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  • Faster, more predictable die casting
    cycle rates. And designers often see a tenfold increase in die life thanks to the low abrasive wear rates of these alloys when compared to their aluminum counterparts. Special die-casting techniques let designers easily modify designs to boost structural properties. To improve creep resistance...
  • MICRO: Product Tech News
    The BedeScan digital x-ray inspection tool identifies and quantifies structural defects in semiconductor wafer substrates and epilayers. The high-speed mapping tool uses nondestructive x-ray diffraction to identify a wide range of anomalies in both incoming and processed wafers up to 300 mm...

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Provides 128 possible characters, the first 32 of which are used for printing and transmission control.
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