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  • Gold and Aluminum Buffered Optical Fibers - What, Why, and Where (.doc)
    to +400°C. Tight buffered Gold coated fibers have a rated operating range of -269ºC to +700º C.
  • Adding Solder to a NanoBond (R) Assembly
    , and HASL (hot air solder leveling) are just a few of the options. Coating the parts that will later be bonded tends to make assembly a bit easier. Solder Preforms. If the parts have a gold or silver surface finish already, a thin solder preform is a very simple way to apply solder in the assembly
  • Humidity and Solder Paste - Avoid Issues
    /High Temp. Die-Attach. Wafer Bumping Paste. Solder Fortification (R). Gold-Based Solder Paste. Solders. Bismuth Solders. Gold Solders. Indium Solders. Bar Solder. Low Temp/High Temp. Preforms. Ribbon and Foil. Solder Fortification (R). Spheres. Tape and Reel Packaging. Solder Paste and Powders. Wire
  • The Miracle of Soldering - an Historical Perspective
    . Indium8.9 Series. Lead-Free. Tin-Lead. Package-on-Package Paste. Low Temp/High Temp. Die-Attach. Wafer Bumping Paste. Solder Fortification (R). Gold-Based Solder Paste. Solders. Bismuth Solders. Gold Solders. Indium Solders. Bar Solder. Low Temp/High Temp. Preforms. Ribbon and Foil. Solder
  • Solder Powder: IPC
    . Low Temp/High Temp. Die-Attach. Wafer Bumping Paste. Solder Fortification (R). Gold-Based Solder Paste. Solders. Bismuth Solders. Gold Solders. Indium Solders. Bar Solder. Low Temp/High Temp. Preforms. Ribbon and Foil. Solder Fortification (R). Spheres. Tape and Reel Packaging. Solder Paste
  • Secure Attachment in Pulsed Power Applications
    and. leaded Resistors. Construction “A” consists of a Copper/Tungsten (Cu/W) flange with. Gold/Germanium (Au/Ge) preforms and .060” thick BeO, 270-ohm chip resistor with leads. Construction “B” consists of a Copper (Cu) flange with Lead/Silver preforms and .060” thick BeO,. 270-ohm chip resistor
  • How to Reduce Voiding in Components with Large Pads
    as Experiment Design. When scanned with a smart phone’s. vias at the location of the PCB board. The PCB board used in the experiment. camera (via a QR reader application), it wil. where the QFN is mounted. The big. is a nickel-gold board with a thickness. take you to a specific URL or text message. thermal
  • Room Temperature LED and D-Pak Type Component-Attach and Reliability Testing (.pdf)
    necessary to melt the tin solder. with silver-, gold-, and enig-plated sur-. standard that LEDs bonded with Nano-. Upon cooling, the tin solidifies and cre-. faces to create a bond. Foil must strive for, understanding the. From one engineer To Another®. 2. Indium Corporation Tech Paper. “look

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