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Standards and Technical Documents - Embedded Capacitor Technology; Status, Opportunity and Challenges -- MILMKT12-11-EMBCAP
Description: DESCRIPTION "Embedded Capacitor Technology; Status, Opportunity and Challenges" was presented by John Andresakis, vice president of strategic technology, Oak-Mitsui at the IPC Conference for the PCB Industry: Critical Issues for the Military Market, Washington D.C., in December 2011.The author
Supplier: Oak-Mitsui, Inc.
Description: When ultra-thin laminate, low impedance, low inductance and high capacitance are needed, FaradFlex® is the solution! Increase your speed while reducing impedance, power bus noise and EMI. Embed Capacitor Layers inside your PCB or Chip Package
- Type: Rigid
- Embedded Passives (Capacitance / Resistance): Yes
- RF / Microwave Laminate: Yes
- Materials of Construction: Copper Foil / Cladding, Metal Foil / Cladding, Plastic / Polymer
Supplier: Techwell, Inc.
Description: ) Automatic Backup to Battery or Super Cap On-Chip Oscillator Compensation Internal Feedback Resistor and Compensation Capacitors 64 Position Digitally Controlled Trim Capacitor 6 Digital Frequency Adjustment Settings to ±30ppm 512x8-Bits of EEPROM 16-Bytes Page Write Mode (32 total
- Device Type: Real Time Clock
- Bus Interface / Output Type: I2C
Projection Screens - Multiple Image Format Masking Screen (HDTV Native Aspect Ratio) -- Multiple FormatSupplier: Visual Sound, Inc.
Description: are quick reversal type, oiled for life, with automatic thermal overload cutout, integral gears, capacitor, embedded microprocessor control and an electric brake to prevent coasting Preset but adjustable limit switches automatically stop the picture surfaces in the up, down and three intermediate
Supplier: TPL, Inc.
Description: and high dielectric constant with sintering temperatures as low as 1000° C. Various dopants can be used with binary compositions to modify properties for a wide range of ferroelectric applications. The ultra-fine particle size makes the powders ideal for thin ceramic capacitor layers and embedded
- Application: Nanoelectronics, Specialty / Other
- Type: Nano Powder / Particulate
- Material Type: Ceramic / Carbide, Other
Supplier: TPL, Inc.
Description: constant with sintering temperatures as low as 1000° C. Various dopants can be used with binary compositions to modify properties for a wide range of ferroelectric applications. The ultra-fine particle size makes the powders ideal for thin ceramic capacitor layers and embedded polymer/ ceramic
- Piezoelectric / Electrostrictive Type: Barium Titanate (BT)
- Shape / Form: Powder / Grain
- Performance Features: Composite / Ceramic Matrix
- Material Type: Piezoelectric Ceramic
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Embedded Capacitance Material - FaradFlex®
Oak-Mitsui has developed a novel thin substrate, FaradFlex ®, which is the next generation of Embedded Capacitance material. Embedded Capacitance utilizes the technology of putting a capacitor plane inside the PCB to reduce the overall impedance of the power distribution system as well as free up surface real estate and improve system reliability by eliminating many of the discrete capacitors. The FaradFlex ® Line of Capacitor Material includes unfilled, filled... (read more)
Browse Foil Tapes Datasheets for Oak-Mitsui, Inc.
Eliminate Capacitors with Buried Capacitance
enjoying the benefits of Buried Capacitance technology using the FaradFlex line of products contact Oak-Mitsui Technologies. FaradFlex® has been the solution for a number of applications such as network servers, routers and switches, data storage, supercomputers and is expanding in the areas of cell phones, RF modules, automotive and aerospace controls, satellite and antennae systems, and medical devices. Oak Mitsui Technologies offers a full range of FaradFlex® products to fit all of your embedded... (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for Oak-Mitsui, Inc.
NanOxide™ Powder Products
applications. The ultra-fine particle size makes the powders ideal for thin ceramic capacitor layers and embedded polymer/ ceramic laminates. ... (read more)
Browse Ceramic Powders and Precursors Datasheets for TPL, Inc.
Titanate Nano Powders (Barium, Strontium Titanate)
be used with binary compositions to modify properties for a wide range of ferroelectric applications. The ultra-fine particle size makes the powders ideal for thin ceramic capacitor layers and embedded polymer/ ceramic laminates. When introducing NanOxide ™ powders into your process, please keep the following points in mind: The manufacturing process for barium titanate includes a drying step which induces soft agglomeration (roughly 75 micron size particles). These agglomerates are easily... (read more)
Browse Nanomaterials Datasheets for TPL, Inc.
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Embedded Computers in Substation Automation (.pdf)
technology, power substations are becoming more automated and increasingly deploy intelligent devices to monitor and control unmanned facilities. Key factors to establishing successful substation automation systems include faster and more reliable networking solutions such as embedded computers. This white
Temperature Measurement Circuits for Embedded Applications
This application note shows how to select a temperature sensor and conditioning circuit to maximize the measurement accuracy and simplify the interface to the microcontroller. Practical circuits and interface techniques will be provided for embedded applications with thermocouples, Resistive
Skyworks De-embedded Scattering Parameters
. ./5cf798ee-6083-4849-a861-fbbaddbb31b8 White PaPer. Skyworks De-embedded Scattering Parameters. Introduction. An integral part of modern RF/microwave circuit design is. Network. Analyzer. circuit simulation and evaluation in which scattering parameters. (S-parameters) for each element of a system are utilized to pre-. dict
Using Single Supply Operational Amplifiers in Embedded Systems
. These amplifier circuits. were selected with embedded system integration in. V. mind. OUT = VIN. *Bypass Capacitor, 1 µF. The second section uses these fundamental circuits to. build useful amplifier functions in embedded control. FIGURE 1: Buffer amplifier; also called a. applications. voltage follower
Using Single Supply Operational Amplifiers in Embedded Systems
= VIN. first section will list fundamental amplifier applications. *Bypass Capacitor, 1µF. with the design equations included. These amplifier cir-. Figure 1: Buffer Amplifier; also called a voltage. cuits where selected with embedded system integra-. follower. tion in mind. The second section will use
PC/104 Embedded Modules, The New System Components
Standards-based design is the best and most logical approach for embedding a PC into a product. PC/104 Embedded Modules: The New System Components (Whitepaper) PC/104 Embedded Modules. The New System Components. Standards-based design is the best and most logical approach for. embedding a PC
FlexiCapTM - Reducing Mechanical Cracking on PCBs
from 0201 (0.5mm long x 0.25mm wide) to 2225 (5.6mm long x 6.4mm wide). A multilayer ceramic chip capacitor is a small block of ceramic dielectric material with embedded layers of metal. Those electrode layers are connected into a parallel plate structure by 'caps' of metallisation, terminations
Interfacing a Micro Crystal MS1V-T1K 32.768 kHz Tuning Fork Crystal to a PIC16F690/SS
OR. OTHERWISE, RELATED TO THE INFORMATION,. AmpLab, FilterLab, Linear Active Thermistor, Migratable. INCLUDING BUT NOT LIMITED TO ITS CONDITION,. Memory, MXDEV, MXLAB, PS logo, SEEVAL, SmartSensor. QUALITY, PERFORMANCE, MERCHANTABILITY OR. and The Embedded Control Solutions Company are. FITNESS
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Oscillator : Fujitsu Global
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