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Dual Damascene

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Parts by Number for Dual Damascene

Part # Distributor Manufacturer Product Category Description
InSight 3D Atomic Force Microscope   Bruker Nano Surfaces Division Wafer and Thin Film Instrumentation isolation (STI) union dual-damascene structures, sidewall angles, line-edge variation and more. Provides the lowest measurement uncertainty for critical dimension (CD) and sidewall angle (SWA) metrology. 30 wph, 9 sites throughput for Depth metrology & 12 wph, 9 sites throughput for CD metrology...

Conduct Research

  • MICRO: Using an in-line measurement system for copper damascene process control
    A three-element technique provides data for production monitoring and process fingerprinting, development, and diagnostic applications. mong the many challenges presented by the adoption of copper damascene and dual-damascene metallization processes for the creation of next-generation interconnects...
  • MICRO: 300-mm Imperative
    Axcelis Technologies says its new resist strip tool is the first such system that won't damage low-k materials. Introduced May 27, the ES3Lk uses chemistries that preserve the insulating and structural properties of the low-dielectric-constant materials in dual-damascene processes, according...
  • MICRO:Building Copperopolis, by Qingyuan Han (Oct '99)
    Qingyuan Han and Ivan L. Berry, ; and Jianou Shi, Thomas W. Mountsier, and Mary Anne Plano, Postdielectric dry strip and residue removal are critical steps toward integrating low-k dielectrics into damascene or dual-damascene processes. As design rules go below 0.18 um, interconnect delay becomes...
  • MICRO: Industry News: Expansions and Acquisitions (May 2000)
    will be used to test copper dual-damascene processes. The pact makes GaSonics the newest member of the Damascus alliance of equipment manufacturers that Novellus established to address the challenges of copper interconnect integration. Other members include Lam Research and SpeedFam-IPEC. GaSonics...
  • MICRO: Product Extras (Jan '2000)
    to high-end copper processing by aiding the removal of copper and barrier residues from field or patterned areas and by preventing mechanisms that lead to the loss of metal thickness, such as erosion and dishing in dual damascene sites. Information: +972 8 9387505. GaSonics International is offering...
  • MICRO:Industry News:'Round the Circuit (Feb 99)
    , unnamed chipmaker is also participating in the open-ended project. The Electra system is based on Applied's Endura platform. Incorporating the supplier's ion metal plasma PVD technology, the system deposits the conformal liner and barrier layers required for manufacturing dual damascene high-aspect...
  • MICRO: Product Extra!
    Dow Corning has been granted a patent in Japan covering the use of silicon carbide barrier films between dielectric and metal layers. Silicon carbide barrier technology is essential in the production of leading-edge devices, which use copper dual-damascene conductors and low-k dielectric insulators...
  • MICRO: Industry News: 'Round the Circuit (Feb 2000)
    of the dual-damascene process is 1.6 times lower than aluminum or tungsten metallization, according to TSMC. Additional benefits include higher electromigration reliability of and via series resistance fives times lower than that of tungsten plug vias, the company says. Because the two-layer capability...
  • MICRO:Building Copperopolis (Jan '99)
    as well as electroless and electrolytic plating each with different grain sizes and fill characteristics. There are still many important issues to be resolved, however, before dual-damascene copper technology can be successfully implemented. Tantalum (Ta)- and tungsten (W)-based diffusion barriers...
  • Chipmakers move to Second-Generation Copper
    products. Technicians at Enthone's New Haven research facility at work in a copper-additive blending area. The blue tanks hold high-purity electrolyte used in dual damascene copper deposition. Photomicrographs reveal how copper builds up in 0.12 m trenches after 8 sec (left) and 30 sec. Use...

Engineering Web Search: Dual Damascene

Dual Damascene Structure invention
Dual damascene structure Abstract: A dual damascene structure and a method of forming a dual damascene structure are disclosed.
Via Plug Formation In Dual Damascene Process invention
Via plug formation in dual damascene process
Direct fabrication of multi-tier structures in dielectric...
Direct fabrication of multi-tier structures in dielectric materials for dual damascene processing
Dual Damascene: a ULSI wiring technology
Dual Damascene: a ULSI wiring technology
) dual damascene interconnection

Electromigration characteristics in dual-damascene copper...
Electromigration characteristics in dual-damascene copper interconnects by difference of via structures
Current Technical Trends: Dual Damascene & Low-k...
Current Technical Trends: Dual Damascene & Low-k Dielectrics Jerry Healey President ? Threshold Systems ? 2002 by Threshold Systems Introduction As
See IC Knowledge LLC Information
Sony Global - CX-NEWS Vol.33
Dual damascene copper wiring technology
BEOL with SFIL Grant Willson Departments of Chemistry and...
Dual Damascene Process Overview Sematech's "Dual Top Hard Mask" Process # of process steps: 0 1 2 3 4 5 6 7 8 9 10 Expose Develop Photoresist BARC
Dr. Kuang-Jung Chen : SPIE.org Profile


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