Our Sites: GlobalSpec.com | GlobalSpec Electronics | CR4
Free Registration 
Welcome to GlobalSpec!
Find parts, products, suppliers, datasheets, and more for:

Flex Substrate

 

Find Suppliers by Category

RF and microwave laminates are used as substrates for radio frequency (RF) and microwave communication systems and electronics. They are designed to meet the demanding performance standards for higher-frequency applications.
Search by Specification | Learn More

Products & Services

See also: Featured Products | Technical Articles | Engineering Web Results

Conduct Research Top

  • Custom Six-Position Peel-A-Way(R) Terminal Carriers Reduce Board Assembly Time and Costs (.pdf)
    . carrier is made from a high. controlled course correction system, the manufacturer's. temperature polyimide film. printed circuit board design required a three-branch flex. substrate that can be. circuit with six pins at the end of each termination. The. used safely at high oven. design called
  • Balancing the Electrical and Mechanical Requirements of Flexible Circuits (.pdf)
    is required, the nominal value is typically 50 ohms (100 ohms differential). Achieving. these values in a flex or rigid-flex circuit usually requires thicker flex substrates than those required for a flex. circuit with no impedance requirements. Also, the layers that require impedance control must
  • Soft grip overmold takes the abuse
    substrates range from 25 to 1,000-ksi flex modulus which spans the mechanical performance range of polyolefin, polycarbonate, and "wet" nylon. Parts can be overmolded by two-step or two-shot injection molding, insert molding, or simultaneously by coinjection molding. The letter opener
  • Guidelines for Bonding Plastics
    the joint, they are invisible within the assembly. Adhesives resist flex and vibration stresses and form a seal as well as a bond, which can protect the joint from corrosion. They join irregularly shaped surfaces more easily than mechanical or thermal fastening, barely increase assembly weight, create
  • Enhanced Imager Chip Packaging for Automotive Applications (.pdf)
    optical format imager chip that was designed for. use with conventional ceramic leadless chip carrier. packaging. Overall package thickness is 1.39mm, with. the complete back-side of the silicon substrate exposed. and available for chip cooling. The flex is bonded to a. glass substrate, which
  • Staying flexible
    . You'll get the straight info on what does or, sometimes more importantly, what doesn't work. The dynamic nature of flex circuits results in a multitude of design options. One method for determining the validity of a design is to physically create a flexcircuit mock-up. When producing a mock-up
  • Part Design Guidelines for Pulse Heated Reflow Soldering (.pdf)
    This report will cover the process definition and components used in the pulse heated reflow soldering process. We will look in depth at the component part design criteria necessary to achieve the optimum quality and consistency of a flex to PCB assembly, concentrating on the most popular joint
  • Pressure-Sensitive Adhesives Make Strong Joints at Low Cost
    fasteners. PSAs resists flex and vibration, can bond dissimilar materials, and can adhere to low-surface energy plastics. Manufacturers are always looking for faster and better ways to fabricate machines and subcomponents while reducing weight, noise, vibration, and costs. Pressure-sensitive adhesives

Engineering Web Search: Flex Substrate Top