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Standards and Technical Documents - Implementation of Flip Chip & Chip Scale Technology -- J-STD-012
Description: flip chip, HDI, micro BGA, micro SMT and SLICC. Also provides general information on implementing flip chip and chip scale technologies for creating multichip modules, I/C cards, memory cards and very dense surface mount assemblies. Developed by IPC, EIA, MCNC and Sematech. 113 Pages. Released
Supplier: Indium Corporation
Description: Epoxy fluxes are often used in no-clean SMT component attach applications. The solder bumps on wafer level CSP, micro BGA or BGA packages are dipped in epoxy fluxes, or the flux is applied to the substrate via a jetting process. The assembly is then reflowed, and the epoxy flux acts to both clean
- Fluxes & Cleaners: Soldering Flux / Rosin
- Form / Shape: Paste
Supplier: Cognex Corp.
Description: Cognex’s BGA II Inspection Package provides a GUI and vision tool for inspecting BFA, CSP, and flip-chip devices. BGA II checks for missing, misplaced, or improperly formed solder balls. This package offers provides robust and high speed inspection despite wide variations in device appearance
- System Type: Modular / PC-Based
- Applications / Capabilities: Edge Detection, Electronics or Semiconductor Inspection, Flaw Detection, Other
- Image Source: Area Scan Camera, Line Scan Camera, High Speed / Brightness
Supplier: Digi-Key Corporation
Description: IC D-TYPE POS TRG QUAD 96LFBGA
- IC Package Type: BGA, Other
- Type: D
- Triggering: Positive-edge Triggered
- Output Characteristics: 3-State Output
Description: This revision provides effective guidelines in the preparation and attachment of components for printed circuit board assembly and reviews pertinent design criteria, impacts and issues. It contains techniques for assembly (both manual and machines including SMT, BGA and flip chip) and consideration
Supplier: Optima Technology Associates, Inc.
Description: ), Micro-BGA, flip-chip, fine-pitch, and high density component placement capabilitity (0201), in-circuit and functional testing. We are equipped with in-house x-ray inspection, and BGA rework tools. 50,000 ft2 ISO Certified, UL Approved Facility Located in Export Zone at NSEZ, Noida India 2 BGA Capable
- Design Services: Conceptual Product Development, Mechanical Design Services, Electrical Design Services, Software Design Services
- Testing Services: Automated Optical Inspection, Functional Testing, In-circuit Testing, X-Ray Testing
- Manufacturing: Printed Circuit Board Assembly, Flexible Printed Circuit Board Assembly, Rigid-Flexible Printed Circuit Board Assembly, Microelectronic, Flip Chip, Microelectronic, Chip On Board, Optoelectronic Assembly, RF / Wireless Assembly, Through Hole Assembly, Surface Mount Assembly, System Assembly
- Production Capabilities: Prototype / Low Volume, Mid Volume, High Volume, Quick Turn, Cabling
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Featured Products for Flip Chip BGA Top
Advanced Interconnections Corp.
Flip-Top BGA Sockets Ease Device Test
The compact Flip-Top ™ Test Socket design matches your device footprint and uses less PC board space than typical test sockets because it requires no external screws, backing plates, or mounting holes in the PCB. The hinged clamp, with integral heat sink, makes insertion and removal of devices quick and easy while ensuring a reliable connection. A chip support plate, customized to your specific IC package, allows for inconsistencies in package coplanarity, thickness, or tolerance issues... (read more)
Browse IC Sockets and Headers Datasheets for Advanced Interconnections Corp.
Mouser Electronics, Inc.
ATS Freescale BGA Heatsinks from MOUSER
Advanced Thermal Solutions (ATS) Freescale BGA heatsinks are designed for Freescale flip-chip ICs.ATS Freescale BGA heatsinks offer MaxiGRIP ™ attachment which applies steady, even pressure to the component and does not require holes in the PCB. The heatsink comes preassembled with high performance phase changing thermal interface material for ease of installation. SUBSCRIPTION CENTER - Mouser's Newest Products and Application News. STAY CONNECTED. Subscribe NOW. See the Newest Products... (read more)
Browse Heat Sinks Datasheets for Mouser Electronics, Inc.
Conduct Research Top
Advanced Thermal Interface Materials for Enhanced Flip Chip BGA
Increased functionality and performance requirements for microprocessors and ASICs have resulted in a trend to package these devices in the flip-chip BGA form factor (FCBGA). Because these devices use in excess of 40-100 Watts of power, their packages must dissipate heat in an extremely efficient
MICRO:Semicon Southwest '98 - Technical/Business Programs (Oct. '98, p.127)
. For a complete listing, log onto SEMI's Web site, Flip Chip, BGA, and Packaging I Chairs: Deborah Patterson, Flip Chip; and George Riley, Hycomp Performance of Evaporated and Plated Bumps on Organic and Ceramic Substrates Addi Mistry, Jim Kleffner, John Czarnowski, Tim Scanlon, Jerry Lozano, James Guajardo
Medical Device Link . Advanced Electronic Packaging Techniques Enhance Function, Performance, and Portability
and flip chips. CSPs are typically only 1.2 1.3x larger than the bare die itself, and some CSPs are essentially shrunken BGAs. The external I/O grid array of a CSP is typically at a pitch of 0.5 1.0 mm, which is smaller than that of a BGA but much larger than a flip chip's fine pad arrays. CSPs
Medical Device Link .
common for BGA packaging. These alternative die-attachment options include thermocompression bonding, solder castillation reflow, and solder-bumped flip-chip methods (see Figure 1). Figure 1. Quad flat pack, ball grid array, chip-scale packaging, and flip-chip package samples. In the flip-chip method
Medical Device Link .
, catheters, low-density plastic components, radiopaque markers in stents and implantable devices, and the presence and placement of internal components. The ViewX-1000 x-ray inspection system is also suited for general circuit-board inspection, which encompasses BGA, flip-chip, CSP, and solder joint
Socket-Adapter Systems: A Practical Test Alternative (.pdf)
Adapter System. Flip-TopTM BGA Socket. Socket Adapter System. and/or. · BGA, LGA, CSP Device Validation or. · BGA & LGA Device Test and Validation. · BGA, LGA, CSP Device Validation. issued. Production-level Socketing. · 1.00mm and 1.27mm Pitch. or Production-level Socketing. patents. · 0.50mm
EETimes.com | Electronics Industry News for EEs & Engineering Managers
is also sampling a next-generation, flip-chip substrate, which promises to lower the cost of flip-chip packages. Hynix pledges to remain independent Wobbly earnings tarnish EDA sector's luster Industry watchers are wondering if the electronic design automation segment, a rare shining star during
Solder Powder: IPC
. About Us. Social Responsibility. Company News. Corporate Awards. ISO and ITAR. Trade Shows. Corporate Literature. Bloggers. Social Media. Facilities. Contact Us. Products. Flux and Epoxy. Ball-Attach Flux. Epoxy Flux. Flip-Chip Flux. Flux Pens. Flux-Cored Wire. Industrial Flux. Liquid Tabbing Flux
Engineering Web Search: Flip Chip BGA Top
XAPP426: Implementing Xilnx Flip Chip BGA Packages
Note: Packaging R Implementing Xilinx Flip-Chip BGA Packages XAPP426 (v1.3) March 3, 2006 Summary Xilinx flip-chip BGA package is offered for Xilinx
Xilinx PK393 1156 Ball Flip-Chip BGA (FF1155/FFG1155) Package,...
1156 Ball Flip-Chip BGA (FF1155/FFG1155) Package PK393 (v1.0) September 23, 2009 X-Ref Target - Figure 1 UG393_01_091009 ? 2009 Xilinx, Inc. XILINX,
AN 114: Designing with High-Density BGA Packages for Altera...
Pad Sizes for SMD & NSMD Pads Recommended Recommended BGA Pad Opening Solder Ball BGA Pad Pitch SMD Pad Size NSMD Pad Size (A) (mm) Diameter (B) (mm)
Package Information for Stratix II & Stratix II GX Devices
Pins EP2S15 Flip-chip FBGA 484 Flip-chip FBGA 672 EP2S30 Flip-chip FBGA 484 Flip-chip FBGA 672 EP2S60 Flip-chip FBGA 484 Flip-chip FBGA 672 Flip-chip
Flip chip Definition from PC Magazine Encyclopedia
The flip chip (bottom) faces down and is typically attached via solder bumps similar to the larger ones that attach BGA packages to the printed
BGA EDHS-BGA Flip Chip Packages PBGA Home > Products > BGA > Flip Chip Packages
Interaction of the system and module-level thermal phenomena-...
Interaction of the system and module-level thermal phenomena- a flip-chip/BGA example
BGA Reparatur | Flip Chip | Die Bonder Equipment
FINEPLACER® pico amaAutomatischer Flip Chip BonderBis zu 5 µm Platziergenauigkeit Hohe Applikationsflexibilität