Electrical Material Impregnating Resin

Description: ES® H62 C is a solvent-free, liquid silicone resin which is cured by heat. Special features is a methylphenylvinylhydrogen polysiloxane not modified with organic components; is of very low volatility (suitable for vacuum pressure impregnation); is cured by heat through catalysed

• Use: Encapsulant / Potting Compound, Impregnating Resin
• Material Type / Grade: Elastomer / Rubber
• Chemical / Polymer System Type: Silicone
• Filler Material: Unfilled

Description: Master Bond Polymer System EP19M is a high performance epoxy resin formulation specially formulated to bond to treated fluoropolymer and other difficult to bond surfaces. It is supplied as a single component low viscosity compound and requires cure at elevated temperatures in order to obtain high

• Use: Die Bonding Adhesive / Compound, Encapsulant / Potting Compound, Gap Filling Compound, Impregnating Resin
• Substrate / Material Compatibility: Other
• Chemical / Polymer System Type: Epoxy (EP), Specialty / Other
• Features: Electrical Insulation / Dielectric Material, Encapsulanting / Potting

Description: Water-borne epoxy emulsion - dip-and-bake impregnating resin

• Use: Impregnating Resin
• Form: Liquid
• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Thermosetting / Crosslinking

Description: plastic films to more rigid materials including polyester films, metal foils and even glasses. Master Bond Polymer System UV19 is a very good electrical insulator. Other advantageous performance properties include low shrinkage during cure, high impact strength, superior resistance to thermal cycling

• Use: Conformal Coating, Encapsulant / Potting Compound, Gap Filling Compound, Impregnating Resin
• Form: Liquid
• Cure Type / Technology: UV / Radiation Cured (also EB, Light)
• Industry: Optoelectronics / Photonics, Semiconductors / IC Packaging, Electronics, Electrical Power / HV

Description: for optoelectronic display devices, bonding fiber optics (glass or plastic) and, for optical filters. EPO-TEK OH101 can be used for bonding glass, quartz, metals and most plastics. It has also been used for impregnating wooden objects in the restoration of artifacts. The maximum recommended service

• Substrate / Material Compatibility: Ceramic / Glass
• Chemical / Polymer System Type: Epoxy (EP)
• Industry: Optical Grade / Material, Photonics / Optoelectronics
• Cure Type / Technology: Thermosetting / Crosslinking

Description: of wire enamel, impregnating resins, potting compounds, casting resins, conformal coatings, adhesives, and specialty epoxy products used in hi-temp applications used for a number of electrical, industrial, automotive, aerospace and civil applications.

• Use: Conformal Coating
• Form: Liquid
• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Thermosetting / Crosslinking

Description: INSULCAST 504 is an unfilled 100% solids epoxy resin casting or impregnating material. The product has excellent physical and electrical properties. The standard room temperature curing agent is INSULCURE 8 which gives fast cures and resilient castings.

• Substrate / Material Compatibility: Plastic
• Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Military / Government (MIL-SPEC / GG), OEM / Industrial, Building / Construction, Other
• Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
• Use: Die Bonding Adhesive / Compound

Description: of wire enamel, impregnating resins, potting compounds, casting resins, conformal coatings, adhesives, and specialty epoxy products used in hi-temp applications used for a number of electrical, industrial, automotive, aerospace and civil applications.

• Use: Encapsulant / Potting Compound
• Form: Liquid
• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Reactive / Moisture Cured, Room Temp. Cure / Vulcanizing, Thermosetting / Crosslinking

Description: of wire enamel, impregnating resins, potting compounds, casting resins, conformal coatings, adhesives, and specialty epoxy products used in hi-temp applications used for a number of electrical, industrial, automotive, aerospace and civil applications.

• Use: Encapsulant / Potting Compound
• Form: Liquid
• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Thermosetting / Crosslinking

Description: of wire enamel, impregnating resins, potting compounds, casting resins, conformal coatings, adhesives, and specialty epoxy products used in hi-temp applications used for a number of electrical, industrial, automotive, aerospace and civil applications.

• Use: Encapsulant / Potting Compound, Impregnating Resin
• Form: Liquid
• Chemical / Polymer System Type: Polyester / Vinyl Ester
• Cure Type / Technology: Reactive / Moisture Cured, Room Temp. Cure / Vulcanizing, Thermosetting / Crosslinking

Description: Dark-brown silicone impregnating resin that offers processing ease and versatility, and features good dielectric properties and moisture resistance. In service, it exhibits good retention of bond strength. Used as an impregnate and coating material for various electrical coils including

• Chemical / Polymer System Type: Silicone
• Compound Type: Liquid
• Industry: Industrial, Tooling / Molds

Description: of wire enamel, impregnating resins, potting compounds, casting resins, conformal coatings, adhesives, and specialty epoxy products used in hi-temp applications used for a number of electrical, industrial, automotive, aerospace and civil applications.

• Compound Type: Encapsulating / Potting
• Dissimilar Substrates: Yes
• Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
• Features: Electrical Insulation / Dielectric Material, Flexible / Dampening, Non-corrosive Cure

Description: of wire enamel, impregnating resins, potting compounds, casting resins, conformal coatings, adhesives, and specialty epoxy products used in hi-temp applications used for a number of electrical, industrial, automotive, aerospace and civil applications.

• Use: Encapsulant / Potting Compound, Impregnating Resin
• Form: Liquid
• Chemical / Polymer System Type: Polyester / Vinyl Ester
• Cure Type / Technology: Room Temp. Cure / Vulcanizing, Thermosetting / Crosslinking