Electrical Plastic Impregnating Resin

Description: VPI / dip-and-bake resin for motor and transformer windings. Chemical-resistant

• Substrate / Material Compatibility: Metal, Paper / Paperboard, Plastic
• Use: Impregnating Resin
• Material Form: Varnish / Impregnating Resin
• Features: Electrical Power / HV, UL Approved

Description: Water-borne epoxy emulsion - dip-and-bake impregnating resin

• Substrate / Material Compatibility: Metal, Paper / Paperboard, Plastic
• Use: Impregnating Resin
• Material Form: Varnish / Impregnating Resin
• Features: Electrical Power / HV, UL Approved

Description: INSULCAST 502 is an unfilled epoxy with low viscosity for general purpose casting and impregnation, exhibiting excellent electrical and physical properties.

• Use: Die Bonding Adhesive / Compound, Impregnating Resin
• Substrate / Material Compatibility: Plastic
• Form: Liquid
• Chemical / Polymer System Type: Epoxy (EP)

Description: Sauereisen Electric Resistor Cement No. 78 is an ideal electrical refractory cement for coating resistors, coils, electric heating elements, furnaces, and embedding resistance wire. It replaces insulating varnish, enamel, mica, etc. The cement is also available in powder form known as Sauereisen

• Use: Die Bonding Adhesive / Compound, Conformal Coating, Encapsulant / Potting Compound, Impregnating Resin
• Substrate / Material Compatibility: Ceramic / Glass, Metal, Paper / Paperboard, Plastic
• Material Type: Conformal / Encapsulating Coating, Die Bonding Adhesive / Compound
• Industry: Electronics, Electrical Power / HV

Description: Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500°F with truly outstanding chemical resistance. High strength bonds serviceable up to 600°F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin

• Substrate / Material Compatibility: Ceramic / Glass, Composites, Metal, Plastic
• Use: Die Bonding Adhesive / Compound, Conformal Coating, Gap Filling Compound, Impregnating Resin
• Dissimilar Substrates: Yes
• Chemical / Polymer System Type: Epoxy (EP)

Description: for optoelectronic display devices, bonding fiber optics (glass or plastic) and, for optical filters. EPO-TEK OH101 can be used for bonding glass, quartz, metals and most plastics. It has also been used for impregnating wooden objects in the restoration of artifacts. The maximum recommended service

• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Thermosetting / Crosslinking
• Industry: Optoelectronics / Photonics
• Composition: Two Component System

Description: of wire enamel, impregnating resins, potting compounds, casting resins, conformal coatings, adhesives, and specialty epoxy products used in hi-temp applications used for a number of electrical, industrial, automotive, aerospace and civil applications.

• Material Form: Polymer (Plastic / Elastomer), Potting Compound
• Features: Electrical Power / HV
• Compound Type: Electrical Insulation / Dielectric
• Form / Function: Encapsulant / Potting Compound

Description: of wire enamel, impregnating resins, potting compounds, casting resins, conformal coatings, adhesives, and specialty epoxy products used in hi-temp applications used for a number of electrical, industrial, automotive, aerospace and civil applications.

• Material Type / Grade: Thermoset
• Chemical / Polymer System Type: Epoxy
• Filler Material: Mineral
• Features: UL Approved

Description: of wire enamel, impregnating resins, potting compounds, casting resins, conformal coatings, adhesives, and specialty epoxy products used in hi-temp applications used for a number of electrical, industrial, automotive, aerospace and civil applications.

• Material Form: Composite, Polymer (Plastic / Elastomer), Potting Compound
• Features: Electrical Power / HV
• Material Type / Grade: Thermoset
• Chemical / Polymer System Type: Epoxy

Description: of wire enamel, impregnating resins, potting compounds, casting resins, conformal coatings, adhesives, and specialty epoxy products used in hi-temp applications used for a number of electrical, industrial, automotive, aerospace and civil applications.

• Material Form: Composite, Polymer (Plastic / Elastomer), Potting Compound
• Features: Electronics / Semiconductors, Electrical Power / HV, UL Approved
• Material Type / Grade: Thermoset
• Chemical / Polymer System Type: Epoxy

Description: of wire enamel, impregnating resins, potting compounds, casting resins, conformal coatings, adhesives, and specialty epoxy products used in hi-temp applications used for a number of electrical, industrial, automotive, aerospace and civil applications.

• Material Form: Coating, Composite, Dielectric Coating (Encapsulant, Conformal, etc.), Polymer (Plastic / Elastomer), Potting Compound
• Features: Electronics / Semiconductors
• Use: Conformal Coating, Encapsulant / Potting Compound
• Form: Liquid

Description: of wire enamel, impregnating resins, potting compounds, casting resins, conformal coatings, adhesives, and specialty epoxy products used in hi-temp applications used for a number of electrical, industrial, automotive, aerospace and civil applications.

• Material Form: Polymer (Plastic / Elastomer), Potting Compound
• Features: Electronics / Semiconductors, Electrical Power / HV
• Compound Type: Electrical Insulation / Dielectric
• Form / Function: Encapsulant / Potting Compound

Description: of wire enamel, impregnating resins, potting compounds, casting resins, conformal coatings, adhesives, and specialty epoxy products used in hi-temp applications used for a number of electrical, industrial, automotive, aerospace and civil applications.

• Dissimilar Substrates: Yes
• Industry: Aerospace, Electronics, Military / Government (MIL-SPEC / GG), OEM / Industrial
• Chemical / Polymer System Type: Epoxy (EP)
• Filled / Reinforced: Yes