Electrically Insulating Polymer

Description: Master Bond Polymer System EP30AOHT is a two component epoxy resin system for high performance potting, bonding, sealing and coating formulated to cure at room temperature or more rapidly at elevated temperatures with a ten-to-one (10:1) mix ratio by weight. It has an attractive balance

• Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Composites, Metal, Plastic, Porous Surfaces, Rubber / Elastomer, Wood / Wood Product
• Dissimilar Substrates: Yes
• Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Marine, OEM / Industrial, Semiconductors / IC Packaging, Building / Construction, Tooling / Mold Material, Other
• Chemical / Polymer System Type: Epoxy (EP)

Description: EPO-TEK® 354 is a two component, high Tg epoxy designed for semiconductor packaging in medical, fiber optic and optoelectronic assemblies. It is an electrically and thermally insulating epoxy.

• Material Type / Grade: Thermoset
• Chemical / Polymer System Type: Epoxy
• Resins & Compounds: Liquid
• Compound Type: Casting Resin

Description: stability. Rulon 945 is best suited for use against hard mating surfaces, like hardened steel substrates since it does have moderate abrasive qualities. It is not suitable in applications where electrically insulating properties are required.

• Material Type / Grade: Thermoplastic
• Chemical / Polymer System Type: Fluoropolymer (PTFE / PVDF)
• Filler Material: Unfilled
• Industry: Industrial

Description: Thermally conductive, electrically insulating epoxy designed for heat sinking and encapsulation. Also ideal for large volume potting applications.

• Material Type: Grease / Paste
• Industry: Electronics
• Features: Electrical Insulation / Dielectric
• Chemical / Polymer System Type: Epoxy (EP)

Description: tubing is an electrically insulating material, eliminating the need to shrink-wrap. Polygon is the industry leader in providing double-insulation for handheld electric power tools. Those same dielectric properties work to reduce the risk of capacitance coupling and oxygen fires during electrosurgery

Description: crystal clear vulcanisate very high transmission long-term stability against weathering, moisture and UV radiation electrically insulating Application multi-purpose potting agent for the solar energy industry encapsulation of solar cells bonding of optical devices

• Material Form: Coating, Dielectric Coating (Encapsulant, Conformal, etc.), Grease / Gel, Polymer (Plastic / Elastomer), Potting Compound
• Features: Electronics / Semiconductors
• Use: Conformal Coating, Encapsulant / Potting Compound
• Form: Grease / Paste

Description: D/W 103 is a skived PTFE that has been compounded with carbon to produce a highly conductive film. D/W 103 can be surface treated to enhance bonding to other substrates.

• Materials of Construction: Fluoropolymer, Plastic / Polymer, Specialty / Other
• Adhesive: None / Non-adhesive
• Features: Anti-static / ESD Control, Thermally Insulating / Insulative, Electrically Conductive
• Type: Electrical Tape, Specialty Tape

Description: A two component, high Tg, thermally conductive, electrically insulating epoxy designed for semiconductor packaging including heat sinking, hermetic sealing, and opto-electronic assemblies. It may be considered a higher viscosity alternative to EPO-TEK® H74.

• Compound Type: Thermally Conductive
• Material Form: Grease / Paste
• Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging

Description: Master Bond Polymer System EP19SC is a one component silver filled electrically conductive epoxy adhesive ocmpound wiht excellent chemical resistant and thermal stability characteristics. This adhesive features very low levels of ionic impurities and provides durable high strength electrically

• Material Type: Gap Filling Compound, Die Bonding Adhesive / Compound
• Industry: Electronics, Electrical Power / HV, Optoelectronics / Photonics
• Features: Electrical Insulation / Dielectric
• Chemical / Polymer System Type: Epoxy (EP), Specialty / Other

Description: ITO Coated Silver FEP Sheldahl’s family of FEP films that are silver coated on one side are used as second surface mirrors to obtain low solar absorptance and high emittance. We then add ITO to the other side to bleed off surface charges without significantly affecting the thermo-optical

• Types: Coated, Metallized
• ITO: Yes
• Film Material: Plastic / Polymer, Polycarbonate
• Features: Anti-static / ESD Control, Electrically Conductive, Thermally Insulating / Insulative

Description: radiation electrically insulating available in translucent, black or white Application Economic multi-purpose adhesive for the PV industry, e.g. for frame sealing or junction box bonding.

• Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic
• Industry: OEM / Industrial, Other
• Chemical / Polymer System Type: Silicone, Rubber Based / Elastomeric
• Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Reactive / Moisture Cured, Single Component System

Description: fast curing primerless adhesion to many substrates long-term stability against weathering, moisture and UV radiation electrically insulating Application Fast-curing multi-purpose adhesive for the solar energy industry, e.g. for frame sealing, bonding of junction boxes or fixation

• Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic
• Industry: OEM / Industrial, Other
• Chemical / Polymer System Type: Silicone, Rubber Based / Elastomeric
• Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System

Description: Master Bond Polymer System EP75-1 is a two component, graphite filled, electrically conductive epoxy for high performance bonding, sealing and coating formulated to cure at room temperature or more rapidly at elevated temperatures. The mix ratio of the EP75-1 system is 100 to 15 by weight

• Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic, Porous Surfaces, Rubber / Elastomer, Wood / Wood Product
• Industry: Automotive, Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging
• Chemical / Polymer System Type: Epoxy (EP)
• Filled / Reinforced: Yes

Description: Withstands polymer decomposition during reflow

• Substrate / Material Compatibility: Ceramic / Glass, Metal, Other
• Industry: Electronics
• Filled / Reinforced: Yes
• Cure Type / Technology: Thermosetting / Crosslinking, Single Component System