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  • Thermal Enhancement of Systems using Organic Flip-Chip Packages (FC-PBGA) with an Alternate Cooling Path through the Printed Wiring Board
    The thermal performance characteristics of organic flip-chip packages (FC-PBGA) incorporating thin (0.5mm), high interconnect density (dense-core) organic substrates has been studied using 1-D calculations and 3-D numerical analysis. Of particular interest is the ability of the substrate to provide
  • | Electronics Industry News for EEs & Engineering Managers
    is also sampling a next-generation, flip-chip substrate, which promises to lower the cost of flip-chip packages. Hynix pledges to remain independent Wobbly earnings tarnish EDA sector's luster Industry watchers are wondering if the electronic design automation segment, a rare shining star during
  • Medical Device Link .
    , " below) Flip chip packages position the chip face down. Bond pads on the face of the chip are connected by solder bumps to the substrate. This configuration produces a low profile and eliminates the need for wire bonds. A successful flip chip design is potentially less costly than other package
  • Honey, I shrunk the circuit board
    with flexible circuit boards. Unlike COB, however, the raw IC mounts with the contact pads against the circuit board, where they align with contact pads on the substrate. This eliminates bonded wires so other flip chips or reflow-soldered components can be placed within a millimeter of each other

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