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Supplier: Allied Electronics, Inc.
Description: reliability of electronic components is a factor. 3M™ Scotch-Weld™ epoxy adhesive DP190 gray is a 1:1 by volume mix ratio of 3M™ Scotch-Weld™ epoxy adhesive 2216 B⁄A gray and exhibits good peel, shear and environmental aging properties.
- Chemical / Polymer System Type: Epoxy (EP)
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Description: INSULCAST 10-148 is a semi-flexible epoxy compound displaying the best thermal shock resistance currently available in an epoxy compound as well as excellent electrical properties over a wire range of temperatures. It makes use of the latest polymer and filler technology to give the maximum thermal
- Chemical / Polymer System Type: Epoxy (EP)
- Features: Flexible / Dampening
- Industry: Electronics, OEM / Industrial
- Form: Grease / Paste
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Description: and enhancing dielectric properties with additional epoxy topcoats.This may be used in immersion service with recommended topcoats. Corrosion resistant Provides dielectric properties when used within an epoxy coating system Contains high molecular weight epoxies Contains hygroscopic solvent system
- Chemistry: Epoxy, Resin Base / Polymer Binder
- Substrate / Surface: Aluminum, Other
- Technology: Thermoset
- Form: Liquid
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Supplier: Protavic America, Inc.
Description: Two part Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the assembly ofnon heat cure products and can be used for repair work in the field. It also has a convenient 1:1 mix ratio.
- Use: Die Bonding Adhesive / Compound
- Form: Gel
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking
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Supplier: Glotrax Polymers Inc.
Description: Magnobond 6398, Parts A & B is a two component thixotropic paste epoxy system designed for bonding metals and composite structures. Magnobond 6398 has good properties at high and low temperatures using a room temperature cure. Applications include insertion filling, composite repair manfacture
- Substrate / Material Compatibility: Composites, Metal
- Industry: Aerospace, Automotive
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Chemical / Polymer System Type: Epoxy (EP)
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Supplier: CoorsTek
Description: and moisture resistant. Optimal properties are obtained with a cure cycle of two hours at 160° C. ES-923 is designed for applications requiring a rapid epoxy cure cycle (10 minutes at 160° C). This accelerated seal cycle results in only a modest reduction in moisture resistance and seal
- Applications: Electrical / HV Parts, Wear Parts / Tooling
- Shape / Form: Fabricated / Custom Shape
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Supplier: RS Industrial, Inc.
Description: , and impact. Strong, durable bonds are their trademark, even when faced with severe environmental conditions. A two-part epoxy, as its name implies, consists of a body of resin mixed with a catalyst or hardener to form a tough waterproof bond. In general, epoxies are known for their excellent
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP3RRLV is a one component, low viscosity tough epoxy for high performance potting, encapsulation and underfill applications featuring rapid curing at temperatures as low as 220-250°F. This unique formulation offers high physical strength properties, good thermal
- Coating Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Single Component System, Specialty / Other
- Industry Applications: Electronics (PCB / SMT Assembly), Automotive, OEM / Industrial
- Chemical / Polymer System Type: Epoxy (EP)
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Supplier: Ellsworth Adhesives
Description: CONAPOXY FR-1274 is a two-component, low exotherm, flame retardant, long pot life epoxy potting and casting system with excellent handling properties.
- Applications: Electronics / Semiconductors, Other
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Description: General Polymers 3479 WATER-BASED EPOXY FLOOR AND WALL COATING produces a low gloss, tough and cleanable finish. 3479 WATER-BASED EPOXY FLOOR AND WALL COATING has excellent hiding properties and provides a quick turnaround, economical two coat system. Its low odor and quick recoat window allows
- Chemistry: Epoxy, Resin Base / Polymer Binder, Water Based
- Type: Coating
- Technology: Multicomponent
- Substrate / Surface: Concrete / Masonry
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Supplier: Ellsworth Adhesives
Description: Thixotropic/non-migrating gel adhesive with excellent gap-filling properties. Bonding metal, ceramic, wood and vertical surface where gap-filling is needed. Bonding metal, ceramic, wood and vertical surface where gap-filling is needed.
- Industry: OEM / Industrial
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Air Setting / Film Drying
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Supplier: R. S. Hughes Company, Inc.
Description: Diversified Brands SB-6-665 RED EPOXY INSULATING ENAMEL; Red Epoxy Insulating Enamel. Ideal for coating end turns on electrical windings exposed to extreme moisture and corrosive conditions. Features: Outstanding chemical-resistance properties; Equipped with EZ TOUCH(R) FANSPRAY(R) Nozzle
- Chemistry: Epoxy
- Type: Enamel Paint
- Features: Corrosion Inhibiting / Rust Preventive
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Description: INSULCAST 985 FR is a semi-flexible flame retardant epoxy compound displaying the best thermal shock resistance currently available in an epoxy compound, as well as excellent electrical properties over a wide range of temperatures. INSULCAST 985 FR makes use of the latest polymer and filler
- Material Form: Coating, Dielectric Coating (Encapsulant, Conformal, etc.), Grease / Gel, Polymer (Plastic / Elastomer), Potting Compound
- Features: Electronics / Semiconductors, Electrical Power / HV, UL Approved
- Coating Type: Electrical Insulation / Dielectric, Thermal / Heat Insulating
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: BJB Enterprises, Inc.
Description: TC-1606 is a very low viscosity, black epoxy-potting compound. It has a long work life, excellent bubble release properties and can be injected through a small diameter tube such as a hypodermic needle. Thermal shock resistance is another advantage of TC-1606
- Material Type / Grade: Elastomer / Rubber
- Chemical / Polymer System Type: Polyurethane
- Filler Material: Unfilled
- Industry: Aerospace, Automotive, Marine, Industrial, Building / Construction, Tooling / Molds
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Supplier: Redwood Plastics
Description: Offer virtually no water absorption Good insulating and electrical properties Excellent dimensional stability Good temperature and chemical resistance
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Supplier: Sauereisen, Inc.
Description: ConducTop SL No. 1313 is a seamless, self-leveling epoxy monolithic that provides a conductive or dissipative flooring system for concrete, vinyl tile and similar surfaces. ConducTop SL exhibits an extremely durable, high-gloss finish that maintains its electrical properties.
- Chemistry: Epoxy, Resin Base / Polymer Binder
- Product Type: Industrial Coating
- Technology Type: Air Setting / Film Drying, Two Component System
- Features: Anti-Static / Electrostatic, Chemical Resistant, Electrically Conductive (ESD / EMI Shielding)
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Conductive Compounds - Emerson & Cuming Stycast Conductive Epoxy 2850FT Blue 60lb -- 2850FT BLU 60LBSupplier: Ellsworth Adhesives
Description: Stycast 2850 FT is a two component, thermally conductive epoxy encapsulant that can be used with a variety of catalysts. It features a low coefficient of thermal expansion and excellent electrical insulative properties.
- Compound Type: Thermally Conductive
- Cure Type / Technology: Two Component System
- Industry Applications: OEM / Industrial
- Chemical / Polymer System Type: Epoxy (EP)
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Supplier: Ellsworth Adhesives
Description: Dynaloy epoxy adhesive is a two component pure silver filled epoxies, which combine the excellent adhesive properties of the epoxies with electrical conductivity of pure silver.
- Type: Cleaner / Cleaning Agent
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Supplier: Andover Corporation
Description: Fuller Epolite FH-5313 is a 100% solid, room temperature curing, electrical grade, epoxy adhesive that has proven to be an excellent bonding agent for ferrite pot cures. This system is designed for continuous operation at temperatures up to 200°F and is available in premeasured kits. USES
- Industry: Optical Grade / Material, Photonics / Optoelectronics
- Cure Type / Technology: Two Component System, Room Temperature Curing
- Features: Encapsulating / Potting
- Form / Function: Encapsulant / Potting Compound
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Supplier: R. S. Hughes Company, Inc.
Description: Loctite(R) D609(TM) Hysol(R) Epoxy Adhesive; 50ML. Loctite(R) D609(TM) Hysol(R) Epoxy Adhesive is a fast setting, clear, medium viscsoity adhesive with excellent insulative properties and chemical resistance to vapors, gasses, petroleum fuels, water, salt solutions, and galvanic action.
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Supplier: Ellsworth Adhesives
Description: CONAPOXY FR-1047 is an inexpensive, flame retardant, non-abrasive epoxy, excellent resistance to thermal shock, low exotherm, and good electrical properties, typified by very good arc resistance. 5 gallon.
- Compound Type: Thermal / Heat Insulating
- Form / Function: Encapsulant / Potting Compound
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Industry Applications: Military / Government (MIL-SPEC / GG), OEM / Industrial
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Supplier: HallStar
Description: extremely good mechanical, adhesive, electrical, and chemically resistant properties. Unfortunately, this particular epoxy resin in its liquid form is highly viscous and hard to handle at room temperatures. Our SUPRMIX® Hallco® Epoxy Resin, however, turns this useful, but viscous, resin
- Chemical / Polymer System Type: Epoxy
- Chemical / Polymer System Type: Epoxy
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Featured Products for Epoxy Property Top
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Epoxy Technology
Epoxy Adhesive Application Guide
Epoxy Technology offers our newest educational tool designed to assist adhesive users in gaining a more thorough understanding of adhesive properties and testing. The information contained within this guide is useful and invaluable for choosing the best adhesive in your specific application. For any additional assistance needed, please contact our Applications Experts at Epoxy Technology at techserv@epotek.com or (978) 667-3805. (read more)
Browse Epoxy Adhesives Datasheets for Epoxy Technology -
Epoxy Technology
Tech Tip 19 - Mechanical Properties of Epoxies
The unique molecular structure of epoxy allows for a large variety of mechanical. properties through varying formulations. Epoxies can range from very soft and flexible to very hard and rigid. Softer materials can relieve stress while harder products are used for their high strength and acoustic properties. The thermosetting nature of epoxies cause them to behave differently than thermoplastics and other engineered materials when stresses are applied. Understanding... (read more)
Browse Epoxy Adhesives Datasheets for Epoxy Technology -
Master Bond, Inc.
Fast Curing Epoxy System
Two Component, Room Temperature Curing, Toughened Epoxy Adhesive/Sealant for High Temperature Bonding and Sealing. Offers High Shear and Peel Strength, Along With Convenient Handling. Master Bond Polymer System Supreme 33CLV is a special, room temperature curing, toughened epoxy adhesive/sealant, featuring exceptionally high temperature resistance. This innovative system has outstanding physical properties along with a wide service temperature range from -100°F to +425°F. It has a mix ratio... (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
Master Bond, Inc.
High Temperature Resistant Epoxy
Well suited for applications involving thermal cycling, Master Bond Supreme 11AOHT has high shear and peel strength. It bonds well to both similar and dissimilar substrates. This toughened compound has exceptional adhesion to most metals, ceramics, glass and most rubbers and plastics. Bonds are resistant to water, oil and most organic solvents. Supreme 11AOHT has a thermal conductivity of 10 BTU/in/ft²/hr/°F. It has a dielectric strength of >400 volts/mil. It also exhibits a T-peel aluminum... (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
Master Bond, Inc.
Snap Cure Epoxy Is Chemically Resistant
which is ideal for bonding dissimilar substrates and applications subject to thermal cycling. Each product comes in half pints, pints, quarts, gallons and 5 gallon container sizes. Master Bond's EP17HT-3 one part snap curing epoxy features high temperature resistance and has outstanding electrical properties and chemical resistance. Read more about Master Bond's one part epoxy formulations at http://www.masterbond.com/lp/tabs/tp_byt_1ptepoxy.html, or contact Master Bond's Technical Support Team... (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
Epoxy Technology
Tech Tip 18 - Understanding Optical Properties
Index of Refraction & Spectral Transmission play a critical role in optoelectronic applications involving epoxies. Index of Refraction is the measurement of the speed of light within a certain substance. Most epoxies have a refractive index range from 1.50 to 1.57. In order to select the best optical grade adhesive, users need to specify the spectral transmission versus wavelength targets. As an example, it is common for a given epoxy to have a characteristic of being infrared transparent... (read more)
Browse Epoxy Adhesives Datasheets for Epoxy Technology -
Master Bond, Inc.
Heat Resistant Epoxy for Structural Bonding
With a balance of superior peel and shear strength properties, Supreme 46HT-2 is suitable for applications where long term exposure to wide temperature ranges between -100°F and +500°F is required. It is used extensively in aerospace, electronic, metalworking, transportation, appliance and chemical/oil processing applications. With a mixing ratio of 100 to 30, it cures at elevated temperatures with a minimum 250°F required for cure. Moreover, product properties are relatively unaffected... (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
ELANTAS PDG, Inc.
Epoxylite® Hi Temp Epoxy Systems
remaining serviceable to 315 °C (600 °F) or higher for short periods. Hi Temp Epoxies are uniquely suited for applications requiring resistance to chemical attack at elevated temperatures including exposure to boiling acid, alkali and solvents. Only the strongest concentrations of acids, such as bright dip at elevated temperatures will soften the material. They provide superior radiation resistance and low outgassing characteristics. These Epoxylite ® Hi Temp Epoxy Systems have since found... (read more)
Browse Epoxy Adhesives Datasheets for ELANTAS PDG, Inc. -
Master Bond, Inc.
New Epoxy Serviceable At Cryogenic Temperatures
Master Bond EP29LPSP has a mix ratio of 100 to 65 by weight. It cures at room temperatures, but best results are obtained if heat cured at 130-165°F for 6-8 hours. EP29LPSP features superior physical strength properties and excellent chemical resistance. It bonds well to a variety of substrates including metals, glass, ceramics and many different plastics. When curing, EP29LPSP has a low exotherm. EP29LPSP has a low viscosity and is easy to apply. Its mixed viscosity is 400 cps. It has... (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
Master Bond, Inc.
Fast Cure High Temperature Resistant Epoxy
ULTRA FAST CURE EPOXY ADHESIVE COMBINED WITH HIGH TEMPERATURE RESISTANCE. Now qualified to meet NASA low outgassing specifications, Master Bond EP65HT-1 is a two component epoxy adhesive that features a unique combination of ultra fast cures and high temperature resistance. With superior electrical insulating properties and strong chemical resistance, it bonds well to a wide variety of substrates including metals, glass, ceramics, woods, vulcanized rubbers and many plastics. It is widely used... (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
Andover Corporation
Fuller Epolite
Fuller Epolite FH-5313 is a 100% solid, room temperature curing, electrical grade, epoxy adhesive that has proven to be an excellent bonding agent for ferrite pot cures. This system is designed for continuous operation at temperatures up to 200 °F and is available in pre-measured kits. USES. • Ideal for bonding a variety of substrates such as metal, glass and plastic. • Potting and encapsulation. • Excellent chemical resistance, mechanical strengths and electrical properties... (read more)
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Epoxy Technology
EPO-TEK® 301 Spectrally Transparent Epoxy
EPO-TEK ® 301 is a two component, room temperature curing epoxy featuring very low viscosity, and excellent optical-mechanical properties. EPO-TEK ® 301 Advantages & Suggested Application Notes: Semiconductor: optical glob top or underfill; adhesion to common wafer passivation, solder mask and flex circuits; compatible with LED die, Si, GaAs. PCB: general potting and protection over FR4, flex, or ceramic PCBs. Medical: It is NONTOXIC —complying with USP Class VI... (read more)
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Sherwin-Williams Protective & Marine Coatings
Fast Clad® ER Epoxy
accuracy. Fast Clad ER Epoxy is an ultra high-solids epoxy amine coating that presents significant advantages over other epoxy coatings in pipeline rehabilitation and repair, such as excellent cathodic disbondment resistance, outstanding adhesion properties, ultra high solids that comply with all VOC regulations and first-rate edge build which improves overall corrosion performance. "This one-coat, rapid-cure epoxy coating is capable of returning pipelines to back fill within six hours... (read more)
Browse Industrial Coatings Datasheets for Sherwin-Williams Protective & Marine Coatings
Conduct Research Top
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Epoxy
Epoxy polymers are cured to form thermoset resins by either homopolymerization of epoxy groups with themselves, or reaction with curing agents such as anhydrides, amines, and novolacs. Because the curing agent contributes significantly to the cured properties of the resin, this is called
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Understanding Optical Properties for Epoxy Applications
Optical or unfilled epoxy adhesives are commonly used for adhering various substrates,. encapsulating components and providing protective coatings in several optical. applications.
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Computational Studies of Crosslinked Epoxy Resins
BHP Steel Research Laboratories, Port Kembla, Australia Scientists at BHP Steel Research Laboratories and RMIT University have used Accelrys' Amorphous Cell and PCFF force-field to model and predict crosslink density and sites in epoxy resins, and also estimate barrier and adhesion properties
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Filled UV Curable Epoxy Provides Low CTE For Electronic Potting and Encapsulating
, glob-tops, coatings, and bonding. Potting is a process where epoxy is poured on top of a circuit board and allowed to cure. This process "encapsulates" the components of the board, protecting them from unwanted damage. Glob-top is a process where epoxy is selectively dispensed onto a vulnerable
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Advanced Boron Nitride Epoxy Formulations Excel in Thermal Management Applications (.pdf)
Epoxy based adhesives are prevalent interface materials for all levels of electronic packaging. One reason for their widespread success is their ability to accept fillers. Fillers allow the adhesive formulator to tailor the electrical and thermal properties of a given epoxy. Silver flake allow
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Epoxy Adhesive Applications Guide
This guide is an educational tool designed to assist adhesive users in. gaining a more thorough understanding of adhesive properties and testing.
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Epoxies for OptoElectronic Packaging: Applications and Material Properties (.pdf)
micro-electronic grade joining materials will be used. For LEDs, the silver epoxy is needed for both electrical and thermal properties. Optically clear epoxy is used for the potting, molding, or encapsulation of the LED. In LCDs, there are many different applications of epoxy of which 2 are presented.
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Understanding Mechanical Properties of Epoxies for Modeling, Finite Element Analysis (FEA)
The unique molecular structure of epoxy allows for a large variety of mechanical properties through varying formulations.
Engineering Web Search: Epoxy Property Top
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ASTM C882 / C882M - 12 Standard Test Method for Bond Strength...
ASTM C882 / C882M - 12 Standard Test Method for Bond Strength of Epoxy-Resin Systems Used With Concrete By Slant Shear
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ASTM F641 - 09 Standard Specification for Implantable Epoxy...
of Plastic Film and Sheeting D2240 Test Method for Rubber Property--Durometer Hardness D2471 Practice for Gel Time and Peak Exothermic Temperature of
- Polyurethane - Wikipedia, the free encyclopedia
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Composite material - Wikipedia, the free encyclopedia
There are numerous thermoset composites, but advanced systems usually incorporate aramid fibre and carbon fibre in an epoxy resin matrix.
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Pouring Sealant with Flame Retardant Property from Wuxi Dahe...
Home > Buy Now > Chemicals > Adhesives & Sealants > Epoxy Adhesives > Pouring Sealant with Flame Retardant Property
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Transparent ATO/epoxy nanocomposite coating with excellent...
Transparent ATO/epoxy nanocomposite coating with excellent thermal insulation property
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Preparation, liquid crystal property and thermodynamic...
Preparation, liquid crystal property and thermodynamic property of Amine-terminated polyesterimide, as modifiers for epoxy resin Publisher Name: IEEE
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Investigation of mechanical behavior of epoxy shape memory...
Structure characteristic, dynamic mechanical property and quasi-static tension property and shape memory behavior of the epoxy SMPs are presented.