Products & Services
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Supplier: Allied Electronics, Inc.
Description: ADHESIVE EPOXY KIT, 5 10-GRAM PACKS, POLYMIDE 2-PART PASTE
- Chemical / Polymer System Type: Epoxy (EP)
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Supplier: Ellsworth Adhesives
Description: ECCOBOND Paste 99 is a one component heat cured, thixotropic non-sag epoxy adhesive paste; it has excellent thermal conductivity and electrical insulation, good chemical resistance, and a low coefficient of thermal expansion. 15 lb can. Sold as a case (4/case).
- Substrate / Material Compatibility: Ceramic / Glass, Metal
- Industry: OEM / Industrial
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Single Component System
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Supplier: Glotrax Polymers Inc.
Description: Magnobond 6398, Parts A & B is a two component thixotropic paste epoxy system designed for bonding metals and composite structures. Magnobond 6398 has good properties at high and low temperatures using a room temperature cure. Applications include insertion filling, composite repair manfacture
- Substrate / Material Compatibility: Composites, Metal
- Chemical / Polymer System Type: Epoxy (EP)
- Industry: Aerospace, Automotive
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
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Supplier: ACCRAbond, Inc.
Description: INSTAbond® 804 A two component aluminum filled epoxy paste adhesive. Bonds to steel, porcelain, concrete and wood. In addition, it can be sanded, filed or machined to a featheredge without loss of bond strength. It can also be sawed, ground, taped drilled or threaded with conventional tools
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Supplier: Allied Electronics, Inc.
Description: HEAT SHRINK TUBING ADHESIVE, 10 3-GRAM PACKS, EPOXY/POLYMIDE TWO-PART PASTE
- Type: Heat Shrink Tubing
- Sleeving: Shrink Tubing
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Supplier: Materion Corporation
Description: Materion Advanced Chemicals silver-filled epoxy cement contains the optimum ratio of silver powder to epoxy resin. This silver-colored thick paste offers maximum thermal and electrical conductivity and mechanical strength.
- Compound Type: Electrically Conductive
- Material Form: Die Bonding Adhesive / Compound, Specialty / Other
- Cure Type / Technology: Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: R. S. Hughes Company, Inc.
Description: 10 Minute(TM) Epoxy Clear (50ml Dev-Pak(TM)). Flexible, two-component, liquid epoxy paste that provides excellent adhesion to metals such as aluminum, copper, steel, brass, and galvanized steel. It exhibits high peel strength and good adhesion for a variety of bonding applications in the signage
- Cure Type / Technology: Two Component System
- Chemical / Polymer System Type: Epoxy (EP)
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Supplier: Parker Hannifin China
Description: need for precision machining, thermal or high force assembly ?Typical application: bushings, bearings, oil seals, pulleys G Series (Anaerobic Gasketing Compounds) ?A high viscosity liquid or paste flange or threaded tube application, working like a liquid gasket eliminating sealing elements
- Chemical / Polymer System Type: Epoxy (EP)
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Description: INSULBOND 839 is a thixotropic paste epoxy adhesive with adjustable flexibility. INSULBOND 839 can be cured at room temperature or at elevated temperatures. The INSULBOND 839 flexibility is determined by the amount of Part B used. INSULBOND 839 exhibits a good mechanical bond, peel strength
- Substrate / Material Compatibility: Ceramic / Glass, Composites, Metal, Plastic, Wood / Wood Product, Other
- Chemical / Polymer System Type: Epoxy (EP)
- Features: Flexible / Dampening
- Industry: Aerospace, Automotive, Electronics, Military / Government (MIL-SPEC / GG), OEM / Industrial, Building / Construction, Other
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Description: General Polymers 3561V EPOXY COVE PASTE is a high solids, two component thixotropic binder resins for forming coves and troweled vertical mortars. This material, when mixed with the proper aggregates, will trowel easily on primed vertical surfaces at 1/16" -1/8" without sagging. RECOMMENDED USAGE
- Chemistry: Epoxy, Resin Base / Polymer Binder, Other
- Substrate / Surface: Concrete / Masonry
- Technology: Multicomponent
- Form: Paste / Mastic
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Supplier: OMEGA Engineering, Inc.
Description: OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper products
- Material Form: Polymer (Plastic / Elastomer)
- Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Metal, Paper / Paperboard, Plastic, Rubber / Elastomer, Wood / Wood Product
- Cure Type / Technology: Two Component System
- Features: Electrical Insulating / Dielectric, Thermal / Heat Conductive
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Supplier: 3M Industrial Adhesives & Tapes Canada
Description: 3M™ Scotch-Weld™ Epoxy Adhesive 2214 Non-Metallic is a heat curing paste epoxy adhesive with higher dialectic strength. High strength bonds are obtainable with many metals, glass and some plastic. Cures in 40 minutes at 250 Degrees F/121 Degrees C. Non-metallic filled Higher
- Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic
- Industry: Electronics, Military / Government (MIL-SPEC / GG), OEM / Industrial, Building / Construction
- Chemical / Polymer System Type: Epoxy (EP)
- Form: Grease / Paste
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Supplier: RS Industrial, Inc.
Description: Structural Adhesives A structural adhesive bond can be formed with a variety of polymer types, depending on the required end use. The common characteristic of all structural adhesives is that they are applied as a liquid or paste form, then cure to form permanent (irreversible) chemical bonds
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Supplier: Epoxy Technology
Description: Thermal type, thermal conductivity, oven cure method
- Substrate / Material Compatibility: Metal, Plastic
- Industry: Electronics
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Thermal / Heat Conductive
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Supplier: Epoxy Technology
Description: EPO-TEK® E4110 is an electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80°C, although other heat cures can be used.
- Chemical / Polymer System Type: Epoxy
- Chemical / Polymer System Type: Epoxy
- Material Type / Grade: Thermoset
- Filler Material: Metal
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Supplier: SAE International
Description: Adhesive, Epoxy Paste, for Structural Weldbond, for 80Mdc (180Mdf) Service Product Code: AMS3708 Date Published: 1987-01-01 - A newer version of this standard is available. Scope This specification has been "CANCELLED" by the Aerospace Materials Division, SAE, as of October 1995.
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Supplier: Koford Engineering, LLC
Description: E-114 is a low cure temperature, non sag high performance filled single component epoxy adhesive whichcan be cured at 100°C or 120°C to provide good shear strength in combination with good temperatureresistance. Especially suitable for assembley applications such as building precisionelectric
- Substrate / Material Compatibility: Metal
- Industry: Electronics
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
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Supplier: Indium Corporation
Description: Epoxy fluxes are often used in no-clean SMT component attach applications. The solder bumps on wafer level CSP, micro BGA or BGA packages are dipped in epoxy fluxes, or the flux is applied to the substrate via a jetting process. The assembly is then reflowed, and the epoxy flux acts to both clean
- Form / Shape: Paste
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Ellsworth Adhesives
Description: ECCOBOND 281 is a one component, highly filled, thixotropic paste epoxy adhesive. It will bond to a wide variety of materials such as metals, glass and plastics. ECCOBOND 281 has good chemical resistance, good electrical insulation properties, high thermal conductivity and low coefficient
- Industry: Electronics, OEM / Industrial
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Filled
- Cure Type / Technology: Single Component System
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Description: ArmorSeal®CRACK FILLER is a two-component, fast set epoxy paste developed specifically for sealing, smoothing, and fairing applications on concrete, metals, plastics (FRP), wood, or masonry. The smooth consistency and excellent non-sagging properties allow the product to be used on vertical
- Substrate / Material Compatibility: Concrete / Masonry, Metal, Plastic, Wood / Wood Product
- Industry: OEM / Industrial, Other
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: NanoAndMore USA Corp.
Description: measurements. Measure tip resistance with simple Wheatstone bridge or apply apply an A.C. signal and use lock in detector. Electrical connection is made to two Au pads on the probes base by either wire bonding, conducting epoxy/paste or mechanical clips. Other applications include applying
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Supplier: Protavic America, Inc.
Description: Filled epoxy system. Excellent chemical and heat resistance. Excellent for stencil and screen bonding due to its high strength fast cure at low temperatures.
- Use: Die Bonding Adhesive / Compound
- Form: Grease / Paste
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking
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Supplier: Henkel Corporation - Electronics
Description: For bonding temperature sensitive components
- Compound Type: Electrically Conductive
- Material Form: Die Bonding Adhesive / Compound, Grease / Paste
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Atlas Minerals and Chemicals, Inc.
Description: Color: Brown (2.5 oz. Package)
- Substrate / Material Compatibility: Wood / Wood Product
- Industry: Building / Construction
- Cure Type / Technology: Two Component System
- Features: Grease / Paste, Leveling / Filling Compound
Find Suppliers by Category Top
Featured Products for Epoxy Paste Top
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Master Bond, Inc.
High Temperature Resistant Epoxy
Well suited for applications involving thermal cycling, Master Bond Supreme 11AOHT has high shear and peel strength. It bonds well to both similar and dissimilar substrates. This toughened compound has exceptional adhesion to most metals, ceramics, glass and most rubbers and plastics. Bonds are resistant to water, oil and most organic solvents. Supreme 11AOHT has a thermal conductivity of 10 BTU/in/ft²/hr/°F. It has a dielectric strength of >400 volts/mil. It also exhibits a T-peel aluminum... (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
Master Bond, Inc.
Snap Cure Epoxy Is Chemically Resistant
which is ideal for bonding dissimilar substrates and applications subject to thermal cycling. Each product comes in half pints, pints, quarts, gallons and 5 gallon container sizes. Master Bond's EP17HT-3 one part snap curing epoxy features high temperature resistance and has outstanding electrical properties and chemical resistance. Read more about Master Bond's one part epoxy formulations at http://www.masterbond.com/lp/tabs/tp_byt_1ptepoxy.html, or contact Master Bond's Technical Support Team... (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
ELANTAS PDG, Inc.
Epoxylite® Hi Temp Epoxy Systems
remaining serviceable to 315 °C (600 °F) or higher for short periods. Hi Temp Epoxies are uniquely suited for applications requiring resistance to chemical attack at elevated temperatures including exposure to boiling acid, alkali and solvents. Only the strongest concentrations of acids, such as bright dip at elevated temperatures will soften the material. They provide superior radiation resistance and low outgassing characteristics. These Epoxylite ® Hi Temp Epoxy Systems have since found... (read more)
Browse Epoxy Adhesives Datasheets for ELANTAS PDG, Inc. -
ACCRAbond, Inc.
INSTAbond® A894
INSTAbond®A894 is a two component; ambient cure epoxy compound designed for structural aerospace metal to metal bonding applications, in particular, aircraft grade aluminum substrates (2024 and 7075) and titanium. Designed after the requirements of MMM-A-132 and MMM-A-134 military specifications, INSTAbond® A894 features exceptional solvent resistance and high temperature performance at 177°C (350°F) and above. It's thixotropic, paste-like viscosity yields good sag resistance for vertical... (read more)
Browse Epoxy Adhesives Datasheets for ACCRAbond, Inc. -
Master Bond, Inc.
Room Temp Curing Epoxy Serviceable Up To 400°F
for use in vacuum environments. Master Bond EP21TCHT-1 is durable and possesses high physical strength properties. Adhesion to metals, ceramics, woods, vulcanized rubbers and most plastics is excellent. Bonds are resistant to water, fuels and most organic solvents. EP21TCHT-1 has a mix ratio of 100 to 60 by weight. It has a light paste viscosity and is easy to apply. (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
Master Bond, Inc.
Vertical Bonding Medical Adhesive
Master Bond's newly developed EP42HT ‑2ND2 has a paste like consistency and facilitates the adhesive's application when bonding vertical surfaces. This no-run two part epoxy fully complies with the testing requirements for USP Class VI biocompatibility. EP42HT ‑2ND2 cures readily at ambient temperatures and exhibits superior thermal stability for service up to 450°F. It forms high strength bonds that are unaffected by sterilization processes such as radiation, ethylene oxide... (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
RS Industrial, Inc.
Adhesion Science Structural Adhesives
strength, the assure maximum performance in assemblies that see stress, shock, and impact. Strong, durable bonds are their trademark, even when faced with severe environmental conditions. A two-part epoxy, as its name implies, consists of a body of resin mixed with a catalyst or hardener to form a tough waterproof bond. In general, epoxies are known for their excellent adhesion, chemical and heat resistance, good-to-excellent mechanical properties and very good electrical insulating properties... (read more)
Browse Epoxy Adhesives Datasheets for RS Industrial, Inc.
Parts by Number for Epoxy Paste Top
| Part # | Distributor | Manufacturer | Product Category | Description |
|---|---|---|---|---|
| S1125-KIT-8 | Allied Electronics, Inc. | TYCO ELECTRONICS RAYCHEM | Not Provided | ADHESIVE EPOXY KIT, 50-ML DUAL SYRINGE, POLYMIDE 2-PART PASTE |
| S1009-KIT-A | Allied Electronics, Inc. | TYCO ELECTRONICS RAYCHEM | Not Provided | HEAT SHRINK TUBING ADHESIVE, 10 3-GRAM PACKS, EPOXY/POLYMERCAPTAN TWO-PART PASTE |
| S1006-KIT-A | Allied Electronics, Inc. | TYCO ELECTRONICS RAYCHEM | Not Provided | HEAT SHRINK TUBING ADHESIVE, 10 3-GRAM PACKS, EPOXY/POLYMIDE TWO-PART PASTE |
Conduct Research Top
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B-stage Epoxy
liquids and pastes. Most pastes. can be easily patterned directly onto the electronic parts, comparable to diced films. and tapes. Deposition Method. General Considerations of B-stage Epoxies: for B-stage Epoxy. · The epoxy is typically applied onto one surface only. Its appearance is similar
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Epoxy Adhesive Applications Guide
This guide is an educational tool designed to assist adhesive users in. gaining a more thorough understanding of adhesive properties and testing. ./afc7bed6-1b87-493d-a312-051c5abbc1dc www.epotek.com. epoxy Adhesive. Application Guide. This guide is an educational tool designed to assist
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Humidity and Solder Paste - Avoid Issues
Gallium. Cored Solder. Cored Solder Wire. Cored Wire Solder. Die Attach. Dipping Flux. Dipping Paste. Epoxy Flux. Flux. Flux Cleaning. Flux Cored Solder. Flux in Soldering. Flux Pen. Fusible Alloy. Gallium Alloy. Gold Indium. Gold Tin. Graping. Halogen Free. Hand Soldering. Head In Pillow. Heat
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Wafer & Substrate Bumping with Solder Paste
Ribbon. BtoB Marcom. Burn In. Bus Ribbon. Chip Attach. CIG. Clad Preforms. Connected Preform. Copper Indium Gallium. Cored Solder. Cored Solder Wire. Cored Wire Solder. Die Attach. Dipping Flux. Dipping Paste. Epoxy Flux. Flux. Flux Cleaning. Flux Cored Solder. Flux in Soldering. Flux Pen. Fusible
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Screen Printable Polymers for Wafer Level Packaging: A Technology Assessment (.pdf)
coating techniques are. and paper products. Modern screens consist of an. summarized below. interwoven mesh of thin stainless steel wire that supports. a photo-imaged emulsion layer. Openings within the. Screen-Print Advantages: emulsion layer enable various inks and epoxy pastes to be. 1. Fewer
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Rheology Benefits for Blending and Extrusion
Rheology is the science that studies the deformation and flow of materials, whether in liquid, melt, or solid form, in terms of the material's elasticity and viscosity. We test the following: liquids, pastes, gels, polymers, plastics, elastomers, epoxy, composites, adhesives, fillers, additives
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Solder Powder: IPC
Responsibility. Company News. Corporate Awards. ISO and ITAR. Trade Shows. Corporate Literature. Bloggers. Facilities. Contact Us. Products. Flux and Epoxy. Ball-Attach Flux. Epoxy Flux. Flip-Chip Flux. Flux Pens. Flux-Cored Wire. Industrial Flux. Liquid Tabbing Flux. Package-on-Package Flux. Tacky Flux
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No-Clean Flux Residue and Underfill Compatibility Effects on Electrical Reliability
were cleaned. Figure 2. Folded RF Shield. 750 mils and greater. This encapsulant. with isopropyl alcohol before being used. exhibits excellent adhesion to organic. Figures 1 and 2 are photographs of the. substrates. RF shields that were used. 4) Underfill D is a reworkable epoxy. Figure 3 shows
Engineering Web Search: Epoxy Paste Top
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Paste Industrial Coatings Datasheets
Form: Paste Chemistry: Epoxy; Resin Type: Coating; Primer; Base Coat; Paint; High Temperature
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Grease / Paste Industrial Sealants Datasheets
Home > Datasheets > Industrial Sealants > Grease / Paste
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Indium Corporation Global Solder Supplier Electronics Assembly...
Select Product Flux and Epoxy Inorganic Compounds Metals NanoFoil® Reclaim and Recycle Solar Assembly Materials Solder Paste and Powders Solders
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470 E. BONITA AVE. POMONA, CA 91767 (909) 625-0056 FAX (909)...
625-0082 WWW.SILPAK.COM Adhesive and Sculpting EPOXY PUTTY PASTE Product Data Sheet EPOXY PUTTY PASTE was developed to fill voids, bond, seal, and
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Epoxy Paste Pigments - System Three Resins, Inc.
Epoxy Paste Pigments Safety Supplies Trial Kits Epoxy Paste Pigments Clear epoxy adhesives and coatings can be colored easily.
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Bostik Australia : Construction & Trade - Catalogue - Patchfix...
Patchfix Epoxy Paste Product: 139 / 189 Technical Data Sheet Patchfix Epoxy Paste Part B MSDS Patchfix Epoxy Paste Part A MSDS
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Low-density epoxy tooling paste...
Low-density epoxy tooling paste SP-High Modulus the marine business of Gurit, has announced the launch of low
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SPECIMEN PREPARATION for SCANNING ELECTRON MICROSCOPY1 Paul E....
Figure 2 shows that, for a 28-day hardened cement paste microstructure, demonstrates that polishing yields clear definition of the constituents: the
