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  • Solder Joint Technology
    Wetting Reaction of Pb-Free Eutectic Solders on Thick Cu UBM...........................................................................
  • Lead-Free Electronic Solders
    For exam- ple, McCormack and coworkers [40, 41] modified the Sn–3.5Ag binary eutectic solder with 0.5–2.0 wt.% Zn additions, and noted substantial refinement of the microstructure; in particular, they observed a decrease in the incidence of b-Sn …
  • Lead-free Solders: Materials Reliability for Electronics
    Tsai, J.Y., Chang, C.W., Ho, C.E. et al. (2006) Microstructure evolution of gold-tin eutectic solder on Cu and Ni substrates.
  • Lead-free Electronics
    After soldering the same components with tin-lead eutectic solder , the lead-free materials were used with a reflow temperature of 245"C, which again was well below the 260°C expected peak.
  • Principles of Soldering
    The authors have com- pared the spreading characteristics, as a function of excess temperature above the melting point (“superheat”), of all combinations of the elements bismuth, indium, lead, silver, and tin when used as eutectic solders on “ideal” substrates [Humpston and Jacobson …
  • A Guide to Lead-free Solders
    As-cast Microstructures of Solder Alloys..........................................73 3.4.1 SnPb Euctectic..........................................................................74 3.4.2 SnAg Eutectic Solder ...............................................................74 3.4.3 SnAgCu Ternary Solders.........................................................75 3.5 .
  • Lead-Free Solder Interconnect Reliability
    and Q.J. Yang, A New Constitutive Creep Constitutive Model for Eutectic Solder Al- .
  • Advanced Flip Chip Packaging
    It has also been utilized to form a hybrid joint, uniting high lead with eutectic solder for joining die onto organic substrates.