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Parts by Number for Epoxy Paste Top

Part # Distributor Manufacturer Product Category Description
S1125-KIT-8 Allied Electronics, Inc. TYCO ELECTRONICS RAYCHEM Not Provided ADHESIVE EPOXY KIT, 50-ML DUAL SYRINGE, POLYMIDE 2-PART PASTE
S1009-KIT-A Allied Electronics, Inc. TYCO ELECTRONICS RAYCHEM Not Provided HEAT SHRINK TUBING ADHESIVE, 10 3-GRAM PACKS, EPOXY/POLYMERCAPTAN TWO-PART PASTE
S1006-KIT-A Allied Electronics, Inc. TYCO ELECTRONICS RAYCHEM Not Provided HEAT SHRINK TUBING ADHESIVE, 10 3-GRAM PACKS, EPOXY/POLYMIDE TWO-PART PASTE

Conduct Research Top

  • B-stage Epoxy
    in various forms including liquids and pastes. Most pastes. can be easily patterned directly onto the electronic parts, comparable to diced films. and tapes. Deposition Method. General Considerations of B-stage Epoxies: for B-stage Epoxy. • The epoxy is typically applied onto one surface only. Its
  • Humidity and Solder Paste - Avoid Issues
    . Copper Indium Gallium. Cored Solder. Cored Solder Wire. Cored Wire Solder. Die Attach. Dipping Flux. Dipping Paste. Epoxy Flux. Flux. Flux Cleaning. Flux Cored Solder. Flux in Soldering. Flux Pen. Fusible Alloy. Gallium Alloy. Gold Indium. Gold Tin. Graping. Halogen Free. Hand Soldering. Head In Pillow
  • Rheology Benefits for Blending and Extrusion
    Rheology is the science that studies the deformation and flow of materials, whether in liquid, melt, or solid form, in terms of the material's elasticity and viscosity. We test the following: liquids, pastes, gels, polymers, plastics, elastomers, epoxy, composites, adhesives, fillers, additives
  • Medical Device Link . SPOTLIGHT ON ADHESIVES
    circuits, flat cables, and wave guides, as well as RF and EMI shielding. Tra-Duct 2902 is a two-part paste formulation made of refined pure silver and epoxy resin components free of any copper or carbon additives. The adhesives develop strong electrically conductive coatings and bonds between dissimilar
  • Medical Device Link .
    dispenses low-viscosity epoxy liquids to high-viscosity pastes into cartridges from 4 to 400 ml with ratios of 1:1 through 10:1. Labeling options include bar codes, corporate logos, caution warnings, instructions for use, material content, and serial numbers. Tooling Technology Enhances In-Line
  • Solder Powder: IPC
    . Corporate. About Us. Social Responsibility. Company News. Corporate Awards. ISO and ITAR. Trade Shows. Corporate Literature. Bloggers. Social Media. Facilities. Contact Us. Products. Flux and Epoxy. Ball-Attach Flux. Epoxy Flux. Flip-Chip Flux. Flux Pens. Flux-Cored Wire. Industrial Flux. Liquid Tabbing
  • No-Clean Flux Residue and Underfill Compatibility Effects on Electrical Reliability
    were cleaned. Figure 2. Folded RF Shield. 750 mils and greater. This encapsulant. with isopropyl alcohol before being used. exhibits excellent adhesion to organic. Figures 1 and 2 are photographs of the. substrates. RF shields that were used. 4) Underfill D is a reworkable epoxy. Figure 3 shows
  • Medical Device Link .
    compound is a paste that can be applied without sagging or dripping, even on vertical surfaces. Its mixing ratio is a convenient 1:1 by weight or volume. Exhibiting high shear and peel strength (1600 psi and 15 pli, respectively, aluminium to aluminium), the epoxy produces bonds that are resistant