Encapsulant Electrical Shielding

Description: ; Edge Seals, Fast-Drop ™ Fiber Bend Radius Control Modules for Cable Management, EMI/RFI Shielding and Thermal Management Materials, and a wide selection of collaborative custom designed products.

• Use: Conformal Coating
• Form: Powder, Specialty / Other
• Chemical / Polymer System Type: Epoxy (EP), Polyamide, Polyester (PET), Specialty / Other
• Cure Type / Technology: UV / Radiation Cured (also EB, Light), Specialty / Other

Description: Master Bond Polymer System EP30C is a new, versatile two component nickel modified polymer system featuring high electrical conductivity, superior bonding strength and chemical resistance for EMI/RFI shielding as well as bonding and sealing applications. This electrically highly conductive compound

• Type / Form: Adhesive, Coating / Paint, Encapsulant / Conformal Coating , Sealant / Gap Filling Compound
• Electrically Conductive: Yes
• Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Composites, Metal, Plastic, Porous Surfaces, Rubber / Elastomer, Wood / Wood Product
• Dissimilar Substrates: Yes

Description: Master Bond Polymer System EP11S is a new superior performance and cost effective one component epoxy resin system featuring excellent electrical conductivity for electrical contacts, bonding sealing and coating and combines high physical strength properties with remarkable thermal shock, heat

• Industry: Electronics, Electrical Power / HV
• Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
• Features: Electrically Conductive, EMI / RFI Shielding Material, Filled, Thermal / Heat Conductive
• Material Type: Conformal / Encapsulating Coating, Grease / Paste, Gap Filling Compound, Specialty / Other, Die Bonding Adhesive / Compound

Description: Bonded laminate, copper shield between layers or Sil-Pad

• Compound Type: Electrical Insulation / Dielectric, EMI / RFI Shielding Material, Thermal Compound / Thermally Conductive
• Form / Function: Specialty / Other
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
• Industry Applications: OEM / Industrial

Description: such as exposure to various chemicals and temperature cycling up to 275°F. Adhesion to both similar and dissimilar substrates is excellent. The hardened material is an electrical insulator. Color of part A is black; part B is dark brown. Master Bond Polymer System EP30M3LVR is widely used in the electronic

• Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Composites, Metal, Plastic, Porous Surfaces, Rubber / Elastomer, Wood / Wood Product
• Dissimilar Substrates: Yes
• Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Marine, OEM / Industrial, Semiconductors / IC Packaging, Building / Construction, Tooling / Mold Material, Other
• Chemical / Polymer System Type: Epoxy (EP)

Description: temperature range of -60°F to + 250°F. it bonds well to a wide variety of substrates including metals, glass, ceramics, wood and many plastics. EP30 Medical has exceptionally low liner shrinkage upon cure as well as superb optical clarity. The cured compound is also an outstanding electrical

• Substrate / Material Compatibility: Ceramic / Glass, Composites, Metal, Plastic, Porous Surfaces, Rubber / Elastomer, Wood / Wood Product
• Dissimilar Substrates: Yes
• Chemical / Polymer System Type: Epoxy (EP), Polyurethane (PU, PUR)
• Filled / Reinforced: Yes

Description: . It bonds well to a variety of substrates including metals, glass, ceramics, wood, rubbers, and many plastics. Once cured, EP21FLVSP is an outstanding electrical insulator. This, coupled with its low viscosity, makes it an excellent encapsulating and potting epoxy. EP21FLVSP contains no solvents

• Product Type: Specialty Polymers and Resins
• Technology Type: Film / Laminate, Solid, Two Component System
• Features: Anti-Static / Electrostatic, Electrically Conductive (ESD / EMI Shielding), Electrical Insulation / Dielectric Material, Electrically Nonconductive, EMI / RFI Shielding
• Industry: Aerospace, Automotive, Electronics, Energy / Utilities, OEM / Industrial, Semiconductor, Other