Our Sites: GlobalSpec.com | GlobalSpec Electronics | CR4
Free Registration 
Welcome to GlobalSpec!
Find parts, products, suppliers, datasheets, and more for:

Flip Chip Material

 

Find Suppliers by Category

RF and microwave laminates are used as substrates for radio frequency (RF) and microwave communication systems and electronics. They are designed to meet the demanding performance standards for higher-frequency applications.
Search by Specification | Learn More

Products & Services

See also: Featured Products | Technical Articles | Engineering Web Results

Conduct Research Top

  • Simulation and Measurement of High Speed Serial Link Performance in a Dense, Thin Core Flip Chip Package
    type dielectric material. ERTI-06-004 Simulation and Measurement of High Speed Serial Link Performance in Dense Thin Core Flip Chip Package (paper) 02 10 Simulation and Measurement of High Speed Serial Link Performance in a Dense, Thin Core Flip Chip Package. Michael J. Rowlands, Steven G
  • Advanced Thermal Interface Materials for Enhanced Flip Chip BGA
    Increased functionality and performance requirements for microprocessors and ASICs have resulted in a trend to package these devices in the flip-chip BGA form factor (FCBGA). Because these devices use in excess of 40-100 Watts of power, their packages must dissipate heat in an extremely efficient
  • Thermal Enhancement of Systems using Organic Flip-Chip Packages (FC-PBGA) with an Alternate Cooling Path through the Printed Wiring Board
    The thermal performance characteristics of organic flip-chip packages (FC-PBGA) incorporating thin (0.5mm), high interconnect density (dense-core) organic substrates has been studied using 1-D calculations and 3-D numerical analysis. Of particular interest is the ability of the substrate to provide
  • Enhanced Imager Chip Packaging for Automotive Applications (.pdf)
    The development of an automotive qualified packaging technology for CMOS and CCD imager chips is described. A flip-chip-on-flex solution was developed. This package solution was demonstrated using a 1/3 inch optical format imager chip that was designed for use with conventional ceramic leadless
  • The Anisotropy of Dielectric Constant in TLY-5A Material
    Abstract Download PDF. GHz Flip Chip - An Overview. TLY, GHz flip chip assembly. Read Abstract Download PDF. Design and Analysis of an Electrically Steerable Microstrip Antenna for Ground to Air Use. TLY, polarized microstrip antenna, 2.45 GHz, avionics. Read Abstract Download PDF. Antiphase Design
  • Honey, I shrunk the circuit board
    and solderable leads associated with finished ICs saves up to 50% of the surface area required by conventional circuit layouts. The flip-chip process is a successor to COB. The flip-chip technique eliminates the surface area around the IC used for wire bonding. As with COB, flip chip is compatible
  • MICRO:Semicon Southwest '98 - Technical/Business Programs (Oct. '98, p.127)
    . For a complete listing, log onto SEMI's Web site, Flip Chip, BGA, and Packaging I Chairs: Deborah Patterson, Flip Chip; and George Riley, Hycomp Performance of Evaporated and Plated Bumps on Organic and Ceramic Substrates Addi Mistry, Jim Kleffner, John Czarnowski, Tim Scanlon, Jerry Lozano, James Guajardo
  • Integrated cooling system lets chips beat the heat
    . In contrast, Georgia Tech's CMOS-compatible technique works at temperatures <260 C and builds microfluidiccooling channels without damaging attached circuits. The scheme works on gigascale integrated (GSI) chips and is fully compatible with conventional flip-chip packaging. Researchers begin by etching

Engineering Web Search: Flip Chip Material Top