Products & Services

See also: Categories | Technical Articles | More Information
  • Description: The KLA-Tencor INM300 DUV microscope includes the latest enhancements in optical imaging capabilities offering the flexibility to include 248nm DUV, 365nm UV, visual brightfield, darkfield and DIC illumination modes. With resolution capabilities down to 80nm, advanced automation and a stage travel

    • Application: Semiconductor Inspection
    • Grade: Benchtop
    • Microscope Type: Fluorescent / UV
    • Total Magnification: 1.6 to 150 X

  • Description: The INS3000 DUV automated optical defect review and classification system incorporates the advantages of a conventional optical microscope into a fully automated, production-ready tool. With wavelengths spanning visible, UV and DUV ranges, the INS3000 DUV enables the highest resolution available

    • Application: Semiconductor Inspection
    • Grade: Benchtop
    • Microscope Type: Fluorescent / UV
    • Resolution: 0.0800 µm

  • Description: Olympus now offers the Deep Ultraviolet (DUV) Light Observation System for high magnification, high resolution and real time DUV observation.

    • Application: Metallurgical
    • Grade: Benchtop
    • Microscope Type: Fluorescent / UV
    • Eyepiece Style: Binocular, Trinocular

  • Description: for the DUV-NUV and Gold for the IR. Free from the problems of chromatic aberration and material absorption associated with standard microscope objectives, these components are ideal for applications requiring high throughput and excellent resolution, including FTIR spectroscopy and microscopy

    • Lens Type: Objective Lens
    • Magnification: 25 X
    • Numerical Aperture: 0.4000 NA
    • Working Distance: 0.5709 inch

  • Description: The INS3300 automated optical defect review and defect classification system incorporates UV and DUV optics for the highest resolution available on any optical review microscope. Fully automated and production-ready, the INS3300 defect classification system is user-friendly, ergonomic and reliable

    • Form Factor: Wafer Probing System
    • Mounting / Loading: Floor Mounted / Stand-alone
    • Applications: Semiconductor Wafers
    • Measurement Capability: Defects / ADC

Page: 1

Conduct Research Top

  • MICRO: Behind the Mask -Chen (April 2000)
    patterned defect inspection system (KLA-Tencor, San Jose) running the advanced performance algorithm (APA). Both i-line and deep ultraviolet (DUV) Verithoro programmed defect masks from DuPont Photomasks were investigated. Although engineers have traditionally used shearing microscopes to measure
  • MICRO: Products
    laser ellipsometer and an integrated DUV reflectometer with a photomultiplier detector, S200/S300- metrology systems can characterize nitrided gate oxides. Measurements of thicknesses and nitrogen concentrations of dielectric films of 15 to 20 A can be performed accurately and repeatably. The system

More Information Top

Lock Indicates content that may require registration and/or purchase. Powered by IHS Goldfire