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Supplier: Advanced Interconnections Corp.
Description: Advanced's Test Point Pins are precision machined from Brass Copper Alloy can be individually packaged in tape and reel pockets to facilitate automated insertion. To further reduce processing costs when used on surface mount PC boards, Test Pins with unique solder preforms are available.
- Product Type: PCB Pins, Pin Receptacles
- RoHS Compliant: Yes
- Mounting: SMT
- Contact Plating: Gold Plating, Other
Supplier: Lucas Milhaupt Global Brazing Solutions
Description: Soft solders are filler metals that melt and flow below 800° F. They are typically available in solid wire or cored with a rosin or acid flux. Soldering alloys are available in tin, lead, silver, copper, antimony and other compositions and can be fabricated into wire, strip, paste, powder or
- Brazing Filler Alloys: Gold Alloy Braze
- Soldering Filler Alloys: Other
- Form / Shape: Paste, Powder, Preform, Solid Wire, Strip / Sheet / Foil
- Melting Range: 536 F
Supplier: Aeroflex / Metelics
Description: of the chip so additional ground bonding ribbon is not required. The chips may be attached using conductive epoxy or solder preform. Gold contacts on the input and output pads make assembly, using standard bonding equipment, fast and reliable. Custom values and configuration available on request.
- Attenuator Type: Fixed
- Attenuation: 3 dB
- Insertion Loss: 0.3000 dB
- Package Type: Other
Supplier: Morgan Advanced Materials
Description: The Wesgo Metals business of Morgan Technical Ceramics manufactures and supplies high-purity, low vapour pressure brazing alloys in various forms. Precious and non-precious alloys are available in atomized powder, discs, evaporation slugs, extrudable paste, FlexibrazeTM, preforms, ribbon, rings
- Brazing Filler Alloys: Gold Alloy Braze
- Form / Shape: Paste, Powder, Solid Wire, Strip / Sheet / Foil
- Melting Range: 1947 F
Supplier: Fiberguide Industries, Inc.
Description: Optical fibers are typically manufactured from a preform consisting of a silica core which may be doped silica or pure silica and a cladding classically of silica having a lower refractive index than the core. An additional layer or coating/buffer is added to prevent the ingress of moisture
- Light Guide Type: Fiber Optic
- Angle: Flexible
- Diameter: 0.0118 inch
- Wavelength Range: 400 to 2400 nm
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Solder Preform Placement...SUPER-FAST
Indium Corporation - Solder preform placement is tremendously faster using InTEGRATED ® SOLDER PREFORMS. Don't fumble with every single preform when you can place tens, or hundreds, in one simple motion. Used in a variety of applications that require precise amounts of solder, dimensions can be held to tight tolerances to assure volume accuracy. Scroll down to see the video demonstration - it's FAST. Solder preforms are available in a variety of alloys, including indium, gold, tin, lead... (read more)
Browse Solder Datasheets for Indium Corporation
Lucas Milhaupt Global Brazing Solutions
Fundamentals of Brazing Course
base materials and heating methods will also be presented. Brazing Design - an overview of a standard braze joint design. Braze Filler Metals - an overview look at various braze filler metals groups available including silver, copper, gold, aluminum and nickel based alloys, their use and application. Preform Design - an overview of various forms of braze filler metals available on the market today in terms of improved productivity and lower cost. Learning Objectives - The material covered... (read more)
Browse Braze and Brazing Alloys Datasheets for Lucas Milhaupt Global Brazing Solutions
Adding Solder to a NanoBond® Assembly
spray, plating, and HASL (hot air solder leveling) are just a few of the options. Coating the parts that will later be bonded tends to make assembly a bit easier. Solder Preforms. If the parts have a gold or silver surface finish already, a thin solder preform is a very simple way to apply solder in the assembly. Preforms are sold as custom-shaped foil for your application. NanoFoil ® Coating. Although Sn is the most popular solder coating for NanoFoil ®, it has been custom plated... (read more)
Browse Nanomaterials Datasheets for Indium Corporation
Advanced Interconnections Corp.
Highly-Reliable Screw-Machined Terminals and Pins
Nurl-Loc ® Insertion Tools, Non-insulated, Feed-thru, Standoff Terminals, and Test Jacks. More information... Our patented solder preform terminals eliminate the need for wave soldering in mixed technology applications. Wide variety of multi-finger contacts available to suit your application. Customized pin designs available upon request. Available with Gold/Gold or Matte Tin/Gold plating for lead-free compatible processing. Quick Links for our Terminals and Test Jacks Products: Overview... (read more)
Browse PCB Pins and Receptacles Datasheets for Advanced Interconnections Corp.
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Gold and Aluminum Buffered Optical Fibers - What, Why, and Where (.doc)
Optical fibers are typically manufactured from a preform consisting of a silica core which may be doped silica or pure silica and a cladding classically of silica having a lower refractive index than the core. An additional layer or coating/buffer is added to prevent the ingress of moisture
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Some Considerations of the Gold-Silicon Die Bond Based on Surface Chemical Analysis
4.4 Die- Gold Preform - Substrate Diffusion Couple The basic difficulties with the Au-Si preform die attach method can be summarized as follows: (1) the silicon-at the preform surfaces oxidizes during heat- up and liquid formation (2) the liquid preform …
Analysis of a Silver Substrate, Gold-Silicon Preform, Die Attach System
It usually consists of a header substrate which has a layer of gold metalliza- tion over the top surface pad, a gold preform con- taining approximately 2% by weight silicon and .
Chip-Bond Process Control with Computer Vision
2.1.1 Absence of Chip In absence of the chip, the field -of -view contains the rectangular gold preform in the carrier well, used in the bonding process.
Failure analysis of die-attachment on static random access memory (SRAM) semiconductor devices
… n u m b e r of rejects due to die cracking in the die-attachment can be minimized if (1) production die and new frames are used, (2) 100% eutectic coverage is performed, (3) no gold preforms is a d d …
Attaining Low Moisture Levels in Hermetic Packages
The inclusion of a gold preform or an unbonded chip in the cavity, or the simulation of a die bond thermal excursion without the chip or preform being present, will result in a high moisture content (> 1000 ppmv).
AES/ESCA/SEM/EDX Studies of Die Bond Materials and Interfaces
In addition to Au-Si alloy preforms, pure gold preforms are also used.
Thermocompression bonding of external package leads on integrated circuit substrates
gold preform between the lead head and the substrate.
A process for prevention of low temperature oxide growth over gold coated backside of silicon wafer
Effectiveness of this treatment was demonstrated by improved wetting of an aged, alloyed film with melted gold preform used in gold-silicon eutectic die bonding compared with a non-alloyed specimen.
Self-Organized Nanoscale Materials
Cobalt-shell gold-core (CoshellAucore) bimetallic nanoparticles could be obtained by polyol reduction of Co ions in the presence of gold preformed nanoparticles.29 .
Gold-silicon fiber shorts in VLSI devices
Hoge and Thomas 131, while advocating a pure gold preform to minimize oxidation, emphasize that close process control is also required to achieve reliable bonding.
Low-temperature electrical characteristics of the Au/Si interface
Next a piece of gold preform is placed on the package.
LSI Packaging that Passes PIND Test
In addition a gold preform , 99.99 percent pure measuring approximately 2.54 X 3.81 X 0.0254 mm thick (Fig. .1(d)), ‘is used.
18 and 22 carat, all yellow hues, plus 990 gold Preform : .
Alignable lift-off transfer of device arrays via a single polymeric carrier membrane
Pure gold preforms are placed in contact with the Si of the die underside.