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  • Epoxy
    Epoxy polymers are cured to form thermoset resins by either homopolymerization of epoxy groups with themselves, or reaction with curing agents such as anhydrides, amines, and novolacs. Because the curing agent contributes significantly to the cured properties of the resin, this is called
  • Computational Studies of Crosslinked Epoxy Resins
    BHP Steel Research Laboratories, Port Kembla, Australia Scientists at BHP Steel Research Laboratories and RMIT University have used Accelrys' Amorphous Cell and PCFF force-field to model and predict crosslink density and sites in epoxy resins, and also estimate barrier and adhesion properties
  • Tech Tip 7 - Epoxy Crystallization
    properties of epoxy resin.
  • Tech Tip 18 - Understanding Optical Properties for Epoxy Applications
    Optical or unfilled epoxy adhesives are commonly used for adhering various substrates, encapsulating components and providing protective coatings in several optical applications. They are found in optoelectronic devices for telecommunications, avionics, satellites as well as scientific and medical
  • Filled UV Curable Epoxy Provides Low CTE For Electronic Potting and Encapsulating
    , glob-tops, coatings, and bonding. Potting is a process where epoxy is poured on top of a circuit board and allowed to cure. This process "encapsulates" the components of the board, protecting them from unwanted damage. Glob-top is a process where epoxy is selectively dispensed onto a vulnerable
  • Advanced Boron Nitride Epoxy Formulations Excel in Thermal Management Applications (.pdf)
    Epoxy based adhesives are prevalent interface materials for all levels of electronic packaging. One reason for their widespread success is their ability to accept fillers. Fillers allow the adhesive formulator to tailor the electrical and thermal properties of a given epoxy. Silver flake allow
  • Epoxy Adhesive Applications Guide
    This guide is an educational tool designed to assist adhesive users in. gaining a more thorough understanding of adhesive properties and testing.
  • Epoxies for OptoElectronic Packaging: Applications and Material Properties (.pdf)
    micro-electronic grade joining materials will be used. For LEDs, the silver epoxy is needed for both electrical and thermal properties. Optically clear epoxy is used for the potting, molding, or encapsulation of the LED. In LCDs, there are many different applications of epoxy of which 2 are presented.

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