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Parts by Number Top

Part # Distributor Manufacturer Product Category Description
2011-1X02G00SB Heilind Electronics, Inc. OUPIIN Connectors STANDARD GOLD FLASH PLATING
641146-3 Powell Electronics, Inc. TE Connectivity Not Provided Replacement Contacts; Wire Termination Type = IDC Standard; Gold (15) over Nickel Contact Mating Area Plating Material; Wire Size = 0.2 ² [24] mm ² [AWG]; Used For MTA-156 Connectors;
641145-4 Powell Electronics, Inc. TE Connectivity Not Provided Replacement Contacts; Wire Termination Type = IDC Standard; Gold (30) over Nickel Contact Mating Area Plating Material; Wire Size = 0.3-0.4 ² [22] mm ² [AWG]; Used For MTA-156 Connectors;
641144-3 Powell Electronics, Inc. TE Connectivity Not Provided Replacement Contacts; Wire Termination Type = IDC Standard; Gold (15) over Nickel Contact Mating Area Plating Material; Wire Size = 0.5-0.6 ² [20] mm ² [AWG]; Used For MTA-156 Connectors;
2011-1X02G00SB ASAP Semiconductor Oupiin Not Provided STANDARD GOLD FLASH PLATING

Conduct Research Top

  • BAN-PLT-1.1 NEW Electroless Nickel Gold Plating (c)
    Conventional LTCC material systems offer three standard metallization schemes, silver, gold and a mixed metal. For high reliability projects, the gold system is a common choice. When price is a significant issue the mixed metal system becomes attractive. Unfortunately the mixed metal system can
  • Plating Showerhead System for Improved Backside Wafer Plating
    Plating thickness uniformity can become increasingly difficult to control when migrating from four inch to six inch wafers, especially when plating through-wafer vias with non-cyanide gold bath solution. The standard tooling provided on our four inch plating equipment did not scale adequately
  • Spiral-Wound Rings
    treatment to retard rust. Cadmium plating and phosphate coating are other standard finishes readily available. Specials include black oxide and parkerized finishes. Zinc, chrome, copper, and gold plates are also available. Plating adds approximately 0.002 in. to the maximum ring thickness. Standard rings
  • TA038: High Performance Wideband Amplifiers For Radar And Satcomm Applications
    flexibility in the development of higher power components. The MLP process differs from a more standard wafer processing in that it incorporates the addition of a second low dielectric constant polyimide layer and a second thick gold metallization layer. The additional polyimide layer offers the flexibility
  • Metrigraphics Article in Today's Medical Developments
    itself. So, when you distill it all out, it comes down to a handful of materials that electroplate really well - specifically nickel, nickel-cobalt, gold, and copper.". The chemistries used in the electroplating process are specifically designed to work with various metals to achieve the results they do

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