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  • Gold Tin The Unique Eutectic Solder Alloy (.pdf)
    The eutectic gold-tin alloy is 80%Au/20%Sn with a eutectic of 280°C (556°F) and is reflowed in a pure nitrogen or forming gas* atmosphere, which forms the "flux", normally onto gold based metallisations. The peak reflow temperature is usually 320-340°C in a bell shaped profile, with a dwell time
  • Assessment of Eutectic Solder Phase Growth in Under-The-Hood Power Control Modules (.pdf)
    In many applications, especially automotive, solder interconnects experience degradation due to prolonged temperature and power cycling. This degradation behavior manifests itself as changes in the grain/phase structure, primarily through grain/phase coarsening. Because the magnitude of the change
  • AN3017: Procedure for MSAG MMIC AuSn Eutectic Solderability
    The following procedure is M/A-COM's recommended instruction for eutecticly attaching die to pedestals. 2.1 The following are materials and supplies required to perform eutectic soldering. Solder Preforms: A. 80/20 AuSn B. Approximately 100% die coverage C. Approximately 1 mil thick Gases: A. N2
  • Solder Reflow Recommendation
    ), melting and eutectic temperatures also change, requiring modification to the solder reflow profile
  • How to use Fusible Alloys (.pdf)
    Fusible alloys are materials that melt at less then 300°F, well below the melting point of tin-lead eutectic solders and SAC alloys. Bismuth is the major component of many of these alloys and influences the melting point, as well as gives these materials the unique characteristic of expansion upon
  • Reliability Study Conducted: Leadless Chip Thermistor with High Temperature Solder Leach Resistant Gold Contacts, Die Mounted with Eutectic Au/Sn Solder by Customer (.pdf)
    This report is a summary of the information contained in the full report with the file name. "CornerstoneT041ThermReliabilityReport.pdf," which came from a customer of Cornerstone Sensors, hereinafter named "Customer," whose name has been withheld due to Customer's request for confidentiality. The
  • High Melting Lead-Free Mixed BiAgX Solder Paste System
    Although lead-free soldering has been main stream in the industry since 2006. with the replacement of the eutectic SnPb system by the SnAgCu system, the. development of drop-in lead-free alternatives for high melting high lead solder. alloys is still far from mature. The BiAg alloy exhibits
  • M567: CR-15 Packaging Handling and Mounting Procedures
    -cobalt leads. The finish consists of electrolytic gold over nickel plate. After component installation, the package is hermetically sealed using a ceramic lid and an 80/20 gold/tin eutectic solder. This bolt down style package provides a robust interface between a highly integrated GaAs MMIC device

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  • Solder Joint Technology
    Wetting Reaction of Pb-Free Eutectic Solders on Thick Cu UBM...........................................................................
  • Lead-Free Electronic Solders
    For exam- ple, McCormack and coworkers [40, 41] modified the Sn–3.5Ag binary eutectic solder with 0.5–2.0 wt.% Zn additions, and noted substantial refinement of the microstructure; in particular, they observed a decrease in the incidence of b-Sn...
  • Lead-free Solders: Materials Reliability for Electronics
    Tsai, J.Y., Chang, C.W., Ho, C.E. et al. (2006) Microstructure evolution of gold-tin eutectic solder on Cu and Ni substrates.
  • Lead-free Electronics
    After soldering the same components with tin-lead eutectic solder , the lead-free materials were used with a reflow temperature of 245"C, which again was well below the 260°C expected peak.
  • A Guide to Lead-free Solders
    As-cast Microstructures of Solder Alloys..........................................73 3.4.1 SnPb Euctectic..........................................................................74 3.4.2 SnAg Eutectic Solder ...............................................................74 3.4.3 SnAgCu Ternary Solders.........................................................75 3.5 .
  • ULSI Semiconductor Technology Atlas
    TABLE 15.1 Layered Structure of UBM Systems UBM System Passivation Bumping method UBM layer structure Sputtered Cu/Ni(V)/Al Silicon nitride Print and reflow Eutectic solder Cu 500 nm Ni(V) 400 nm Al 400 nm Al or SiN SiO2 or...
  • Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
    Reliability of Pb-Free Solder Joints in Comparison to Sn-Pb Eutectic Solder Joints .
  • Lead-Free Soldering
    This approach is eminently logical: the new standard Pb-free alloy replaces Sn-Pb eutectic solder in a wide variety of board designs and microelectronics applications.