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Heat Conductive Interface
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Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product.
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Supplier: Wacker Chemical Corp.Description: and + 180 °C Low modulus Low bleeding, low volatile Application Interface material for heat sink applications for the electronics industry
- Compound Type: Thermal Compound / Heat Conductive
- Cure Type / Technology: Two Component System, RTV / Room Temperature Curing
- Features: Electrical Insulation / Dielectric Material
- Industry: Electronics
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Supplier: Aremco Products, Inc.Description: Thermal grease, offers exceptional thermal and electrical properties
- Compound Type: Thermally Conductive
- Material Form: Grease / Paste
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Industry Applications: OEM / Industrial
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Supplier: Thermon Manufacturing Co.Description: T-99 is a specialty heat transfer compound formulated to provide exceptional thermal stability and superior bonding strength up to 1832°F (1000°C). Maximum exposure temperature 1832°F (1000°C)
- Compound Type: Thermally Conductive
- Material Form: Grease / Paste
- Cure Type / Technology: Single Component System
- Electrical / Electronics Applications: Electrical Power / HV (Coils, Motors)
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Supplier: Nye Lubricants, Inc.Description: Overview Heat sink compounds or thermal greases, are wide-temperature, grease-like materials that are used to conduct thermal energy away from sensitive components to larger ventilated areas or to heat measuring and controlling instruments. The plasticity of the heat sink compound or thermal
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Supplier: Ellsworth AdhesivesDescription: LOCTITE 383 is a thermally conductive adhesive system designed for bonding heat generating components to heat sinks. This item does not ship on Fridays!
- Material Type: Grease / Paste
- Industry: Semiconductors / IC Packaging
- Chemical / Polymer System Type: Acrylic / Polyacrylate
- Composition: Unfilled
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Supplier: Hernon Manufacturing, Inc.Description: Tuffbond epoxies offer substantial moisture, chemical, and heat resistance. Use for bonding: wood, metal, ceramic, glass, plastic, masonry, stone, concrete, rubber, etc. Provides high shear strength for tough and durable bonds. Surfaces to be bonded must be clean and free of oil. Tuffbond epoxies
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Supplier: Allied Electronics, Inc.Description: AC Outlet Analyzer and Wrist Strap Tester Designed for use in transferring heat away from electrical and electronic devices such as; transistors, power diodes, semi-conductors, ballasts and thermocouple wells. High thermal conductivity, high dielectric constant, high dissipation factor, use
- Compound Type: Thermally Conductive
- Material Form: Grease / Paste
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Supplier: Comus InternationalDescription: Thermal Pad Features * Thermal impedance : 0.22°C-in²/W (@50 psi) * Maximum heat transfer * Aluminium foil coated both sides * Designed to replace thermal grease The TPQ2 - 1 is a composite of .0015" aluminium foil coated on both sides with .0025" thermally/electrically conductive
- Device: Passive Heat Sink
- Heat Sink Fin Style: Straight Fin
- Mounting: Mounting Holes
- Material: Aluminum
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Supplier: Acrolab Ltd.Description: Isopaste is a high-temperature thermal bridging compound used in Acrolab's Isoplatens and Heat Transfer Tools to act as a heat conductor in the Isobar® Heat Pipe channels. It comes in three stock sizes: 4oz., 8oz., and 16oz. cans. Larger quantities can be arranged with your Acrolab Engineering
- Substrate / Material Compatibility: Metal, Other
- Features: Thermal Compound / Interface (Thermally Conductive)
- Industry: OEM / Industrial, Other
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Supplier: Sauereisen, Inc.Description: Sauereisen Adhesive Paste No. 19 is an inorganic, odorless, nontoxic cement used for bonding glass, porcelain, wood, felt, cork, metals and ceramic fiber. Some typical applications inculde protection of exposed metal surfaces during heat treating, bonding wallboard to brick or concrete
- Compound Type: Thermally Conductive
- Material Form: Die Bonding Adhesive / Compound, Grease / Paste
- Cure Type / Technology: Single Component System
- Industry Applications: OEM / Industrial
Featured Products for Heat Conductive Interface Top
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Gap Pad VO is a cost-effective, thermally conductive interface material.The material is a filled, thermally conductive polymer supplied on a rubber-coated fiberglass carrier allowing for easy material handling.The conformable nature of Gap Pad VO allows the pad to fill in air gaps between PC boards and heat sinks or a metal chassis. Note: Resultant thickness is defined as the final gap thickness of the application. Features and Benefits. Thermal conductivity: 0.8 W/m-K. Enhanced puncture, shear... (read more)Browse Conductive Compounds Datasheets for Quist Electronics -
reinforced for puncture, shear and tear resistance. Typical Applications Include: Computer and peripherals. Telecommunications. Heat interfaces to frames, chassis, or other heat spreading devices. RDRAM ™ memory modules / chip scale packages. CDROM / DVD cooling. Areas where irregular surfaces need to make a thermal interface to a heat sink. DDR SDRAM memory modules. FBDIMM modules. Configurations Available: Sheet form, die-cut parts, and roll form (converted or unconverted). Data Sheet... (read more)Browse Thermal Compounds and Thermal Interface Materials Datasheets for Quist Electronics
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330P offers excellent handling and consistent liner peel-off characteristics. The material is designed for use between a high power electronic component requiring electrical isolation and its heat sink. Hi-flow 330P's thermal performance is exceptional with a thermal impedance of 0.17ºC-in²/W at 50 psi. Bergquist recommends the use clips or springs for phase change materials to assure constant pressure between the component interface and the heat sink. Contact us for further information, or view... (read more)Browse Thermal Compounds and Thermal Interface Materials Datasheets for Quist Electronics
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Gap Filler 1000 is a thermally conductive, liquid gap filling material. It is supplied as a twocomponent, room or elevated temperature curing system.The material is formulated to provide a balance of cured material properties highlighted by a low modulus and good compression set (memory).The result is a soft, thermally conductive, form-in-place elastomer ideal for coupling "hot" electronic components mounted on PC boards with an adjacent metal case or heat sink. Before cure, Gap Filler 1000... (read more)Browse Thermal Compounds and Thermal Interface Materials Datasheets for Quist Electronics
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Gap Filler 2000 is a high performance, thermally conductive, liquid gap filling material supplied as a two-component, room or elevated temperature curing system.The material provides a balance of cured material properties and good compression set (memory).The result is a soft, form-in-place elastomer ideal for coupling "hot" electronic components mounted on PC boards with an adjacent metal case or heat sink. Before cure, it flows under pressure like grease.After cure, it won't pump from... (read more)Browse Conductive Compounds Datasheets for Quist Electronics
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48A43X008 functional product specifications: Flame Rating (UL94) V-0. Relative Thermal Index 150oC. Thermal Impedance (50oC, 3 MPa) 0.26 (in2-Co)/W. Dielectric Breakdown Strength 640 V/mil. Durometer (rubber only) 77 SAP. Operating Temperature -100 to 204oC. Evaluation samples are available from www.Arlon-STD.com. Ask for 48A43X008 or speak to a regional Sales Engineer for product recommendations specific to your unique application. (read more)Browse Thermal Compounds and Thermal Interface Materials Datasheets for Arlon LLC - Silicone Technologies Division
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As industry demands that electronic packages continue to become smaller and more compact, the need to address the heat generated by these small devices continues to increase. Dissipating this heat and removing it from the unit is a key factor in the performance and longevity of many devices. ITW Insulcast manufactures a number of materials that provide superior heat transfer and thermal conductivity characteristics to meet these demanding requirements. These materials draw heat out from... (read more)Browse Thermal Compounds and Thermal Interface Materials Datasheets for ITW Polymer Technologies - Insulcast Division
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applications. Hi-Flow 650P is designed for use between a high-power electrical device requiring electrical isolation from the heat sink and is ideal for automated dispensing systems. Bergquist recommends the use of spring clips to assure constant pressure with the component interface and the heat sink. Please refer to the TO-220 thermal performance data to determine the nominal spring pressure for your application. Typical Applications Include. Spring / clip-mounted devices. Discrete power semiconductors... (read more)Browse Thermal Compounds and Thermal Interface Materials Datasheets for Quist Electronics
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Alpha Gel, while preserving its inherent softness and tackiness, turns into more multi-functional material with some compatible fillers. One such application is the invention of soft, high performance thermal conductivity gel ( sheet-type and past-type ). Its conformable flexibility has proven to help to minimize heat resistance. RE-100/RE-100H with electromagnetic absorption characteristics on top of thermal conductivity, is also a variation in the material. For the latest sheet-type PDF... (read more)Browse Thermal Compounds and Thermal Interface Materials Datasheets for TAICA Corporation (formerly Geltec Co., Ltd.)
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contractors. Secure ™ adhesives have been developed specifically for LED and Power applications where long-term reliability is a top concern. Secure ™ adhesives form chemical bonds with the substrates they are in contact with during cure to produce robust adhesion that is resistant to heat, humidity, and shock. This eliminates the need for mechanical fasteners and concern with screws coming loose, clips loosing clamping force, gap pads taking a compression set, or thermal greases... (read more)Browse Thermal Compounds and Thermal Interface Materials Datasheets for Arlon LLC - Silicone Technologies Division
Parts by Number for Heat Conductive Interface Top
| Partb # | Distributor | Manufacturer | Product Category | Description |
|---|---|---|---|---|
| MMM88052X36 | Amazon | 3M | Industrial & Scientific | 3M 8805 Thermally Conductive Double-Sided Bonding Tape, 0.005" Thick, 2" x 36 yards, Dual Film Liners |
| MMM88102X36 | Amazon | 3M | Industrial & Scientific | 3M 8810 Thermally Conductive Double-Sided Bonding Tape, 0.010" Thick, 2" x 36 yards, Dual Film Liners |
Conduct Research Top
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Designing to beat the heat
A new family of polymers can replace metals, ceramics, and conventional plastics in heatsensitive applications. Edited by Jean M. Hoffman The choice of plastic used in the bobbin is dictated by how hot the winding gets during service. With thermally conductive plastics, heat generated
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Designing to beat the heat
A new family of polymers can replace metals, ceramics, and conventional plastics in heatsensitive applications. The choice of plastic used in the bobbin is dictated by how hot the winding gets during service. With thermally conductive plastics, heat generated by the winding spreads throughout
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Solving for heat, stress, flow, and more
A few guidelines help handle complex simulation problems with modern analysis software. The sooner an engineering team understands the physical processes behind a proposed product, the sooner its problems can be identified and solved. These problems can be a combination of heat, stress, flow
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Thermal Interface Materials (.pdf)
tested. Thermal Interface Materials ®. Hoja de Datos de Producto. Thermal Interface Materials. Thermal Inter face Materials (TIMs) are used to. Grease. effi ciently transmit heat from an area of high. Thermally conductive greases are commonly. thermal energy to an area of lower thermal
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Thermal Interface Materials - A Brief Overview
power to the electronic component introduces the needed heat for the phase change to occur, establishing a stable thermal joint. These materials consist of organic binders (i.e., a polymer and a low-melt-point crystalline component, such as a wax), thermally conductive ceramic fillers
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Achieving conduction heat transfer for commercial AdvancedMCs in a rugged MicroTCA System
panel. The EMI gasket needs to be removed as it can cause interference in the adjacent module and is not required since EMI is contained by the clamshell and additional EMI containment is usually provided at the chassis level. Figure 1: Heat is transferred through thermally conductive gap material
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Shielding Touchscreens from EMI
The pros and cons of thin-film conductive coatings and fine conductive grid solutions. Shielding touchscreens from EMI - Electronic Products. Friday, December 9, 2011 Sign In | Register AllFeature Article Product Reference DesignVideo. Home. Articles. Products. News
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Power Modules-How to Avoid Errors When Applying Thermal Paste (.pdf)
normally consist of a plastic carrier materi-. al (e.g. silicon oil) and thermal conductive filler substances such as. zinc oxide, graphite or silver. They are available in the form of pastes,. adhesives, phase-change materials and foils. Thermal interface. materials conduct heat better than air
Engineering Web Search: Heat Conductive Interface Top
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Heat sink - Wikipedia, the free encyclopedia
Heat sink attachment methods and thermal interface materials also affect the eventual die temperature of the integrated circuit.
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Thermal grease - Wikipedia, the free encyclopedia
called thermal gel, thermal compound, thermal paste, heat paste, heat sink paste or heat sink compound) is a viscous fluid substance, originally with
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NetBSD/alpha: Multia Frequently Asked Questions
Multia Heat Death It certainly helps to keep the CPU from overheating, but the cause of the typical
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Thermal Compound / Interface (Thermally Conductive)...
Home > Datasheets > Industrial Sealants > Thermal Compound / Interface (Thermally Conductive)
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Home | Methode Electronics,...
User Interface Radio Remote Controls Custom User Interface Standard User Interface Automotive & Transportation
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Thermal Interface Wet Dispensed Page - Dow Corning
Home > Technical Library > Electronics > Thermal Interface - Wet Dispensed
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Heat Sink | Pressurex-micro | Tactile Pressure Indicating...
Conductive Heat Transfer Across a Bolted Automotive Joint and the Influence of Interface Conditioning
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Thermal Management
Using the heat-sink-to-ambient equation (and a ?CS of 0.1 °C/W for typical thermal interface material), calculate the required heat-sink-to-ambient
