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  • Epoxy
    Epoxy polymers are cured to form thermoset resins by either homopolymerization of epoxy groups with themselves, or reaction with curing agents such as anhydrides, amines, and novolacs. Because the curing agent contributes significantly to the cured properties of the resin, this is called
  • Epoxy and Silicone Interactions
    Epoxy adhesives are a great choice for many applications for their excellent adhesion,. chemical and temperature resistance, as well as many other attributes. When selecting an epoxy for a specific application, it is important to consider any potential negative. interactions from alternative
  • B-stage Epoxy
    B-staged epoxy resin is a descriptive term used to define a one component epoxy system,. using a latent (low reactivity) curing agent. This unique product can be partially cured. (sometimes referred to as "pre-dried"), as an initial stage after being applied onto one. substrate/surface. It can
  • Using Mold Release Agents with Epoxy Adhesives
    . • Micro-molded camera lens optics directly molded onto CCD/CMOS. or glass wafers, using the de-wetting properties contributed from. Epoxy. silicone molds. • Medical implants such as molding around titanium venal access ports. Substrate. or molding a feed-through wire into a pacemaker hermetic case. Molded
  • Understanding Optical Properties for Epoxy Applications
    Optical or unfilled epoxy adhesives are commonly used for adhering various substrates,. encapsulating components and providing protective coatings in several optical. applications.
  • Computational Studies of Crosslinked Epoxy Resins
    BHP Steel Research Laboratories, Port Kembla, Australia Scientists at BHP Steel Research Laboratories and RMIT University have used Accelrys' Amorphous Cell and PCFF force-field to model and predict crosslink density and sites in epoxy resins, and also estimate barrier and adhesion properties
  • Filled UV Curable Epoxy Provides Low CTE For Electronic Potting and Encapsulating
    , glob-tops, coatings, and bonding. Potting is a process where epoxy is poured on top of a circuit board and allowed to cure. This process "encapsulates" the components of the board, protecting them from unwanted damage. Glob-top is a process where epoxy is selectively dispensed onto a vulnerable
  • Advanced Boron Nitride Epoxy Formulations Excel in Thermal Management Applications (.pdf)
    Epoxy based adhesives are prevalent interface materials for all levels of electronic packaging. One reason for their widespread success is their ability to accept fillers. Fillers allow the adhesive formulator to tailor the electrical and thermal properties of a given epoxy. Silver flake allow

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  • Handbook of Paint and Coating Raw Materials Volume 1 and 2
    ...BYK-Chemie USA] Chem. Descrip.: Polymer in alkylbenzene/methoxypropylacetate (12/1), silicone-free Uses: Defoamer for solv.-based and solv.-free systems, protective coatings, can/coil coatings, industrial coatings, esp. wood/furniture coatings based on glossy polyesters, paraffin-polyesters, UV-curing polyesters, and epoxies Properties : Dens.
  • Handbook of PLASTIC AND RUBBER ADDITIVES Volume 1 and 2
    resistors, circuit boards, etc.) with no deterioration in elec. props.; features good mech. str., elec. props., hydrolytic stability, flammability; suitable for styrenics, epoxies Properties : Amber powd.; readily dissolved in chloroform, chlorobenzene, trichloroethylene, benzene, styrene monomer, toluene, tetrahydrofuran, 1,1,2-trichloroethane; sp...
  • Handbook of Lubricants
    ...C12-15 alkyloxypropylamine CAS 68610-26-4 UN 2735 Uses: Corrosion inhibitor for metalworking fluids; antistat; flotation collector; additive for fuel, lubricant, petrol. refining; intermediate for surfactants, textile foamers, ethoxylates and agric. chem.; crosslinking agent for epoxies Properties : Gardner 5 max. cl...
  • Handbook of Fillers, Extenders, and Diluents
    ...do not store above 70 F Kenplast® PG [Kenrich Petrochems. http://www.westnet.com/~kpiemm/] Chem. Descrip.: Phenyl glycol ether See Phenoxyethanol CAS 122-99-6; EINECS/ELINCS 204-589-7 Uses: Plasticizer; nonreactive diluent and flexibilizer for epoxies Properties : Gardner 3 liq.; sp...
  • Handbook of Corrosion Inhibitors
    ...C12-15 alkyloxypropylamine CAS 68610-26-4 UN 2735 Uses: Corrosion inhibitor for metalworking fluids; antistat; flotation collector; additive for fuel, lubricant, petrol. refining; intermediate for surfactants, textile foamers, ethoxylates and agric. chem.; crosslinking agent for epoxies Properties : Gardner 5 max. cl...
  • http://dspace.mit.edu/bitstream/handle/1721.1/42815/42213528.pdf?sequence=1
    unaffected by temperature, but the epoxy properties changed with temperature, .
  • Long-Term Durability of Polymeric Matrix Composites
    [12, 13] while the other properties are estimated based on typical graphite/ epoxy properties .
  • Advances in FRP Composites in Civil Engineering
    Table 2 TYFO® T- High Temperature Resistant Epoxy PROPERTY .