Supplier: Aeroflex / Metelics
Description: of the chip so additional ground bonding ribbon is not required. The chips may be attached using conductive epoxy or solder preform. Gold contacts on the input and output pads make assembly, using standard bonding equipment, fast and reliable. Custom values and configuration available on request.
- Attenuator Type: Fixed
- Package Type: Other
Supplier: Morgan Advanced Materials
Description: The Wesgo Metals business of Morgan Technical Ceramics manufactures and supplies high-purity, low vapour pressure brazing alloys in various forms. Precious and non-precious alloys are available in atomized powder, discs, evaporation slugs, extrudable paste, FlexibrazeTM, preforms, ribbon, rings
- Brazing Filler Alloys: Gold Alloy Braze
- Form / Shape: Paste, Powder, Solid Wire, Strip / Sheet / Foil
Supplier: Fiberguide Industries, Inc.
Description: Optical fibers are typically manufactured from a preform consisting of a silica core which may be doped silica or pure silica and a cladding classically of silica having a lower refractive index than the core. An additional layer or coating/buffer is added to prevent the ingress of moisture
- Angle: Flexible
- Core Material: Silica / Quartz
- Light Guide Type: Fiber Optic
Supplier: Advanced Interconnections Corp.
Description: Advanced's Test Point Pins are precision machined from Brass Copper Alloy can be individually packaged in tape and reel pockets to facilitate automated insertion. To further reduce processing costs when used on surface mount PC boards, Test Pins with unique solder preforms are available.
- Product Type: PCB Pins, Pin Receptacles
- RoHS Compliant: Yes
- Contact Plating: Gold Plating, Other
- Mounting: SMT
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Featured Products for Gold Preform Top
Solder Preform Placement...SUPER-FAST
Indium Corporation - Solder preform placement is tremendously faster using InTEGRATED ® SOLDER PREFORMS. Don't fumble with every single preform when you can place tens, or hundreds, in one simple motion. Used in a variety of applications that require precise amounts of solder, dimensions can be held to tight tolerances to assure volume accuracy. Scroll down to see the video demonstration - it's FAST. Solder preforms are available in a variety of alloys, including indium, gold, tin, lead... (read more)
Browse Solder Datasheets for Indium Corporation
Solder Alloys...Gold Based Advantages
. Gold-based solder alloys are used for medical products, as well as for aerospace, defense, package sealing, optics, and specialty MEMS packaging. Gold-based alloys can be processed in a variety of soldering applications, including vacuum solder, die-attach, reflow, laser soldering, vapor phase reflow, and manual soldering. Indium Corporation offers gold-based alloys in a variety of forms, including solder paste, solder preforms, solder wire, and solder spheres. Visit Indium Corporation at IMAPS... (read more)
Browse Semiconducting Materials Datasheets for Indium Corporation
Adding Solder to a NanoBond® Assembly
spray, plating, and HASL (hot air solder leveling) are just a few of the options. Coating the parts that will later be bonded tends to make assembly a bit easier. Solder Preforms. If the parts have a gold or silver surface finish already, a thin solder preform is a very simple way to apply solder in the assembly. Preforms are sold as custom-shaped foil for your application. NanoFoil ® Coating. Although Sn is the most popular solder coating for NanoFoil ®, it has been custom plated... (read more)
Browse Nanomaterials Datasheets for Indium Corporation
Lucas Milhaupt Global Brazing Solutions
Fundamentals of Brazing Course
base materials and heating methods will also be presented. Brazing Design - an overview of a standard braze joint design. Braze Filler Metals - an overview look at various braze filler metals groups available including silver, copper, gold, aluminum and nickel based alloys, their use and application. Preform Design - an overview of various forms of braze filler metals available on the market today in terms of improved productivity and lower cost. Learning Objectives - The material covered... (read more)
Browse Braze and Brazing Alloys Datasheets for Lucas Milhaupt Global Brazing Solutions
Advanced Interconnections Corp.
Low Insertion Force PGA Sockets
PGA footprints available. Standard, interstitial, and custom designs available. Closed bottom terminal for 100% anti-wicking of solder. Tapered entry for ease of insertion. Available with solder preform terminals for intrusive reflow applications (eliminates need for wave soldering in mixed SMT/Thru-hole environments. Available with Gold/Gold or Matte Tin/Gold plating for lead-free compatible processing. About Advanced Interconnections: Advanced Interconnections Corp. is an ISO 9001 Certified... (read more)
Browse IC Sockets and Headers Datasheets for Advanced Interconnections Corp.
Advanced Interconnections Corp.
Highly-Reliable Screw-Machined Terminals and Pins
Nurl-Loc ® Insertion Tools, Non-insulated, Feed-thru, Standoff Terminals, and Test Jacks. More information... Our patented solder preform terminals eliminate the need for wave soldering in mixed technology applications. Wide variety of multi-finger contacts available to suit your application. Customized pin designs available upon request. Available with Gold/Gold or Matte Tin/Gold plating for lead-free compatible processing. Quick Links for our Terminals and Test Jacks Products: Overview... (read more)
Browse PCB Pins and Receptacles Datasheets for Advanced Interconnections Corp.
Conduct Research Top
Gold and Aluminum Buffered Optical Fibers - What, Why, and Where (.doc)
to +400°C. Tight buffered Gold coated fibers have a rated operating range of -269ºC to +700º C.
Adding Solder to a NanoBond (R) Assembly
, and HASL (hot air solder leveling) are just a few of the options. Coating the parts that will later be bonded tends to make assembly a bit easier. Solder Preforms. If the parts have a gold or silver surface finish already, a thin solder preform is a very simple way to apply solder in the assembly
Humidity and Solder Paste - Avoid Issues
/High Temp. Die-Attach. Wafer Bumping Paste. Solder Fortification (R). Gold-Based Solder Paste. Solders. Bismuth Solders. Gold Solders. Indium Solders. Bar Solder. Low Temp/High Temp. Preforms. Ribbon and Foil. Solder Fortification (R). Spheres. Tape and Reel Packaging. Solder Paste and Powders. Wire
The Miracle of Soldering - an Historical Perspective
. Indium8.9 Series. Lead-Free. Tin-Lead. Package-on-Package Paste. Low Temp/High Temp. Die-Attach. Wafer Bumping Paste. Solder Fortification (R). Gold-Based Solder Paste. Solders. Bismuth Solders. Gold Solders. Indium Solders. Bar Solder. Low Temp/High Temp. Preforms. Ribbon and Foil. Solder
Solder Powder: IPC
. Low Temp/High Temp. Die-Attach. Wafer Bumping Paste. Solder Fortification (R). Gold-Based Solder Paste. Solders. Bismuth Solders. Gold Solders. Indium Solders. Bar Solder. Low Temp/High Temp. Preforms. Ribbon and Foil. Solder Fortification (R). Spheres. Tape and Reel Packaging. Solder Paste
Diode Chips, Beam-Lead Diodes, Capacitors: Bonding Methods and Packaging
in plastic chip trays containing up to. Gold Dot. 400 individual devices. The chips may be removed from the tray. Vacuum. and positioned for inspection or bonding using tweezers or a. Pick–up. Metalized. vacuum pickup. Particular care must be exercised to avoid any. Gold Back. Contact. Solder Preform
Secure Attachment in Pulsed Power Applications
and. leaded Resistors. Construction “A” consists of a Copper/Tungsten (Cu/W) flange with. Gold/Germanium (Au/Ge) preforms and .060” thick BeO, 270-ohm chip resistor with leads. Construction “B” consists of a Copper (Cu) flange with Lead/Silver preforms and .060” thick BeO,. 270-ohm chip resistor
How to Reduce Voiding in Components with Large Pads
as Experiment Design. When scanned with a smart phone’s. vias at the location of the PCB board. The PCB board used in the experiment. camera (via a QR reader application), it wil. where the QFN is mounted. The big. is a nickel-gold board with a thickness. take you to a specific URL or text message. thermal