focal planes and electronic imaging systems. In order to assure rapid achievement of research goals, complete control of product quality and timely product delivery schedules, all of our engineering, semiconductor wafer fabrication, production assembly, and business facilities are co-located and managed at a single facility. Resident manufacturing processes include semiconductor wafer fabrication, wafer dicing, packaging, backside thinning, device butting,
fiber-optic element attachment, X-ray...
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