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Supplier: Anoplate Corporation
Description: Quality industrial plating and metal finishing services including: nickel, chromium, zinc, cadmium, silver, gold and tin. Electroless nickel, black chrome, hard chrome, black nickel. Expertise includes specialized masking operations and selective plating processes. Certified to NADCAP, MIL, ASTM
- Capabilities: Abrasive Blasting, Peening
- Services : Refinishing
- Material / Substrate: Aluminum, Ceramic, Copper / Copper Alloys, Steel / Steel Alloys, Stainless Steel, Iron / Cast Iron, Metal, Nickel / Nickel Alloys, Precious Metals, Polymer (Plastic / Rubber), Titanium
- Industry: Aerospace, Architectural / Construction, Castings / Cast Metal, Commercial / Professional, Electronics, Energy / Utilities, Government, Machine Tools, Medical / Healthcare, Military Specification, OEM / Industrial, Oil & Gas
Supplier: Specialty Seal Group
Description: replaced gold plating with lower-cost boron electroless nickel. This method offers high melting points for high-temperature resistance. Boron nickel is the best choice for wear applications in which subsequent heat treating is not practical. Rockwell Hardness is equal to hardchrome plating
Electrical Connectors - Pin Jack; Black; 3 A; 1500 V (RMS); Polycarbonate; Nickel Plated Brass; 115 deg -- 70198183Supplier: Allied Electronics, Inc.
Description: Insulated Pin Jack with Wire Wrap Terminals, Nickel Plated Brass Contact Accepts 0.080 dia. pin. Max. Panel Thickness: 0.25. Material: Jack — nickel-plated brass. Spring: Gold-plated beryllium copper. Terminal: Gold-plated phosphor bronze. Insulation: Polycarbonate. Rating: 1500
Supplier: Tech-Etch, Inc.
Description: having to commit to expensive, progressive die tooling. Visit our Flat Design Guide and Formed Design Guide for complete specifications. Tech-Etch has a full in-house plating and mechanical finishing facility. This includes Gold, Nickel, Electroless Nickel, Copper, Tin, and Tin-lead plating, plus
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Featured Products for Electroless Gold Top
Metalor Technologies USA Corporation
Electroless Immersion/Electrolytic Precious Metals
Metalor Technologies USA provides a wide variety of gold. processes for the semiconductor industry. Broadly speaking,. the offerings can be consolidated under the following. headings: • Immersion gold systems. • Electroless or autocatalytic gold and palladium systems. • Electrolytic gold systems. • Commodity components. We are the worldwide market leader in precious metals for. the semiconductor industry. Immersion gold – Supermex 200 Series. Excellent complement... (read more)
Browse Plating Chemicals and Anodizing Chemicals Datasheets for Metalor Technologies USA Corporation
H.C. Starck Inc. - Fabricated Products Group
Semiconductor Materials for Thermal Management
. Our electroplating capabilities add value to our thermal management components, we have one of the largest electroplating facilities specializing in ruthenium, rhodium, silver, gold, electroless and electrolytic nickel coatings. Various techniques are available, including PVD for single or double-sided coating, rack or barrel plating, enabling complete and comprehensive part size flexibility in addition to volume management capability – from a single component to multi-batch. Specialty... (read more)
Browse Semiconducting Materials Datasheets for H.C. Starck Inc. - Fabricated Products Group
Compac Development Corporation
Send Us Your Prints! Custom EMI/RFI Shielding
is Chemical Film per Mil-C-5541 Class 3. Compac offers a wide selection of other finishes from plated (e.g. Electro and Electroless Nickel Plating, Silver, Tin, Cad, Gold and Anodize to name a few.) We also offer both paint and powder coating. We can part mark by silk screening, stenciling, engraving or rubber-stamping. Quick Links: Board Mountable Enclosures (FLT). Standard Series. RFT Series RFI/EMI Shielded Enclosures... (read more)
Browse EMI and RFI Shielding Datasheets for Compac Development Corporation
Parts by Number for Electroless Gold Top
|Part #||Distributor||Manufacturer||Product Category||Description|
|6478178||RS Components, Ltd.||Bourns Electronics||Resettable Surface Mount Fuses||Trip Current:0.6A; Voltage Rating:30 V; Time to Trip:0.1s; Hold Current:0.3A; Maximum Current:10 A; Length:4.73mm; Height:1.1mm; Width:3.41mm; Terminal Material:Electroless Nickel Immersion Gold; Minimum Resistance:0.3Ohms|
|6478370||RS Components, Ltd.||Bourns Electronics||Resettable Surface Mount Fuses||Trip Current:0.4A; Voltage Rating:30 V; Time to Trip:0.02s; Hold Current:0.2A; Maximum Current:10 A; Length:3.43mm; Height:1.1mm; Width:2.8mm; Terminal Material:Electroless Nickel Immersion Gold; Minimum Resistance:0.4Ohms|
|6478364||RS Components, Ltd.||Bourns Electronics||Resettable Surface Mount Fuses||Trip Current:1.5A; Voltage Rating:6 V; Time to Trip:0.1s; Hold Current:0.75A; Maximum Current:40 A; Length:3.43mm; Height:0.85mm; Width:2.8mm; Terminal Material:Electroless Nickel Immersion Gold; Minimum Resistance:0.07Ohms|
Conduct Research Top
BAN-PLT-1.1 NEW Electroless Nickel Gold Plating (c)
exhibit problems including Kirkendall voiding and battery effects between gold and silver, which make the solution less attractive. Barry LTCC is now able to offer a lower cost more reliable alternative to the gold system. Utilizing the silver system for LTCC construction with subsequent electroless
Avoiding Plating Headaches
and covering/throwing power) would not be on the laundry list of headaches. Unfortunately chrome, zinc, tin, gold and most other plating operations are not "electroless" and end-up as items 1) and 3) on "THE LIST". . . THE LIST . . 1) Sharp pointed edges or points. . 2) Lack of either drain
Micro-D Connectors in Cable Assemblies
shell finishes. All. Electroless Nickel or Cadmium/Olive Drab or Black Anodize; other finishes available. Backshell finishes. All. Same as connector shell finishes. Detailed specifications can be provided upon request. Micro-D Connector Drawings. Drawings shown are for pin connectors, viewed into mating
Ceramic Electronic and IC Packaging Design Guide
). 7.16 (3.98). 4.50 (2.5). thicknesses typical y. Gold. Electroless. Meets MIL-G-45204 or AMS2422. Thermal Conductivity (25°C). W/mK (BTU-in/ft2-h-°F). 20.3 (141). 160 (1174). from 50µ" to 300µ". Electrolytic. MIL-G-45204 or AMS2422. Dielectric Strength. kv/mm (volts/mil). 11.6 (295). 13.0 (330
TA002: Backside Mounting Procedures for Semiconductor Wafer Processing
, this pro-. cess is difficult to automate for high-vol-. The photoresist mask is. ume GaAs wafer manufacturing because. stripped from the backside. electroless baths are typically very sensitive. wafer surfaces by first. to temperature, pH, specific gravity, organ-. immersing the wafers in a. ic
Discover the Best Material for your Application
): Copper (Electroless) Plating Solutions, Copper Plating (Misc): Copper Pyrophosphate Plating Solutions, Gold Plating: Acid 75 F Plating Solutions, Gold Plating: Cyanide 150 F Plating Solutions, Gold Plating: Neutral 75 F Plating Solutions, Indium Sulfamate Plating R.T.
TA022: Benefits and Challenges in Decreasing GaAs through Substrate via Size and Die Thickness
on the back-side. locked, four wafer per chamber RIE systems using. surface and inside the vias by sputter, electroplate, or. BCl. electroless deposition. In order to remove the solder-stop. 3/Cl2 based chemistries have been used to etch small,. through substrate vias with an average etch rate in the 0.3. metal
PTFE And Hybrid Multilayer Bonding And Fabrication
that have been used successfully are a light brown oxide, microtech and electroless nickel followed by an immersion gold. While it is true oxide coatings and untreated copper surfaces will decompose and oxidize during lamination at temperatures suitable for Fluorinated Ethylene Propylene (FEP) film
Engineering Web Search: Electroless Gold Top
Cyan-free electroless gold plating with high adhesion to...
> Research Results > Cyan-free electroless gold plating with high adhesion to various plastic films
Neutral type Auto-Catalytic Electroless Gold Plating Process...
of EN film in electroless gold bath Currently, PC-package (PKG) applications are wire In order to measure the rest potential of gold deposition
ENIG electroless nickel, ENEPIG, immersion gold plating,...
General Metal Finishing ?New Miralloy 2851 ?Electroless Nickel ?Electroless Gold and Other Products Automotive Industry Ceramic Substrates Apparel
Electronics & Communications | The Dow Chemical Company
Pure immersion gold plating solution for electroless nickel immersion gold (ENIG) or electroless nickel electroless palladium immersion gold (ENEPIG)
Non-cyanide electroless gold plating solution and process for...
Non-cyanide electroless gold plating solution and process for electroless gold plating -> Monitor Keywords
Electroless Gold Plating Solution invention
been filed for non-cyanide displacement electroless gold plating solutions include those that make use of gold sulfite compounds (see, for example,
A Comparison of Cyanide and Thiosulfate Baths for the plating...
Shown in figure 2 is a comparison of Electroless Plating of Gold Thin Films cyanide and thiosulfate electroless plating on a Ni A. Angstetra, M. I.
Nanotextured gold coatings on carbon nanofiber scaffolds as...
characterization of a hybrid material made by electroless deposition of gold onto a scaffolding of vertically aligned carbon nanofibers is described.