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  • Failure Mode Analysis of Medical Resection Loops Using Thermal Imaging
    thermal imaging was used to determine and predict the failure mode of electrosurgical resection loops powered by radio frequency (RF) energy. These loops are commonly used to remove, resect or ablate (remove or cut away) soft tissue. Applications include resection of enlarged prostate glands
  • Designing Safer Products Proactive Hazard Analysis
    Hazard analysis is the foundation of many other product-safety activities. The objective of productsafety efforts is to correct or address safety problems. There are many types of hazard analysis: Failure Mode and Effects Analysis (FMEA), Fault Tree Analysis (FTA), and Preliminary Hazard Analysis
  • Semicon West --Business is back
    Lithography Masks, Failure Mode Analysis of Flip Packages, Functional Safety in Compliance with SEMI S2, Integrated Measurement Module Communications, The Fundamental Limits of Optical Lithography, Introduction to Flip Chip Technology, Developing and Implementing Intellectual Property Strategies
  • The Pitfalls of Process TOC Analysis and How To Avoid Them (.pdf)
    characteristics required for true process control have been notably absent. The purpose of this paper is to discuss those limitations as evidenced by field experience, maintenance requirements and other practical considerations. Failure mode and effect analyses are summarized for critical components
  • Integrating RCM with Effective Planning and Scheduling - Part 1
    Plant Maintenance Resource Center Home The first thing to note about an RCM analysis is that the key output is a collection of recommended actions, each of which is focused on a specific failure mode. These actions can be classified into three groups. Successful RCM implementation requires that all
  • Ship's Steering Gear Motor Problem Diagnosed Using IR Technology (.pdf)
    The Queen of Saanich Ro-Ro Passenger Ferry experienced a high temperature bearing problem with one of its main steering gear motors. IR analysis showed the non drive end thrust bearing as the source of the heat being generated. It was thought at the time that the bearing was in failure mode
  • STEM Image Observation Using the S-5200 UHR FE-SEM (S-5200, FB-2000A SEM 100)
    Process evaluation of semiconductor devices requires cross-sectional observations using SEMs for optimizing exposures and/or etching conditions. For this purpose wafers need to be fractured for evaluation. Failure analysis of semiconductor devices, on the other hand, requires evaluation of inner
  • JEM-9320FIB Product Brochure
    Nanoscale observation and analysis are increasingly important in the nanotechnology era. Based on electron- and ion-optics technologies developed by JEOL for many years, the JEM-9320FIB system can prepare cross sections from local areas of STEM/TEM specimens for semiconductor failure analysis

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