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Epoxy Insulating Laminate

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  • Description: Offer virtually no water absorption Good insulating and electrical properties Excellent dimensional stability Good temperature and chemical resistance
  • Description: Sheldahl Flexbase G1964 products use our proprietary high temperature, RoHS compliant flame retardant, modified epoxy adhesive to bond polyester film and copper foil, creating single sided composites. G1964 laminates are engineered for use in flex ci
    • Type: Film / Flexible Substrate, Rigid
    • Materials of Construction: Copper Foil / Cladding, Metal Foil / Cladding, PET / Polyester, Plastic / Polymer
    • Features: Tested to IPC, Chemical Resistant, Dielectric / Insulating
  • Description: Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The service
    • Compound Type: Electrically Conductive, Electrical Insulation / Dielectric Material
    • Material Form: Die Bonding Adhesive / Compound, Gap Filling Compound
    • Electrical / Electronics Applications: Electrical Power (Coils, Motors), Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
    • Industry Applications: Aerospace, Automotive, OEM / Industrial, Other
  • Description: Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The service
    • Compound Type: Electrically Conductive, Electrical Insulation / Dielectric Material
    • Material Form: Die Bonding Adhesive / Compound, Gap Filling Compound
    • Electrical / Electronics Applications: Electrical Power (Coils, Motors), Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
    • Industry Applications: Aerospace, Automotive, OEM / Industrial, Other
  • Description: Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The service
    • Compound Type: Electrically Conductive, Electrical Insulation / Dielectric Material
    • Material Form: Die Bonding Adhesive / Compound, Gap Filling Compound
    • Electrical / Electronics Applications: Electrical Power (Coils, Motors), Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
    • Industry Applications: Aerospace, Automotive, OEM / Industrial, Other
  • Description: Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The service
    • Compound Type: Electrically Conductive, Electrical Insulation / Dielectric Material
    • Material Form: Die Bonding Adhesive / Compound, Gap Filling Compound
    • Electrical / Electronics Applications: Electrical Power (Coils, Motors), Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
    • Industry Applications: Aerospace, Automotive, OEM / Industrial, Other
  • Description: Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The service
    • Compound Type: Electrically Conductive, Electrical Insulation / Dielectric Material
    • Material Form: Die Bonding Adhesive / Compound, Gap Filling Compound
    • Electrical / Electronics Applications: Electrical Power (Coils, Motors), Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
    • Industry Applications: Aerospace, Automotive, OEM / Industrial, Other
  • Description: Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The service
    • Compound Type: Electrically Conductive, Electrical Insulation / Dielectric Material
    • Material Form: Die Bonding Adhesive / Compound, Gap Filling Compound
    • Electrical / Electronics Applications: Electrical Power (Coils, Motors), Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
    • Industry Applications: Aerospace, Automotive, OEM / Industrial, Other
  • Description: Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The service
    • Compound Type: Electrically Conductive, Electrical Insulation / Dielectric Material
    • Material Form: Die Bonding Adhesive / Compound, Gap Filling Compound
    • Electrical / Electronics Applications: Electrical Power (Coils, Motors), Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
    • Industry Applications: Aerospace, Automotive, OEM / Industrial, Other
  • Description: Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The service
    • Compound Type: Electrically Conductive, Electrical Insulation / Dielectric Material
    • Material Form: Die Bonding Adhesive / Compound, Gap Filling Compound
    • Electrical / Electronics Applications: Electrical Power (Coils, Motors), Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
    • Industry Applications: Aerospace, Automotive, OEM / Industrial, Other
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Conduct Research Top

  • CONAP(R) CE-1170 (.pdf)
    CHARACTERISTICS. CONAP CE-1170 is a high-performance coating specifically. designed as an electrical insulating coating for printed circuitry. and components. The ultimate performance of the cured film is. Appearance. Amber, Slight Haze. dependent on process controls used in application...
  • CONAP(R) CE-1171 (.pdf)
    . Brookfield Viscosity @ 25°C, cps. 900. Specific Gravity @ 25ºC. 0.98. CONAP CE-1171 is a high-performance conformal coating. specifically designed as an electrical insulating coating for printed. Solids Content, %. 30. circuitry and components. The ultimate performance of the. Flashpoint, (Closed Cup), °F...

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