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  • Solving Ultraviolet Curable Potting & Encapsulating Problems With Shadow Cure Technology
    potting compound is poured over the assembly. The term Encapsulation describes a molding or dipping process where there is no case or shell. The assembly is either coated or the compound is poured into a mold and the cured compound becomes the outside of the assembly. The terms Potting and Encapsulating
  • New Urethane Technology for Potting & Encapsulation in Electronics
    Many electronic components and assemblies require a potting compound for protection against moisture, thermal shock, vibration and very low temperatures. Most of the potting & encapsulating compounds available to designers are unable to give adequate protection over a wide temperature range
  • Adhesives hold electric motors together
    that bond structural metal and plastic components; Proform hot melts for bonding engineering plastics, including polyolefins and high-temperature polyamides; and Encap potting and encapsulating compounds to protect electric parts from exposure to chemicals, moisture, and thermal shock. A new acrylic

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