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  • Medical Device Link .
    such as smaller size and shorter connection distances that cannot be gained from more-conventional electronic packages. But using advanced packages in high-volume production requires careful planning of production processes to avoid costly interruptions. (See the sidebar "Key Points of the Flip Chip Package
  • Thermal Pad Design and Process for Voiding Control at QFN Assembly (.pdf)
    Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry recently. This package offers a number of benefits including (1) small size, such as a near die size footprint, thin profile, and light weight; (2) easy PCB trace routing due to the use of perimeter I/O
  • Enhanced Imager Chip Packaging for Automotive Applications (.pdf)
    experts. All rights reserved. No part of this publication may be reproduced, stored in a retrieval system, or. transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise,. without the prior written permission of SAE. For permission and licensing requests

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