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  • Simulation and Measurement of High Speed Serial Link Performance in a Dense, Thin Core Flip Chip Package
    , like Hyper Transport, Infiniband, PCI Express, RapidIO and SATA, are driving new speed and density specifications for differential signals. This paper will show how to meet these product requirements with a thin core, flip chip, organic package which uses a standard, reasonable-cost, reliable FR-4
  • Dielectric Materials for Use in Radomes
    and is obtained coupled with dielectric constant. Common Materials. There are a variety of materials with dielectric properties used across a number of industries,[4] as described in the introduction. As shown in Chart 1, general trends are based on molecular makeup of the materials. For example

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