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Supplier: Advanced Abrasives Corp.
Description: on a work piece or polishing cloth, it will dry soft and so reduce scratching otherwise associated with standard colloidal silica re-crystallization. Applications: Chemical - Mechanical Planarization (CMP) of sapphire wafers, silicon wafers, gallium nitride, quartz, ceramics, metallographic specimens.
- Type: CMP / Wafer Planarization
- Products / Materials Finished: Ceramics / Glass, Semiconductors / Electronics (Wafers), Specialty / Other
- Form: Liquid / Dispersion, Other
- Abrasive Grain Type: Ceramic, Silica
Supplier: New Pig Corporation
Description: Perfect for no-scratch removal of wax, polishing compound, fingerprints and smudges from surfaces, or for prepping products for painting Rayon/poly blend stands up to harsh sanitizers, degreasers, cleaners and solvents Highly absorbent and textured cloth pulls contaminants away from parts
- Material / Backing: Synthetic / Polyester
- Width / OD: 14 inch
- Overall Length: 18 inch
Supplier: DME Company
Description: Quality of mold or die ﬁnish is frequently an important factor in how a mold or die operates. D-M-E Diamond Compound is proven to produce the ﬁnest quality ﬁnish with considerable savings in time and labor. D-M-E Diamond Compound contains no adulterants, nor non-graded
- Type: Polishing
- Products / Materials Finished: Specialty / Other
- Form: Liquid / Dispersion
- Abrasive Grain Type: Diamond
Supplier: CS UNITEC
Description: Made of merino felt with buttonhole fastening system for polishing work on open and closed pipe constructions and handrails. The polishing belt can be opened and closed as often as necessary. For use with grinding belt rollers and our polishing compounds and creams. Use a separate felt belt
- Type: Narrow Belt (Bench / Backstand)
- Width: 1.2 inch
- Length: 26 inch
- Applications: Dry Grinding / Sanding, Polishing (Very Fine Grits)
Supplier: Brush Research Manufacturing Co., Inc.
Description: If you’re looking for power brushes perfect for surface finishing, then Brush Research Manufacturing’s Tampico wheel brushes are the brushes for you. These natural fiber industrial brushes work well in wet or dry applications for the deburring of decorative surfaces. For tough
Supplier: C & M Topline
Description: , Chemical and compound mixing, industries are just a few. This barrel is designed for wet or dry process. This is ideal for combining dry powders, ball mill, and chemical mixing, remove burrs, deflashing, ball milling, obtain a uniform appearance, and polishing. Many labs use glass jars to tumble lenses
- Type: Rotary Barrel / Tumbler
- Mounting: Bench
- Driver Technology: Electric Motor / Vibrator
- Motor Voltage and Phase: 115 / 120 V 60 Hz, 50 Hz / International Power, Other
Description: Produced from the leaf of the Mexican Agave plant, which has a soft to medium texture with good durability. Used in power brushes with and without compounds, resulting in somewhat finer finishes. Tampico used to be the standard in the polishing trade. A fibre from a cactus type plant that grows
- Type / Shape: Power / Rotary Brush (Wheel, Roller)
- Brush Filament Type: Natural Bristle / Hair
- Outer Diameter (OD): 2 inch
- Shank / Bore Diameter: 0.5000 inch
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Advanced Abrasives Corp.
The highest quality superabrasive formulations
. For precise application or for use on inclined surfaces, our compounds are ideal. Our three carrier base formulations: Water Base - Our Aqua-Pol series. Formulated for ease of use in lapping and polishing systems where fast removal rates with high surface finishes are required. They are water soluble, so no harsh chemicals are needed for cleanup. Oil Base - Our Petro-Pol series. Formulated for applications needing the highest quality of surface finish for which petroleum distillates are commonly used... (read more)
Browse Diamond Powders and Superabrasive Grains Datasheets for Advanced Abrasives Corp.
TriStar Plastics Corp.
Atomic-level Cleaning via Surface Modification
may appear to remove all visible gross contaminants, organic residuals such as machining oils, wax, grease, and polishing compounds often remain behind ? and can impede the bonding of component materials. In contrast, atomic-level plasma cleaning is a dry process that removes all traces of contamination left behind on "clean" devices. Plasma cleaning offers superior manufacturing benefits over conventional cleaning methods including: A truly clean surface for enhanced bonding. Dry and uniform... (read more)
Browse Surface Engineering Services Datasheets for TriStar Plastics Corp.
Jet Pulverizer Company (The)
Select Your Jet Pulverized Materials
. Phosphate, Inorganic. Pigment. Pigment, Brown. Pigment, Red Cosmetic. Piroxicam. PMMA. Polishing Powder. Pollen. Polyimide. Polyester. Polyethersulfone - PES. Polyethylene. Polymid. Polyimide Resin. Polyvinyl Resin. Porcelain Scrap. Potassium Chloride. Potassium Nitrate. Potassium Sulfate. Pramoxine Hydrochloride. Protein - Milk. Protein - Soy. PTFE. PVC. PVDC Film. Pyrite. . . Quartz. Ruthenium. Saccharin. Salt. Salts & Sugars. Samarium Colbalt. Sand. Selenium Sulfide. Selenium Metal... (read more)
Browse Grinding Mills and Pulverizers Datasheets for Jet Pulverizer Company (The)
Conduct Research Top
Comparing cleanroom wipers with a dry abrasion resistance test
equipment are being cleaned after sputtering, etching, chemical vapor deposition, or chemical-mechanical polishing. The goal of the study reported in this article, therefore, was to develop a dry test that would allow comparison of wipers on the basis of particle release caused by
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Printed Circuits Handbook, Sixth Edition > ELECTROPLATING
Clean and dry between polishing compounds .
An anodic dissolution-based mechanism for the rapid cracking, ``pre-exposure`` phenomenon demonstrated by Al-Li-Cu alloys
The T 1 intermetallic specimens were mounted in an epoxy potting compound then dry polished through 6_tm SiC paper.
Tribological Behavior of Carbide-derived Carbon Coating on SiC Polycrystal against SAE52100 Steel in Moderately Humid Air
The pol- ishing was done dry and without polishing compound .
Activation of titanium electrodes for voltammetric detection of oxygen and hydrogen peroxide in alkaline media
These surfaces then were rinsed with deionized water, wiped gently with a wetted cotton swab to insure complete removal of the polishing compound , and dried in air.