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  • Polishing Mechanism of Glass Substrates with its Processing Characteristics by Cerium Oxide and Manganese Oxide Slurries
    With an aim to reduce the consumption of cerium oxide (CeO2) used in large quantity for the polishing of glass substrates applied for HDD and display, we have attempted to obtain the processing characteristics of glass substrates by CeO2 slurry .
  • Handbook of Manufacturing Engineering and Technology
    Recently polishing of glass sub- strates for HDD was attempted using the bell-jar-type closed CMP machine, as a part of the �development of materials for rare earth replacement� by NEDO (New Energy and Industrial Technology Development Organization). � example of a relationship between the removal rate of glass substrate by ceria slurry and the ambient �
  • Advanced Tribology
    This is the lowest roughness value reported on HDD substrates. However, the MRR of Disk-A sample by Slurry A is about 12% higher than that of � During polishing process, the nano-silica particles may segregate, and some of them become bonded with polishing �
  • Key Engineering Materials
    Polishing Mechanism of Glass Substrates with its Processing Characteristics by Cerium Oxide and Manganese Oxide Slurries � cerium oxide (CeO2) used in large quantity for the polishing of glass substrates applied for HDD and...
  • Scientific.Net: Materials Science
    Polishing Mechanism of Glass Substrates with its Processing Characteristics by Cerium Oxide and Manganese Oxide Slurries � cerium oxide (CeO2) used in large quantity for the polishing of glass substrates applied for HDD and...
  • Scientific.Net: Materials Science
    Polishing Mechanism of Glass Substrates with its Processing Characteristics by Cerium Oxide and Manganese Oxide Slurries � cerium oxide (CeO2) used in large quantity for the polishing of glass substrates applied for HDD and...
  • Scientific.Net: Materials Science
    Effects of Friction Modifier Additives on HDD Substrate Defects and Surface Topography during CMP Abstract:This study investigates the effects of Friction Modifier Additives (FMA) added into the polishing slurry on Aluminium Nickel Phosphorous...
  • Scientific.Net: Materials Science
    Effects of Friction Modifier Additives on HDD Substrate Defects and Surface Topography during CMP Abstract:This study investigates the effects of Friction Modifier Additives (FMA) added into the polishing slurry on Aluminium Nickel Phosphorous...
  • Physics and tribology of chemical mechanical planarization
    Manipulation of the CMP slurry formulation allows different levels of PTR: a zero PTR slider in figure � Transducer damage can result in a serious malfunction of a HDD system. . Relative speeds of a wafer against a polishing pad under specific rotation speeds of a carrier and �
  • Ultra-Precision Machining Technologies, CJUMP2011
    Keywords: chemical mechanical polishing (CMP), pad groove pattern, slurry flow behavior, trajectory of slurry flow, moving target indicator (MTI) processing CMP is introduced into manufacture of glass substrate using HDD , and frequently uses large amount of CeO2 �


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