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Parts by Number Top

Part # Distributor Manufacturer Product Category Description
CUP ENCAPSULANT MR-138-88 National Microchip Not Provided Not Provided Not Provided
SCL-3/8-0-STK Heilind Electronics, Inc. RAYCHEM / TYCO ELEC Tubing & Insulation Products SEMI RIGID ENCAPSULANT 3/8"ID DUAL WALL 4'LENGTHS
8882-5000C Digi-Key 3M Cables, Wires - Management HIGH GEL REENTERABLE ENCAPSULANT
8882-500C Digi-Key 3M Cables, Wires - Management ENCAPSULANT RE-ENTERABLE 521ML
ER2002RP250G ASAP Semiconductor ELECTROLUBE Not Provided ENCAPSULANT, EPOXY, 250G; Potting Compound Type:Epoxy; Dispensin
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Conduct Research Top

  • Handling Procedures for Syringes of Frozen Underfill Encapsulants
    Recommendations: The follow is recommended for storage and handling of frozen underfill encapsulant syringes. These recommendations should be used as guidelines in handling frozen underfill syringes because each product is unique and the thawing time and process may vary. We recommend trial
  • Epoxy (EP) Resins
    . Depending on the formulation, epoxy resins are used as casting resins, potting agents, resin binders, or laminating resins in fiberglass or composite construction. Epoxy (EP) resins are also used as encapsulants, electrical conductors in microelectronic packaging, and adhesives in structural bonding
  • Manufacturers stay ahead of deadlines for WEEE, RoHS
    an electronics manufacture in Andover, Mass., says all its devices will meet RoHS requirements by the end of this year. Vicor will use components with different lead finishes and encapsulants and lead-free assembly materials and techniques. And once the company has confirmed a family of devices
  • Using Thermally Conductive Materials
    Thermally conductive materials are an effective way to resolve a variety of design and processing challenges. They fall into the categories of adhesives, coatings, films, encapsulants, and greases. The products are differentiated by the degree of thermal conductivity that measures the ability
  • UV Curing Adhesives Shine
    compounds. This diverse group of adhesives, sealants and encapsulants. cures only when activated by a suitable UV light source. As. one-component materials, they don't require labor intensive. weighing or mixing steps. With the exception of special. dual-cure systems, UV curable compounds require no heat
  • New Flame-Retardant Structural Adhesive
    is a fast-setting, clear-drying, general-purpose adhesive/encapsulant for OEM assembly operations such as potting aerospace inserts. As a creamy paste, it is easily dispensed, fills gaps, and bonds metals, glass, ceramics, wood, and concrete. It has a mixed viscosity of 115,000 cps, a working time
  • MICRO:Semicon Southwest '98 - Technical/Business Programs (Oct. '98, p.127)
    Institute FhG/IZM-Berlin Flip-Chip Manufacturing Using Wafer-Applied Multilayer Encapsulants M. Albert Capote, Sherry Zhu, and Ligui Zhou, Aguila Technologies; and R. Wayne Johnson, Auburn University Flux-Free Process for Placement and Attach of Solder Balls to Wafers, Flip Chips, and All BGA Packages
  • | Electronics Industry News for EEs & Engineering Managers
    diode market, including three new LED-protecting encapsulants and a moldable resin. Siano launches chipset for mobile digital TV Mobile digital television (MDTV) chip developer Siano Mobile Silicon will introduce a standard receiver chipset for mobile digital television (MDTV) to the Asian market

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