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Staying flexible
standard outlines acceptable bend radii for different material types of varying thickness. IPC, formerly the Institute for Printed Circuits, is a global trade organization for the electronic interconnect industries. Paper-doll patterns help check the fit of the flexible-circuit design. Modifications...
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MICRO:Roundup 2000 (Nov '00)
will require. Smaller interconnect cross sections at the lowest levels. Cu/low-k interconnect materials. Longer wires with larger cross sections to meet wire resistance targets. More layers--more work. Smaller cross sections--more difficult work. Fortunately, small interconnect cross sections...
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Design Considerations for Power Modules
As discussed in previous Tech Bulletins, the explosive growth of automotive electrical systems and. other industries using inverter and converter based power modules is driving the need for press-fit. technologies to provide reliable, solderless interconnect solutions that can support high current...
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Company News 9/25/08
Co. Ltd. , a pressure-transmitter and magnetic-flowmeter supplier, has designed FM25L16 16-Kb serial F-RAM memory device into its 2000S safe-pressure transmitters. F-RAM replaces EEPROM in Welltech's new explosionproof transmitters. Endicott Interconnect Technologies' Center for Advanced...
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MICRO: 'Round the Circuit
of gate length and gate oxide scaling, including strain techniques and the introduction of new materials, to achieve some performance enhancements, but needed changes in device architecture to get the complete performance pop they were looking for. Interconnect at 65 nm, Menon said, accounts for at least...
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MICRO: Archive: Back Issue TOC
filtration capabilities Alan Weber: Facing the challenges of APC's second decade Interconnect: Etch, deposition, cleaning, and materials challenges line the road to. MICRO: Archive: Back Issue TOC. MICRO Advertiser and Product Information Buyers Guide. Chip Shots blog. Greatest Hits of 2005. Featured...
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MICRO: The Hot Button
dimension control, mitigating or eliminating process damage, improving cohesive and adhesive properties of interconnect stack materials and interfaces, reducing electromigration resulting from increased current-density requirements, managing the large increases in copper resistance caused by shrinking...
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MICRO: Integrated metrology beginning to measure up to expectations
, the industry is "going from well-known aluminum and oxide interconnect structures" to the use of copper and low-k materials. "This isn't easy,. MICRO: Integrated metrology beginning to measure up to expectations. MICRO Advertiser and Product Information Buyers Guide. Chip Shots blog. Greatest Hits...
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Power in small packages
maintaining structural integrity and dielectric capability. For instance, package wall-section thicknesses that were once 50 thousandths of an inch are now 6 or 7 thousandths. Packaging improvements show up on baseplates and termination systems, customized transformers and chokes, and interconnect...
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MICRO:Semicon Europa 2004
, Infineon, Micronic, IMEC, LETI, and IHP, the STS will feature papers on important technical advances. Topics will include interconnect technologies, e-manufacturing and e-diagnostics, silicon-on-insulator technology, and the low k1 reticle challenge. Other technical sessions will focus on several...