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  • BAN-PLT-1.1 NEW Electroless Nickel Gold Plating (c)
    Conventional LTCC material systems offer three standard metallization schemes, silver, gold and a mixed metal. For high reliability projects, the gold system is a common choice. When price is a significant issue the mixed metal system becomes attractive. Unfortunately the mixed metal system can
  • Plating Showerhead System for Improved Backside Wafer Plating
    Plating thickness uniformity can become increasingly difficult to control when migrating from four inch to six inch wafers, especially when plating through-wafer vias with non-cyanide gold bath solution. The standard tooling provided on our four inch plating equipment did not scale adequately
  • Spiral-Wound Rings
    treatment to retard rust. Cadmium plating and phosphate coating are other standard finishes readily available. Specials include black oxide and parkerized finishes. Zinc, chrome, copper, and gold plates are also available. Plating adds approximately 0.002 in. to the maximum ring thickness. Standard rings
  • TA038: High Performance Wideband Amplifiers For Radar And Satcomm Applications
    flexibility in the development of higher power components. The MLP process differs from a more standard wafer processing in that it incorporates the addition of a second low dielectric constant polyimide layer and a second thick gold metallization layer. The additional polyimide layer offers the flexibility
  • Metrigraphics Article in Today's Medical Developments
    . Then an electrolytic bath is used to deposit electroplatable metal onto a photographically-produced conductive patterned surface. Once the plating material has been built up - plated-up - to the desired thickness, the electroformed part is stripped away from the master substrate, yielding high-quality

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