Products & Services

See also: Categories | Featured Products | Technical Articles | More Information
Page: 1 2 3 Next

Conduct Research Top

  • Epoxy
    Epoxy polymers are cured to form thermoset resins by either homopolymerization of epoxy groups with themselves, or reaction with curing agents such as anhydrides, amines, and novolacs. Because the curing agent contributes significantly to the cured properties of the resin, this is called
  • Understanding Optical Properties for Epoxy Applications
    Optical or unfilled epoxy adhesives are commonly used for adhering various substrates,. encapsulating components and providing protective coatings in several optical. applications.
  • Computational Studies of Crosslinked Epoxy Resins
    BHP Steel Research Laboratories, Port Kembla, Australia Scientists at BHP Steel Research Laboratories and RMIT University have used Accelrys' Amorphous Cell and PCFF force-field to model and predict crosslink density and sites in epoxy resins, and also estimate barrier and adhesion properties
  • Filled UV Curable Epoxy Provides Low CTE For Electronic Potting and Encapsulating
    , glob-tops, coatings, and bonding. Potting is a process where epoxy is poured on top of a circuit board and allowed to cure. This process "encapsulates" the components of the board, protecting them from unwanted damage. Glob-top is a process where epoxy is selectively dispensed onto a vulnerable
  • Advanced Boron Nitride Epoxy Formulations Excel in Thermal Management Applications (.pdf)
    Epoxy based adhesives are prevalent interface materials for all levels of electronic packaging. One reason for their widespread success is their ability to accept fillers. Fillers allow the adhesive formulator to tailor the electrical and thermal properties of a given epoxy. Silver flake allow
  • Epoxy Adhesive Applications Guide
    This guide is an educational tool designed to assist adhesive users in. gaining a more thorough understanding of adhesive properties and testing.
  • Dielectric Properties of Epoxies
    barrier between two conductors (as in cross over and multi-layered. circuits) and for encapsulating circuits. Dielectric properties, specifically for epoxy adhesives, refer to the electrical properties of a material.
  • Epoxies for OptoElectronic Packaging: Applications and Material Properties (.pdf)
    micro-electronic grade joining materials will be used. For LEDs, the silver epoxy is needed for both electrical and thermal properties. Optically clear epoxy is used for the potting, molding, or encapsulation of the LED. In LCDs, there are many different applications of epoxy of which 2 are presented.

More Information Top

Lock Indicates content that may require registration and/or purchase. Powered by IHS Goldfire

  • Handbook of Paint and Coating Raw Materials Volume 1 and 2
    ...BYK-Chemie USA] Chem. Descrip.: Polymer in alkylbenzene/methoxypropylacetate (12/1), silicone-free Uses: Defoamer for solv.-based and solv.-free systems, protective coatings, can/coil coatings, industrial coatings, esp. wood/furniture coatings based on glossy polyesters, paraffin-polyesters, UV-curing polyesters, and epoxies Properties : Dens.
  • Handbook of PLASTIC AND RUBBER ADDITIVES Volume 1 and 2
    resistors, circuit boards, etc.) with no deterioration in elec. props.; features good mech. str., elec. props., hydrolytic stability, flammability; suitable for styrenics, epoxies Properties : Amber powd.; readily dissolved in chloroform, chlorobenzene, trichloroethylene, benzene, styrene monomer, toluene, tetrahydrofuran, 1,1,2-trichloroethane; sp...
  • Handbook of Lubricants
    ...C12-15 alkyloxypropylamine CAS 68610-26-4 UN 2735 Uses: Corrosion inhibitor for metalworking fluids; antistat; flotation collector; additive for fuel, lubricant, petrol. refining; intermediate for surfactants, textile foamers, ethoxylates and agric. chem.; crosslinking agent for epoxies Properties : Gardner 5 max. cl...
  • Handbook of Fillers, Extenders, and Diluents
    ...do not store above 70 F Kenplast® PG [Kenrich Petrochems. http://www.westnet.com/~kpiemm/] Chem. Descrip.: Phenyl glycol ether See Phenoxyethanol CAS 122-99-6; EINECS/ELINCS 204-589-7 Uses: Plasticizer; nonreactive diluent and flexibilizer for epoxies Properties : Gardner 3 liq.; sp...
  • Handbook of Corrosion Inhibitors
    ...C12-15 alkyloxypropylamine CAS 68610-26-4 UN 2735 Uses: Corrosion inhibitor for metalworking fluids; antistat; flotation collector; additive for fuel, lubricant, petrol. refining; intermediate for surfactants, textile foamers, ethoxylates and agric. chem.; crosslinking agent for epoxies Properties : Gardner 5 max. cl...
  • Advances in Materials and Materials Processing
    In addition to the type of polymer and nanoclay to start with the improvement in epoxy properties resulted from nanoclay addition depends mainly on mixing techniques used to disperse nanoclay into epoxy matrix [3,7,10].
  • http://dspace.mit.edu/bitstream/handle/1721.1/42815/42213528.pdf?sequence=1
    unaffected by temperature, but the epoxy properties changed with temperature, .
  • Challenges in Mechanics of Time-Dependent Materials, Volume 2
    Creep compliance and the creep rate values also dropped below the neat epoxy property values.