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Supplier: American Welding Society (AWS)
Description: This specification addresses processing and quality control requirements for electron beam welding. Processing includes both high- and low-voltage welding equipment and high and medium vacuum variations. Materials. This specification covers all major engineering alloys including: Ferrous AlloysShow More
Supplier: RS Components, Ltd.
Description: through the feet of the pads of the resistor. We recommend that you are generous with the traces and board pads. . Suitable applications include automatic test equipment, electron microscopes, electron beam recording equipment, forced balance electronic scales, high precision instrumentation, current
- Technology / Construction: Metal Film
- Mounting / Packaging: Surface Mount (SMT / SMD)
- Resistance Range: 0.0100 ohms
- Tolerance: 1 +/- %
Supplier: Richardson RFPD
Description: and LO buffer amplifier makes the provision of the LO easier than for fundamental mixers at these frequencies. IF and IF mixer inputs are provided through an external 180 degree hybrid. This MMIC uses Mimix Broadband's GaAs PHEMT device model technology, and is based upon electron beam lithography
- Function: Transmitter Only
- Output Power: 39.81 milliwatts
- Operating Frequency: 1.80E10 to 3.60E10 Hz
- Form Factor / Package: Other
Supplier: Richardson RFPD
Description: . This MMIC uses GaAs PHEMT device model technology, and is based upon electron beam lithography to ensure high repeatability and uniformity. The chip has surface passivation to protect and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy
- Device Type / Applications: Transceiver
Description: functional form which it might be expected to take were suggested by previous work of one of the authors on microwave tubes and their noise performance. This work showed that noise parameters of the electron beam set an ultimate limit to the entire noise performance of the amplifier that employedShow More
Supplier: KLA-Tencor Corporation
Description: , versatile imaging capabilities, and the industry's best-tested resist models to produce the most accurate and easy-to-use e-beam simulator available. Quickly delivers electron beam lithography process optimization information--in minutes versus days Accurately explores the effects of processShow More
Hookup Wires - Wire, Hook-Up; 24 AWG; 7/32; 0.016 in.;0.056 in.; -55 degC; 105 degC; White -- 70136271Supplier: Allied Electronics, Inc.
Description: wire is exposed to controlled electron beam radiation which results in an insulation far superior to ordinary PVC. Irradiated PVC withstands High Er temperatures than ordinary PVC. Because of its ability to resist solder iron heat, it is the ideal material to use where high reliability is essential
- Rated Voltage: 300 volts
- Wire Insulation: Polyvinyl Chloride (PVC)
- Wire Conductor: Copper and Copper Alloys
- North American (AWG): 24 AWG
Supplier: FLEXcon Company, Inc.
Description: to the standard 2.0 mil product Matte topcoated film designed for cross-technology printability via impact, laser, electron beam, wax, resin and wax/resin thermal transfer (we recommend evaluating the intended ribbon and ink system for compatibility with the product under the application conditionsShow More
Supplier: FLEXcon Company, Inc.
Description: 2.0 mil matte topcoated clear polyester provides consistent surface smoothness, excellent dimensional stability and endurance to varying temperatures Matte topcoated film designed for cross-technology printability via impact, laser, electron beam, wax, resin and wax/resin thermal transfer (weShow More
Supplier: Vistec Electron Beam Lithography Group
Description: The Vistec SB3050 Series - now with a Cell Projection option - is our commitment to semiconductor manufacturing professionals. Designed to meet the challenges of direct patterning down to the 32nm technology node, it features Variable Shape Beam (VSB) technology with vector scan and continuouslyShow More
Supplier: Samsung Electro-Mechanics
Description: are created based on each pitch according to the mounting methods and the needs of customers - SMD : Solder Mask Defined - NSMD : Non Solder Mask Defined Technology - Able to form solder resister in the BGA Pad section - Various materials such as PSR ink, Coverlay, Prepreg and others are usedShow More
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PHOTONIS Technologies SAS
FieldMaster™ Resistive Glass Ion Guides
Ion Guides and Drift Tubes: FieldMaster TM Resistive Glass Ion Guides and Drift Tubes have demonstrated an improvement in ion transmission when compared to conventional tubes. They can be easily removed or cleaned without degradation in performance. The single-piece, solid tube design provides containment for counter-flow gas, eliminating the need for an additional enclosure. PHOTONIS has developed a series of specialty glass tubes which can be used by analytical instrument designers... (read more)
Browse Mass Spectrometers Datasheets for PHOTONIS Technologies SAS
H.C. Starck Inc. - Fabricated Products Group
Niobium Plate, Sheet, Foil, Tubing, Rod, Wire, Bar
Niobium Plate, Sheet, Foil, Tubing, Rod, Wire, and Bar for the Chemical Processing Industry. H.C. Starck offers NRC (R) niobium metal produced from electron beam melted ingots. Grain Stabilized Niobium (GSNb) is made by EB and VAR melting. Both materials are malleable, weldable, machineable and formable. GSNb is used in applications where a consistently finer grain size is required. GSNb is a patent pending single-phase micro-alloy that has a grain size of approximately 2 ASTM numbers finer... (read more)
Browse Refractory and Reactive Metals Datasheets for H.C. Starck Inc. - Fabricated Products Group
Memory Protection Devices, Inc.
Lowest profile CR2032 battery holder !
reflow soldering. Additionally, the LCP has excellent chemical resistance and can withstand repeated sterilizations by standard methods used in medical device assembly, including gamma and electron beam, ethylene oxide, and hot steam or hot air processes. The LCP used is also halogen-, PFOS-, and PFOA-free, as well as SVHC, REACH, RoHS, and WEEE compliant - meaning that Minis meet global environmental regulations. While the BU2032SM-JJ-MINI-GTR only holds CR2032 batteries, design work has already... (read more)
Browse Battery Holders Datasheets for Memory Protection Devices, Inc.
Conduct Research Top
Effects of Electron Radiation Generated during E-beam Evaporation on a beam Evaporation on a
. However, most of the available resist can be cross linked if. exposed to excessive heat or when bombarded by electrons with. sufficient energies. Cross linked resist will not dissolve. completely in the normal wet strip chemicals and a residue will. result. Although the resist residue can usually
MICRO: Behind the Mask
with a mature electron-beam resist system, and the nature of the defect populations produced by the two CAR candidates is contrasted. The tests described in this article were prompted by the findings of a previous study, which compared ZEP7000, a mature E-beam resist from Zeon (Tokyo), with another
Nanosized resonators show commercial promise
. Here, a tightly focused electron beam cuts a pattern into a chemical film covering a wafer of silicon or a similar substance. Acid then etches away the silicon in places resist has been removed. Cornell uses an alternative method called electrospinning. It forces a liquid polymer through a row
Fabrication of Nano-Structures using EB-Lithography and its Application to Long-Wavelength Quantum-Wire Lasers
It is important to fabricate high density and high uniformity nano-structures for the realization of quantum wire lasers. In this work, 1.5um-wavelength GalnAsP/InP quantum wire lasers were fabricated by electron beam (EB) lithography, and wet chemical etching followed by embedding organic metal
MICRO: SPIE Microlithography
covered in the special sessions are hydrocarbon impurities on the optical surfaces at 157 nm, direct-to-digital holography for wafer defect detection, the effect of a scanned electron beam on an advanced logic device, and SEM inspection of optically invisible defects. The broad-ranging
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Chemistry and Lithography
M.P.C. Watts, “ Electron beam resist systems A critical review of recent development,” Solid State Technol. 27(2), 111 (1984).
Chemical Solution Deposition of Functional Oxide Thin Films
With the exception of few studies, almost all the work on metal oxides as electron beam resists were carried out using free-standing thin films.
Carbon and Oxide Nanostructures
It also presents a review of the applications of fullerene and its deriva- tives as electron beam resists , as well as outlining the effects of catalyst on the morphology of the carbon nanotubes.
McCaord, M.A. and T.H. Newman, Low voltage, high resolution studies of electron beam resist exposure and proximity effect.
Resists for sub-20-nm electron beam lithography with a focus on HSQ: state of the
Applications of this electron beam resist in lithographic techniques other than EBL are also discussed.
Direct-Write Electron Beam Lithography For Integrated Circuits: Submicron Image Reversal Process Of Novolac-Diazo Resist And Its Stability Towards Composite Me...
The sensitivity of AZ1470 defined as the dose necessary to produce a film thickness corresponding to 50% original thickness as a negative electron beam resist was not appreciably increased by a postexposure bake between electron beam exposure and UV flood exposure and …
The most widely used electron beam resist is PMMA which posses advantageous optical properties and is very cost eﬀective.
Electron beam lithography with feedback using in situ self-developed resist
More recently, ice and frozen carbon dioxide were shown to behave as an electron beam resist without the need of a development step [15-18].
Statistics predict that there is a high probability of exposure of the electron beam resist to backscattered electrons in the region around the incident electron beam.
Principles of Lithography
L. F. Thompson and M. J. Bowden, “A new family of positive electron beam resists —poly(oleﬁn sulfones),” J. Electrochem. Soc. 120, 1722–1726 (1973).