound comparison Review date: 13 March 2002. |
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