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Supplier: Ellsworth Adhesives
Description: Release coating for plastics, adhesives, and elastomeric products. Easy to use, does not discolor molded parts, and is solvent dilutable. In fabricating plastic parts, provides durable parting film for epoxies, melamines, methacrylates, phenolics, polyesters, and polyurethanes. Releases silicone
Supplier: R. S. Hughes Company, Inc.
Description: DuraKote Mold Release 55-Gallon. Semi-permanent mold release agent for thermosets. Excellent rotational mold release. Use for urethane & epoxy molding. Completely dry, paintable and non-flammable. * Semi-permanent for thermosets * Completely dry * Will not discolor * Extremely thin film * Urethane
Supplier: Invotec Solutions Ltd.
Description: Ambersil Formula 10 Dry Film Non-Silicone Release Agent A dry film, non-silicone mould release agent. Highly effective release agent for thermosetting plastics. Provides excellent release properties on polyurethane,s, epoxy resins and polyester. A dry film, non-silicone mould release agent
- Chemistry / Constituents: Fluoropolymer / PTFE (e.g., Teflon®)
- Operating / Use Temperature: 356 F
- Features: Aerosol / Spray
Industrial Adhesives - B-Staged Film Adhesive/Sealant Featuring Toughness, High Temperature Resistance, Thermal Conductivity and Electrical Isolation -- FLM36Supplier: Master Bond, Inc.
Description: with a pair of sharp scissors into various shapes and sizes. With intricate shapes, preforms can be provided; although, a technical drawing with tolerances would be required. The films are rugged, durable and not prone to cracking. Using the film is simple. The films have release paper on each side
- Substrate / Material Compatibility: Ceramic / Glass, Composites, Metal
- Industry: Aerospace, Electronics, OEM / Industrial
- Features: Electrically Insulating / Dielectric
- Use Temperature: -100 to 500 F
Supplier: OMEGA Engineering, Inc.
Description: The SA1-RTD is a surface temperature sensor that can be applied to most clean, dry surfaces. Just peel off the release sheet on the bottom of the sensor and the silicone adhesive bonds the sensor to the surface, no cements or epoxies to mix, apply and cure. The thin design of the SA1-RTD minimizes
- Sensed Temperature Range: -99.4 to 500 F
- Input Options: RTD Inputs
- # of Inputs / Channels: 1 #
- Display Type: None - No Display
Supplier: DeWAL Industries, Inc.
Description: DW 904-1 uses 1 mil polyester film coated with silicone adhesive. The silicone adhesive will release cleanly. This tape product is transparent for applications where optical clarity is important. APPLICATION INFORMATION These tapes are used in masking metal parts during bonding or mild acid
- Materials of Construction: PET / Polyester, Plastic / Polymer
- Thickness: 25.4 µm
- Width: 6350 to 431800 µm
- Length: 2592 inch
Description: Release films provide excellent release capabilities from epoxy, phenolic, polyester and other resin systems. The film can be used as a medium between the book and the platen. Maximum service temperatures are 400 degrees F (205 degrees C) or
- Type: Film
- Width: 1.22E6 to 1.83E6 µm
- Thickness: 50 to 250 µm
- Features: Transparent
Description: 3M™ Scotch-Weld™ Low Density Composite Surfacing Film AF 163 2XS is thermosetting, laminated metal foil films that adheres to cold and release coated tools.
- Substrate / Material Compatibility: Composites
- Industry: Aerospace, OEM / Industrial
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
Supplier: Mitsui Chemicals America, Inc.
Description: TPX® Film Opulent™ is a high performance heat resistant release film used for a wide range of applications including flex circuits. The non stickiness polymethylpentene film is available in both single layer and multi layer and either may be selected according to the application
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Master Bond, Inc.
Toughened B-Staged Adhesive Film
metals, composites, glass and many plastics. Additionally, thermally conductive FLM36 is a superior electrical insulator. Unlike other heat resistant epoxy systems, FLM36 possesses more flexibility and toughness, which enables it to endure thermal and mechanical shocks as well as thermal cycling. It also has good chemical resistance to water, acids, bases, fuels and oils. The film has release paper on each side. After the substrates to be bonded are properly prepared, the release paper is removed... (read more)
Browse Specialty Adhesives, Sealants, and Compounds Datasheets for Master Bond, Inc.
MINTEQ® International Inc, Pyrogenics Group
Fire Retardant Coatings for Oil & Gas Industry
Retardants. Firex ™ coatings are designed to interrupt or hinder the combustion processes of a fire allowing more time to escape. Our coatings delay or slow: time to ignition (flash over). smoke development. spread of flames. release of toxic gases. release of corrosive chemicals. release of heat. Firex ™ fire retardants interfere with the combustion at various stages of the process including during heating, decomposition, ignition or flame spread. How Does Firex ™ Work... (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for MINTEQ® International Inc, Pyrogenics Group
Dow Automotive Systems
Dow Automotive to Launch VORAFORCE 5300
Affordable Lightweighting – Dow Automotive Systems to launch VORAFORCE 5300 ultra fast epoxy resin for structural composite parts in mass production. 90-second cycle times support faster, more affordable lightweighting and enormous potential for parts consolidation. Bringing mass reduction capabilities to mass production facilities, Dow Automotive Systems can now offer 90-second cycle times for resin transfer molding (RTM) with VORAFORCE ™ 5300 resin matrix, making... (read more)
Browse Resins and Compounds Datasheets for Dow Automotive Systems
Conduct Research Top
Tape eases appliance design pressures
The roll of pressure-sensitive adhesive (PSA) tape in the design and production of home appliances is a sticky one. of pressure-sensitive adhesive (PSA) tape in the design and production of home appliances is a sticky one. The flexibility and aggressive adhesive of free film helps bond irregular
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Siloxane- and Imide-modified Epoxy Resin Cured with Siloxane-containing Dianhydride
The precured epoxy in released film was placed in alu- minium pan, and was cured according to the curing profile: 130 ◦C/30 min + 150 ◦C/180 min + 200 ◦C/30 min.
Other uses include release films for epoxy -based printed circuit board (PCB) substrates and advanced composites and filtration media.
Adhesive based flip chip technology for assembly on polyimide flex substrates
isotropic Z-axis conductive adhesive preform is fabricated by printing complimentary pattems c€ electrically conducting and non-conducting filled epoxies onto a Mylar release film .
Improving the fracture energy of carbon fibre-reinforced plastics by delamination promoters
The only property required of the film material was its thermal stability atthe cure temperature and chemical resistance to the attack by epoxy groups; characterized release films were also discarded.
Polymer/Boron Nitride Nanocomposite Materials for Superior Thermal Transport Performance
The PVA/BN films could be peeled off directly in free-standing form, while the epoxy /BN films were released from the glass slides after immersion in water for about 30 min.