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Heat Conductive Potting Compound
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Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product.
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Supplier: Wacker Chemical Corp.Description: ELASTOSIL® RT 675 A/B is a pourable, addition-curing RTV-2 silicone rubber. Special features two-part, 1 : 1 mixing ratio very high hardness Shore A excellent heat stability high thermal conductivity Application encapsulation of electrical components
- Compound Type: Thermal Compound / Thermally Conductive
- Material Form: Encapsulant / Potting Compound
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Polymer / Chemical Type: Silicone
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Supplier: OMEGA Engineering, Inc.Description: OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper products.
- Compound Type: Electrical Insulation / Dielectric Material, Thermal Compound / Thermally Conductive
- Material Form: Encapsulant / Potting Compound
- Polymer / Chemical Type: Silicone
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Supplier: Epoxies Etc...Description: 50-1225 is a low viscosity, room temperature curing, RTV silicone potting and encapsulating compound. When cured, this material forms a soft, highly flexible, flame retardant, and thermally conductive package.
- Compound Type: Thermal Compound / Thermally Conductive
- Material Form: Encapsulant / Potting Compound
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Polymer / Chemical Type: Silicone
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Description: RTVS 920 is a two-component, low viscosity silicone that cures at room temperature to a transparent gel. It is supplied in a convenient kit with a 1:1 mix ratio by weight or volume.
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Form / Function: Conformal / Encapsulating Coating, Encapsulant / Potting Compound
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Chemical / Polymer System Type: Silicone
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Supplier: Quist ElectronicsDescription: Acts as thermal interface between a heat sink and an electronic device
- Substrate / Material Compatibility: Ceramic / Glass, Composites, Metal, Plastic
- Industry: Electronics
- Filled / Reinforced: Yes
- Cure Type / Technology: Thermosetting / Crosslinking
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Supplier: Ellsworth AdhesivesDescription: STYCAST 4954 is a RTV condensation cure, thermally conductive, silicone rubber potting compound. It yields a flexible, very thermally conductive material having excellent electrical properties and high temperature resistance. Sold as a pack (12/pk).
- Compound Type: Thermally Conductive
- Industry Applications: OEM / Industrial
- Chemical / Polymer System Type: Silicone
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Supplier: Master Bond, Inc.Description: of performance properties including high thermal conductivity, excellent electrical insulation characteristics and superior dimensional stability, as well as good physical strength properties. EP30AOSP is low viscosity with excellent flow characteristics making it ideal as a thermally conductive potting epoxy
- Compound Type: Electrical Insulation / Dielectric Material, Thermal Compound / Thermally Conductive, Thermal / Heat Insulating
- Material Form: Conformal Coating, Die Bonding Adhesive / Compound, Encapsulant / Potting Compound, Gap Filling Compound
- Electrical / Electronics Applications: Electrical Power (Coils, Motors), Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
- Industry Applications: Aerospace, Automotive, OEM / Industrial, Other
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Supplier: Epoxy TechnologyDescription: EPO-TEK® T7110 is a two component, thermally conductive, electrically insulating epoxy designed for heat sinking electronics and semiconductors. It may be used as an adhesive, potting, or encapsulation material, for industries such as consumer, medical or optics.
- Material Type: Grease / Paste
- Industry: Electronics, Semiconductors / IC Packaging
- Features: Electrical Insulation / Dielectric
- Chemical / Polymer System Type: Epoxy (EP)
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Supplier: Sauereisen, Inc.Description: Sauereisen Refractory Coating No. 360 is a heat-cured refractory coating for expendable thermocouple tubes and induction furnace linings. No. 360 exhibits excellent coating properties and may be applied by rolling, dipping or casting. No. 360 is also available in chemical-set formulation.
- Material Form: Adhesive, Coating, Dielectric Coating (Encapsulant, Conformal, etc.), Powder / Grain
- Features: Electronics / Semiconductors, Electrical Power / HV
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Supplier: Hernon Manufacturing, Inc.Description: Tuffbond epoxies offer substantial moisture, chemical, and heat resistance. Use for bonding: wood, metal, ceramic, glass, plastic, masonry, stone, concrete, rubber, etc. Provides high shear strength for tough and durable bonds. Surfaces to be bonded must be clean and free of oil. Tuffbond epoxies
Featured Products for Heat Conductive Potting Compound Top
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Epoxies etc...'s UL 94 V-O listed 50-2369 FR is the fastest self extinguishing Thermally Conductive Polyurethane Potting Compound available on the market today. It offers a unique combination of properties seldom seen in a Thermally Conductive Potting Compound. 50-2369 FR provides a quick heat dissipating system in a polyurethane chemistry, while also passing UL's 94 V-O self extinguishing test. Designing electronic assemblies with Epoxies, Etc...'s UL Listed 50-2369 FR Potting Compound... (read more)Browse Encapsulants and Potting Compounds Datasheets for Epoxies Etc... -
Sauereisen Thermal Potting Cement No. 11 is primarily used where high electrical insulation and thermal conductivity are desired. No. 11 is a chemical-setting cement ideal for potting applications subject to high temperature and thermal shock. Thermal Potting Cement No. 11 is formulated to be compatible with most metal alloys that it may contact. The cement is supplied in powder form and need only be mixed with water to apply. High electrical resistance. Heat conductive and thermal shock... (read more)Browse Specialty Adhesives, Sealants, and Compounds Datasheets for Sauereisen, Inc. -
DESCRIPTION: 50-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 50-2366 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical properties. This system is a good choice for potting applications containing surface mount components or any application requiring low stress, thermal conductivity and flame retardancy... (read more)Browse Electrical and Electronic Resins Datasheets for Epoxies Etc... -
Although Epoxies, Etc... offers a complete standard product line, we also custom formulate Potting and Encapsulating Compounds for specific customer requirements. Our technical team can develop a special viscosity, color, hardness, or other unique property for your application. The Epoxies, Etc... research and production facility is perhaps the newest and most advanced in the industry fulfilling small requests as well as large volume demands. Some of the types of custom formulated potting... (read more)Browse Encapsulants and Potting Compounds Datasheets for Epoxies Etc... -
Epoxies, Etc... develops 50-3150 FR to meet the non-burning requirements of UL94 V-O. 50-3150 FR Black Epoxy with Catalyst 190 and Catalyst 105 are listed with Underwriter's Laboratory for passing UL94 V-O. This system offers heat transfer, low shrinkage, and outstanding insulation properties. The 50-3150 FR provides both thermal conductivity and flame retardancy in an electronic grade potting compound. TYPICAL SPECIFICATIONS: · Viscosity @ 25oC cps 60,000. · Specific Gravity, 25oC/25oC 1.6... (read more)Browse Encapsulants and Potting Compounds Datasheets for Epoxies Etc... -
20-3063. POTTING COMPOUND. DESCRIPTION: 20-3063 is an electronic grade potting and encapsulating compound. This is a low cost epoxy system designed for applications requiring a low viscosity. 20-3063 has an easy one to one mix ratio by weight or volume. The resin is pigmented black and the catalyst white for a visual indication that the products have been properly mixed together. For less filler settling and a slightly higher viscosity use Catalyst 20-3063C HV. FEATURES: * Low Viscosity. * Low... (read more)Browse Encapsulants and Potting Compounds Datasheets for Epoxies Etc... -
Epoxies, Etc's new electronic grade 20-2620 is a two component Polyurethane compound designed for applications requiring "water like" clarity. This room temperature curing system provides excellent environmental protection and will not yellow over time. 20-2620 is semi-flexible and will not place excess stress on electronic components. It also has a low viscosity, which facilitates easy flow and penetration into difficult areas. This product has a convenient one to one mix ratio... (read more)Browse Encapsulants and Potting Compounds Datasheets for Epoxies Etc... -
Epoxies, Etc. has developed two new Polyurethane Potting Compounds. These systems provide outstanding thermal cycling properties, low temperature resistance, and low embedment stress to sensitive electronic components. 50-2185 is a filled 80 Shore A system exhibiting flexibility to -55C, high thermal conductivity, and flame resistance meeting UL 94 V-O. These unique set of properties provide low component stress upon curing and extreme thermal cycling making 50-2185 ideal for protecting... (read more)Browse Encapsulants and Potting Compounds Datasheets for Epoxies Etc... -
Epoxies, Etc... recognizes the importance of developing green chemistries. The new Elastomeric Polyurethane Potting Compounds are formulated with natural oil based polyols that are obtained from a plant source. In addition to being derived from a renewable resource, they are also free of any Volatile Organic Compounds (VOC's). These low durometer products range in hardness from a gel to a Shore A 80. They have excellent dielectric properties and are ideal choices for the potting, casting... (read more)Browse Encapsulants and Potting Compounds Datasheets for Epoxies Etc... -
to room temperature or heat cure. Call today to discuss your application with a Technical Sales Engineer with over 20 years of potting and encapsulating experience!... (read more)Browse Encapsulants and Potting Compounds Datasheets for Epoxies Etc...
Conduct Research Top
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Managing Heat Transfer With Potting Compounds
and require additional power to operate. Molded plastics are used in place of metal enclosures due to cost control and weight savings. In most cases, these plastics are not as effective at transferring heat away from its source. Thermally conductive potting compounds are an effective way to control...
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The Coolest Compounds (.pdf)
Through heat dissipation, thermally conductive adhesives and potting compounds play a pivotal role in the protection of today's electronic circuitry. In tandem with the great growth of the technological sector comes the need for a new generation of innovative, highly advanced solutions capable...
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Connectors stand up to corrosion
against harsh environments. Sealing closes off the leak paths that moisture and oxygen follow to get to the contacts. Silicone-based materials and epoxy-based "potting" compounds are effective sealants in many applications. Both types are typically applied by hand to the connectors; but hand application...
Engineering Web Search: Heat Conductive Potting Compound Top
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Epoxies, Etc... - Epoxy, Urethane & Silicone Formulations Electrically Conductive Ink Water Resistant Potting Compound Potting, Encapsulating and Casting Electrically Conductive Resins See Epoxies Etc... Profile & Catalog |
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Epoxies, Etc... - Non-Hazardous Electrically Conductive Ink Water Resistant Potting Compound Potting, Encapsulating and Casting Electrically Conductive Resins See Epoxies Etc... Profile & Catalog |
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Potting Compound withstands temperature extremes., Master... Potting Compound withstands temperature extremes. Potting Compound withstands temperature extremes. |
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Current and reliable Adhesives & Sealants news stories Potting and Encapsulating Compound is FDA compliant. |
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MasterBond.com | Adhesives, Sealants & Coatings UV Potting Compounds Dual Curing Form-in-Place Gaskets Heat Curing LED Curing Room Temperature Curing See Master Bond, Inc. Profile & Catalog |
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RTV Silicone Sealants, High Temperature Sealants and Adhesives... Resistant Sealants and Adhesives Engineering Adhesives | RTV Silicone Potting Compounds and Silicone Gel |
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Loctite? 3861 Thermally Conductive Potting 3861 Thermally Conductive Potting A thermally conductive, potting compound for automotive electronic applications requiring thermal conductivity and |
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Chemicals - Chemicals & Adhesives from Allied Electronics See Allied Electronics, Inc. Profile & Catalog |
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Metal repair and patching compound - Alvin Products - Metal... Heat Block Heat Sink Compound Telcon Mold Release dry lubricant LAB-METAL ready-to-use repair and patching compound. See Alvin Products Inc. Information |
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SAE Standards Works Silicone Potting Compound, Elastomeric, Two-Part, General Purpose, 200 - 600 Poise Viscosity (Cancelled Jul 1988) See SAE International Information |
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