Page: 1 2 Next

Parts by Number Top

Part # Distributor Manufacturer Product Category Description
456-101-870 ASAP Semiconductor EMC Not Provided DPA REPLICATION ANALYSIS 1TB 41-60TB HIGH DENSITY
456-101-970 ASAP Semiconductor EMC Not Provided DPA REPLICATION ANALYSIS 1TB 601-1KTB HIGH DENSITY

Conduct Research Top

  • New ideas run thermal and emission simulations together
    in electromagnetcompatibilitysimulations. The EMC budget estimates emissions from internal components and provides margin of error protection, typically between 10 and 30 dB. The shielding effectiveness (SE) required is usually plotted against frequency and compared to the SE of the enclosure
  • Investigating Cosite Interference Effects on an Automobile
    altogether. This article demonstrates how a full-wave simulation in CST MICROWAVE STUDIO (R). can be combined with. RF cosite interference analysis in Delcross EMIT to identify and mitigate EMC/EMI problems.
  • Medical Device Link .
    A dc motor offers a service life of 3000 hours continuous duty (sintered bronze bearing version) and produces low noise. The 42-mm-diam unit is rated at a maximum 50-W usable power (at 2000 rpm). It also meets current EMC standards and will meet EN 55011 with the addition of an interference
  • Medical Device Link . A Guide to Selecting Effective Shielding against EMI
    The importance of effective EMI shielding of medical devices continues to escalate, due in large part to two European regulatory requirements that apply to all medical equipment manufacturers that sell products in Europe. The European Union's (EU) Electromagnetic Compatibility (EMC) Directive
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    300-mm pilot line this year Hynix Semiconductor Inc. plans to open a 300mm-wafer pilot line in the fourth quarter of this year with initial production starting one quarter later. Five years ago...Intel to license StrongARM RISC Flomerics set to combine EMC and thermal analysis LONDON -- Flomerics Ltd
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    An upsurge of criminal charges and financial reporting delays stemming from the stock options scandal is putting even more heat on the electronics industry. PCB design survey finds conflict between thermal, SI/EMC Electromagnetic compatibility and signal integrity design requirements for printed circuit
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    Graphics quietly acquired in January, carried a price tag of $5.3 million, according to a regulatory filing. PCB design survey finds conflict between thermal, SI/EMC Electromagnetic compatibility and signal integrity design requirements for printed circuit board design are frequently conflict

More Information Top

Lock Indicates content that may require registration and/or purchase. Powered by IHS Goldfire