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  • Dielectric Materials for Use in Radomes
    Plastics Mfg. Co. LAST-A-FOAM (R) products, flexible foam dielectric data, and general inquiries can be found on our website at References: [1] Ahmad, Z. (2012). Polymer Dielectric Materials, Dielectric Material, Dr. Marius Alexandru Silaghi (Ed.), ISBN: 978-953-51-0764-4, InTech
  • Simulation and Measurement of High Speed Serial Link Performance in a Dense, Thin Core Flip Chip Package
    , like Hyper Transport, Infiniband, PCI Express, RapidIO and SATA, are driving new speed and density specifications for differential signals. This paper will show how to meet these product requirements with a thin core, flip chip, organic package which uses a standard, reasonable-cost, reliable FR-4

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