Hard Water Etches

Conduct Research

• MICRO: Wet Surface tech
  , etch-masking properties, and stability. The stability of Si films allows the material to be used for such elements as gate spacers, etch and CMP stops, antireflective coatings, barriers, and hard masks. In next-generation devices, Si will continue to be a critical material for device fabrication...
• Chemical Switch Cuts Costs, Improves Safety (.pdf)
  in the NOx scrubber at the end of its dedicated aluminum precleaning process. Used to prepare a cast aluminum cylinder for a small engine for hard chromium plating, the automated line cleans and etches the parts using various cleaner and acid baths. 1105sol1.indd solutions. Reprinted From: Technology...
• Blasted away
  . They include detailed patterns and shapes such as channels, surface pads, cavities, and surface texture. PMP can also deeply etch lowdensity materials and remove large amounts of material quickly. It can quickly form array patterns of holes in thin wafer materials as well as permanently engrave hard-to-mark...
• MICRO:Product Technology News (June '99)
  1338) The dual-frequency Exelan dielectric etch system for processing 0.18-um devices has a streamlined design that features a single RF power supply and fixed-gap chamber that minimize components. Hard-mask opening, inorganic and organic ARC etching, and photoresist stripping are performed in situ...
• MICRO:Top 40 (Nov '99)
  shallow trench isolation, the system is capable of etching layers on deep-submicron memory, flash, microprocessor, and logic devices where nitride hard mask is used as a CMP-stopping layer. The tool's chamber design ensures that films on both sides of the wafer are etched simultaneously in the chemical...
• MICRO:Top 40 (Nov '99)
  for high-throughput batch wet benches, the process tool uses an ICP source to generate fluorine-based dry process chemistries. Targeted for use after shallow trench isolation, the system is capable of etching layers on deep-submicron memory, flash, microprocessor, and logic devices where nitride hard mask...
• MICRO: Materials Integration
  product performance that is as good as or better than that of the non-wet-clean process of record (POR). The test vehicle used in these experiments was a single-damascene structure. The structure consisted of an integrated stack that had a porous dielectric film capped with an SiC/SiO dual hard mask...
• MICRO: Technical Viewpoint
  on the wafer surface than was previously the case. Figure 1 shows typical data from good test wafers that had been processed on a Mirra Mesa polisher from Applied Materials (Santa Clara, CA) using a 711 hard porous pad from Thomas West (Sunnyvale, CA) and 2585 slurry from Cabot (Aurora, IL). The data...
• MICRO: Surface Conditioning - Hakanson (March 2000)
  in the brushes, while residual slurry can cause reliability problems and early failure issues in both semiconductor devices and hard-drive heads. Moreover, the relatively large bristles of nylon brushes are not able to clean etched features (trenches) on the wafer surface. In hard-drive head...
• MICRO:Product Technology News (Feb 99)
  fluorine-based dry process chemistries. Targeted for use after shallow trench isolation, the system is capable of etching layers on deep-submicron memory, flash, microprocessor, and logic devices where nitride hard mask is used as a CMP-stopping layer. The tool's chamber design ensures that films...

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