Encapsulating Encapsulant Impregnating Resin

Description: ES® H62 C is a solvent-free, liquid silicone resin which is cured by heat. Special features is a methylphenylvinylhydrogen polysiloxane not modified with organic components; is of very low volatility (suitable for vacuum pressure impregnation); is cured by heat through catalysed

• Use: Encapsulant / Potting Compound, Impregnating Resin
• Material Type / Grade: Elastomer / Rubber
• Chemical / Polymer System Type: Silicone
• Filler Material: Unfilled

Description: Sauereisen Electric Resistor Cement No. 78 is an ideal electrical refractory cement for coating resistors, coils, electric heating elements, furnaces, and embedding resistance wire. It replaces insulating varnish, enamel, mica, etc. The cement is also available in powder form known as Sauereisen

• Use: Die Bonding Adhesive / Compound, Conformal Coating, Encapsulant / Potting Compound, Impregnating Resin
• Material Type: Conformal / Encapsulating Coating, Die Bonding Adhesive / Compound
• Industry: Electronics, Electrical Power / HV
• Features: Electrical Insulation / Dielectric

Description: Master Bond Polymer System EP19HT is a storage stable one component liquid epoxy resin system for durable, high performance adhesive/sealants, impregnants and liners. It features remarkably long shelf life and excellent storage characteristics at ambient temperatures yet cures readily at elevated

• Use: Die Bonding Adhesive / Compound, Conformal Coating, Encapsulant / Potting Compound, Gap Filling Compound, Impregnating Resin
• Substrate / Material Compatibility: Metal, Porous Surfaces
• Industry: Electronics, Electrical Power / HV
• Chemical / Polymer System Type: Specialty / Other, Epoxy (EP)

Description: STYCAST 1217 is an unfilled, low viscosity, general purpose, epoxy encapsulating and impregnating resin. It yields good electrical and physical properties and can be cured with a wide variety of catalysts. Sold as a pack (4/pk).

• Industry Applications: OEM / Industrial
• Chemical / Polymer System Type: Epoxy (EP)
• Composition: Unfilled

Description: RTVS 27 LV is a low viscosity, general purpose, reversion resistant RTV Silicone Compound. RTVS 27 LV finds use in commercial potting/casting application. RTVS 27 LV's one-to-one ratio by weight or volume makes it ideal for dispensing equipment or unskilled labor. With the ability to cure rapidly at

• Use: Conformal Coating, Encapsulant / Potting Compound, Impregnating Resin
• Compound Type: Encapsulating / Potting
• Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, RTV / Room Temperature Curing
• Features: Electrical Insulation / Dielectric Material, Thermal / Heat Insulating

Description: of wire enamel, impregnating resins, potting compounds, casting resins, conformal coatings, adhesives, and specialty epoxy products used in hi-temp applications used for a number of electrical, industrial, automotive, aerospace and civil applications.

• Material Form: Coating, Composite, Dielectric Coating (Encapsulant, Conformal, etc.), Polymer (Plastic / Elastomer), Potting Compound
• Features: Electronics / Semiconductors
• Use: Conformal Coating, Encapsulant / Potting Compound
• Form: Liquid

Description: of wire enamel, impregnating resins, potting compounds, casting resins, conformal coatings, adhesives, and specialty epoxy products used in hi-temp applications used for a number of electrical, industrial, automotive, aerospace and civil applications.

• Material Type / Grade: Thermoset
• Chemical / Polymer System Type: Epoxy
• Filler Material: Mineral
• Resins & Compounds: Liquid

Description: of wire enamel, impregnating resins, potting compounds, casting resins, conformal coatings, adhesives, and specialty epoxy products used in hi-temp applications used for a number of electrical, industrial, automotive, aerospace and civil applications.

• Material Form: Polymer (Plastic / Elastomer), Potting Compound
• Features: Electronics / Semiconductors, Electrical Power / HV
• Compound Type: Encapsulating / Potting
• Dissimilar Substrates: Yes

Description: Master Bond Polymer System UV19 is a newly developed UV curable, low viscosity optically clear compound specifically designed for high performance laminating, sealing, bonding and coating. This remarkable acrylic based polymer composition can effectively replace conventional heat and/or solvent

• Use: Conformal Coating, Encapsulant / Potting Compound, Gap Filling Compound, Impregnating Resin
• Substrate / Material Compatibility: Ceramic / Glass, Metal, Paper / Paperboard, Plastic, Porous Surfaces, Rubber / Elastomer, Wood / Wood Product, Other
• Form: Liquid
• Chemical / Polymer System Type: Rubber Based / Elastomeric

Description: Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500°F with truly outstanding chemical resistance. High strength bonds serviceable up to 600°F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin

• Use: Die Bonding Adhesive / Compound, Conformal Coating, Gap Filling Compound, Impregnating Resin
• Substrate / Material Compatibility: Ceramic / Glass, Composites, Metal, Plastic
• Dissimilar Substrates: Yes
• Chemical / Polymer System Type: Epoxy (EP)