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  • Thermal Enhancement of Systems using Organic Flip-Chip Packages (FC-PBGA) with an Alternate Cooling Path through the Printed Wiring Board
    The thermal performance characteristics of organic flip-chip packages (FC-PBGA) incorporating thin (0.5mm), high interconnect density (dense-core) organic substrates has been studied using 1-D calculations and 3-D numerical analysis. Of particular interest is the ability of the substrate to provide
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    expected Optics maker Axsys realigns as semiconductors rebound Optics maker Axsys Technologies realigns businesses as semiconductors rebound Kyocera 'decommits' as supplier of flip-chip substrates for Intel Pentiums Alpha Industries buying Network Device for $141 million in stock AMD offers 850-MHz
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    is also sampling a next-generation, flip-chip substrate, which promises to lower the cost of flip-chip packages. Hynix pledges to remain independent Wobbly earnings tarnish EDA sector's luster Industry watchers are wondering if the electronic design automation segment, a rare shining star during
  • Medical Device Link .
    , " below) Flip chip packages position the chip face down. Bond pads on the face of the chip are connected by solder bumps to the substrate. This configuration produces a low profile and eliminates the need for wire bonds. A successful flip chip design is potentially less costly than other package
  • Honey, I shrunk the circuit board
    and solderable leads associated with finished ICs saves up to 50% of the surface area required by conventional circuit layouts. The flip-chip process is a successor to COB. The flip-chip technique eliminates the surface area around the IC used for wire bonding. As with COB, flip chip is compatible
  • MICRO:Semicon Southwest '98 - Technical/Business Programs (Oct. '98, p.127)
    . For a complete listing, log onto SEMI's Web site, Flip Chip, BGA, and Packaging I Chairs: Deborah Patterson, Flip Chip; and George Riley, Hycomp Performance of Evaporated and Plated Bumps on Organic and Ceramic Substrates Addi Mistry, Jim Kleffner, John Czarnowski, Tim Scanlon, Jerry Lozano, James Guajardo

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