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  • Sensor Film Shows Assembly Clamp Needs a Redesign
    ) on production assemblies using a pressure sensing film that changes color under different loads. The procedure showed that clamping pressures ranged from 50 to upwards of 200 psi during some production runs, says Futek mechanical engineer James Meiselbach. The pressure-sensing film called Pressurex
  • Semiconductor Inspection
    There are a number of techniques that are utilised today in the post process on line optical inspection of semiconductor wafers. These include: * Spectroscopic reflectometry where multiple laser wavelengths are shone down onto the surface of the thick film covered substrate to obtain information
  • Consider UV Inspection
    syringe or verification of a process step, such as the application of a UV blocking layer in a clear packaging film necessary to prevent degradation of UV sensitive products. Many processes require manual sampling or inspection on a representative sample pulled from a production line. Often
  • Flexible circuit helps shed light on optical inspection line
    circuit film called R/flex 2005 was selected. Now, the operators simply roll the flexible circuit over the panel surface, feed the diode leads through die-cut holes, then solder the leads to circuit traces. Thinner films reportedly ripped during this procedure, but the R/flex 2005 from Rogers Corp
  • | Electronics Industry News for EEs & Engineering Managers
    drives MicroSensors receives patent for silicon micromachined gyro sensor France's Soitec, Gemplus target SOI wafers for smart-card ICs Veeco adds thin-film inspection, ion-beam deposition through two mergers PMC-Sierra's networking-chip strategy lifts earnings Patton leaves Schlumberger
  • MICRO: Products
    that have more than one cassette or an additional thin-film inspection module sharing the same robot. Based on an optical design using a blue laser diode, the compact system outputs a full 2-D color map of the wafer surface in minutes, showing not only the distribution but also the sizes of defects
  • Tracking the performance of photolithographic processes with excursion monitoring
    photocluster performance is vital, and the individual tools are typically monitored by means of numerous tool checks (inspection procedures designed to evaluate specific components of the process). Examples include resist-film-thickness and hot-plate temperature uniformity measurements on the track
  • Application Tape for Single Lettered Emblem Mounting - FT 0411(.pdf)
    A transparent protective film allows perfect visual inspection. Designed as an application tape for emblem and badge mounting. The tape can be cleanly removed from plastics, wood, painted steel and glass surfaces even after long term use.
  • Product Technology News
    inspection step to another with minimal operator involvement. An amber film for cleanroom windows prevents transmission of up to 99% of harmful blue and UV light under 500 nm. The pressure-sensitive film, available in rolls of various widths, can be professionally installed to fit any size cleanroom

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