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  • Base Flatness Measurement (.pdf)
    One of the biggest issues in the machinery installation process is that many machines are installed but they are left under strain due to the fact that they are bolted to distorted bases or frames. The problem is that the machines feet and the base are not in the same plane. In other words, the feet
  • Thickness, Shape and Flatness Measurement of Semiconductor Wafers
    measurements. TTV is expressed in microns or mils (thousandths of an inch).
  • Flatness
    , and kept to a minimum separation. The highest peak-to-valley normal measurement provides an indication of part flatness. Flatness can also be analyzed with the minimum zone calculation method. The surface data to be analyzed is enclosed by two parallel planes with only minimal separation. The level
  • Infrared Sensor Graphic Interface PVC Sheet Material
    site-flatness measurement precision offers chipmakers good control of polishing, which improves yields of fine-line-geometry devices. The multigenerational tool has automated noncontaminating edge-grip wafer-handling capability and supports the ITRS at the 90-, 65-, and 45-nm nodes. In addition
  • MICRO: Products
    geometry measurements, the 300-mm Advanced Flatness system measures and reports SEMI-standard wafer shape, flatness, thickness, and resistivity results. The multifunctional wafer-flatness measurement and sorting system can also be used in ultrathin SOI, epitaxial, prepolish, and reclaim wafer
  • MICRO: Products
    and characteristics. Used in silicon quality and process control applications to perform noncontact wafer geometry measurements, the 300-mm Advanced Flatness system measures and reports SEMI-standard wafer shape, flatness, thickness, and resistivity results. The multifunctional wafer-flatness measurement
  • Group Delay and its Impact on Serial Data Transmission and Testing (.pdf)
    This paper is an extension of last years paper entitled "Eye Pattern Measurements in Scopes". Last years paper pointed out the effects of bandwidth, roll-off rate, flatness, and group delay characteristics along with probe loading and return-loss. It only glossed over the more complicated topic
  • Amplifier Specifications Definitions
    All models described in this catalog are classified by several specifications, namely: * Operating Frequency Range. * Gain. * Gain Flatness. * Noise Figure. * Output Power at 1 dB Compression. * Input and Output VSWR. * DC Supply Voltage and Current Consumption. The following notes give detailed

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