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  • Gold and Aluminum Buffered Optical Fibers - What, Why, and Where (.doc)
    to +400°C. Tight buffered Gold coated fibers have a rated operating range of -269ºC to +700º C.
  • Adding Solder to a NanoBond (R) Assembly
    , and HASL (hot air solder leveling) are just a few of the options. Coating the parts that will later be bonded tends to make assembly a bit easier. Solder Preforms. If the parts have a gold or silver surface finish already, a thin solder preform is a very simple way to apply solder in the assembly
  • The Miracle of Soldering - an Historical Perspective
    . Indium8.9 Series. Lead-Free. Tin-Lead. Package-on-Package Paste. Low Temp/High Temp. Die-Attach. Wafer Bumping Paste. Solder Fortification (R). Gold-Based Solder Paste. Solders. Bismuth Solders. Gold Solders. Indium Solders. Bar Solder. Low Temp/High Temp. Preforms. Ribbon and Foil. Solder
  • Humidity and Solder Paste - Avoid Issues
    /High Temp. Die-Attach. Wafer Bumping Paste. Solder Fortification (R). Gold-Based Solder Paste. Solders. Bismuth Solders. Gold Solders. Indium Solders. Bar Solder. Low Temp/High Temp. Preforms. Ribbon and Foil. Solder Fortification (R). Spheres. Tape and Reel Packaging. Solder Paste and Powders. Wire
  • Solder Powder: IPC
    . Low Temp/High Temp. Die-Attach. Wafer Bumping Paste. Solder Fortification (R). Gold-Based Solder Paste. Solders. Bismuth Solders. Gold Solders. Indium Solders. Bar Solder. Low Temp/High Temp. Preforms. Ribbon and Foil. Solder Fortification (R). Spheres. Tape and Reel Packaging. Solder Paste
  • Diode Chips, Beam-Lead Diodes, Capacitors: Bonding Methods and Packaging
    in plastic chip trays containing up to. Gold Dot. 400 individual devices. The chips may be removed from the tray. Vacuum. and positioned for inspection or bonding using tweezers or a. Pick–up. Metalized. vacuum pickup. Particular care must be exercised to avoid any. Gold Back. Contact. Solder Preform
  • Secure Attachment in Pulsed Power Applications
    and. leaded Resistors. Construction “A” consists of a Copper/Tungsten (Cu/W) flange with. Gold/Germanium (Au/Ge) preforms and .060” thick BeO, 270-ohm chip resistor with leads. Construction “B” consists of a Copper (Cu) flange with Lead/Silver preforms and .060” thick BeO,. 270-ohm chip resistor
  • How to Reduce Voiding in Components with Large Pads
    as Experiment Design. When scanned with a smart phone’s. vias at the location of the PCB board. The PCB board used in the experiment. camera (via a QR reader application), it wil. where the QFN is mounted. The big. is a nickel-gold board with a thickness. take you to a specific URL or text message. thermal

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