Products & Services
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Supplier: Molex
Description: Heat Sink for LED Array Holders with 40.00mm Screw Centers, 80.00mm Diameter, 40.00mm, Pre-drilled, Black Anodized Finish
- Device: Passive Heat Sink
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Supplier: SFCable.com
Description: Heat Sink Silicon Compound
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Supplier: RS Electronics
Description: Up to 25A Usage Rated Heat Sink that offers excellent thermal management and are matched to the load current rating of a variety of Crydom relays.
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Supplier: Comus International
Description: on hocky puck type of solid state relays to be attached between the cooling plate and the heat sink * Other shapes can be used between a transistor and a heat sink * Between a heat sink and a chassis
- Device: Passive Heat Sink
- Heat Sink Fin Style: Straight Fin
- Mounting: Mounting Holes
- Material: Aluminum
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Supplier: Wonik Corporation USA
Description: Certified Factories · Over 100 factories available dependant on product requirements · ISO UL, CSA, CE, RoHS, ENERGY STAR Seven dedicated sourcing agents throughout Asia · China, Taiwan, Japan, Korea, Hong Kong Superior consolidated freight capabilities ·
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Supplier: Tempco Electric Heater Corporation
Description: Solid state relay de-rating curves are used to determine the actual current the relay is capable of carrying vs. the ambient temperature in the enclosure. It also indicates the heat sink required to dissipate the heat the relay produces at the ambient temperature. Failure to dissipate
- Device: Passive Heat Sink
- Heat Sink Fin Style: Straight Fin
- Mounting: Mounting Holes, Other
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Supplier: CoorsTek
Description: Optimize Component Life and Performance A natural choice for both electrical insulation and heat diffusion, our ThermTile™ ceramic tiles and films serve the power generation industry and are used to lower the power chip's operating temperature by dissipating heat build-up. These sinks
- Device: Passive Heat Sink
- Material: Other Materials
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Supplier: Newark / element14
Description: Heat Sink Compoud; Leaded Process Compatible:No; Peak Reflow Compatible (260 C):No
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Supplier: Ohmite Manufacturing Co.
Description: Ohmite S Series LED Heatsinks are low cost and easy assembly heat sinks for “Star” LED packages supplied by Cree, Lumileds, Osram and others. This simple heat sink can hold LED modules and can be mounted simply with some thread forming screws. The heat sink has two types of surface
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Supplier: Allied Electronics, Inc.
Description: LE Enclosure Black without heat sink
- Type: Electronic and Instrument Enclosures
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Supplier: Thorlabs, Inc.
Description: The HSLT1 Lens Tube Heat Sink provides the ability to cool down a lens tube setup that may be subject to an unusual amount of heat. By providing a total surface area of 79 square inches, the HSLT1 provides a thermal resistance of 0.25°C/W. Ø1 optical components can be mounted
- Adjustment Type: Fixed
- Mounted Object Shape: Circular
- Mount Type: Lens Holder
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Description: Castable Epoxy Heat Sink, UL recognized under file E86165 & meets the flammability requirement of 94 V-0. INSULCAST 140 FR is an epoxy casting system with high thermal conductivity. This system, when cured with INSULCURE 11B, also provides Class F operating properties.
- Material Type / Grade: Thermoset
- Chemical / Polymer System Type: Epoxy
- Features: Thermally Conductive
- Industry: Aerospace, Automotive, Electronics, Electric Power, Military / Government (MIL-SPEC), Industrial, Building / Construction, Other
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Supplier: Teledyne Relays
Description: The Series XV relay combines the best of solid-state and electromechanical technology. The relay is designed in a touch-proof hockey puck package. The XV relay switches current up to 30A without a heat sink. Visual control status is provided as a standard. Elimination of the heat sink conserves
- Solid State Relay Type: Optically Isolated Relay
- Application Type: General Application Relay
- Mounting: DIN Rail
- Input Voltage Type: DC
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Supplier: Nye Lubricants, Inc.
Description: Overview Heat sink compounds or thermal greases, are wide-temperature, grease-like materials that are used to conduct thermal energy away from sensitive components to larger ventilated areas or to heat measuring and controlling instruments. The plasticity of the heat sink compound or thermal
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Description: FIXED POWER WIREWOUND RESISTORS WIREWOUNDINSULATED HEAT SINK RESISTORS WITH RIGID TERMINATION
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Supplier: R. S. Hughes Company, Inc.
Description: Super Lube(R) Silicone Heat Sink - 30 lb pail. Silicone compound blended with thermally conductive, fine metal oxide powders Features: Temperature range from -40degF to +500degF; High dielectric strength; Excellent heat transfer efficiency; Viscosity stable; Superior conductive quality; Thermally
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Supplier: Digi-Key Corporation
Description: HEATSINK ALUM ANOD
- Device: Passive Heat Sink
- Mounting: Mounting Holes
- Material: Aluminum
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Supplier: ASME
Description: thermal performance. He or she will choose it as the only one that will work electrically. Lesson: Introduction to CFD (computational fluid dynamics). Chapter 6: When Is a Heat Sink Not a Heat Sink?.................39 More folklore from EE-land about how aluminum has the magical ability to absorb
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Supplier: ASME Standards and Certification
Description: thermal performance. He or she will choose it as the only one that will work electrically. Lesson: Introduction to CFD (computational fluid dynamics). Chapter 6: When Is a Heat Sink Not a Heat Sink?.................39 More folklore from EE-land about how aluminum has the magical ability to absorb
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Supplier: OMEGA Engineering, Inc.
Description: User to Precisely Control Air Flow Rate Using the Included USB Cable to Connect to the Control Box • Large Test Chamber with a Hinged Access Door and Small Access Panel Allows for Fast Comparison Testing on Many Different Size Heat Sinks and Circuit Boards • Operates from 90 to 264 Vac
- Test Chamber Style: Benchtop / Instrument, Reach-In
- Test Parameters: Other
- Features: Programmable, Windows
- Type: Environmental Stability
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Supplier: PLANSEE SE
Description: Wafer substrates are bonded to the semiconductor layers of LED chips. With molybdenum and molybdenum-copper wafer substrates, PLANSEE offers the optimum material for a reliable heat dissipation in LED chips. The uniform thermal expansion of the wafer substrate, sapphire substrate and ceramic base
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Supplier: Saint-Gobain Innovative Materials
Description: Saint-Gobain NorPro's Process Ceramics group has developed and manufactured more heat transfer media than any other company in the world. In fact, we were the first company to supply a media, Norton™ Proware™ saddles, for regenerative thermal oxidizers (RTO). Since then, we have
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Supplier: Saint-Gobain NorPro
Description: Saint-Gobain NorPro's Process Ceramics group has developed and manufactured more heat transfer media than any other company in the world. In fact, we were the first company to supply a media, Norton™ Proware™ saddles, for regenerative thermal oxidizers (RTO). Since then, we have
Find Suppliers by Category Top
Featured Products for Heat Sink Top
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Mouser Electronics, Inc.
Ohmite SV-LED Series Heat Sinks
Ohmite's SV-LED Series Heat Sinks are high performance, low cost, configurable, scalable and compact power heatsink for LED modules. These powerful, high aspect ratio heatsinks come in two standard heights (14 and 25mm). They can be configured to customer specifications for length, surface finish, mounting holes, and custom machining. With a 9.9mm mounting surface, these heatsinks are popular in applications such as illuminated headsets for surgeons and dentists. (read more)
Browse Heat Sinks Datasheets for Mouser Electronics, Inc. -
HV Components/CKE
Modular Heat Sink Assembly
The Modular Heat Sink Assembly from CKE provides a modern, economical, labor saving, replacement of diodes, SCR or IGBT modules for traditional ceramic capsule (hockey puc) or stud assemblies. Options include cooling fan, snubbers, fuses, and/or terminal blocks. A version of the assembly offers a form, fit and function replacement to legacy devices thus reducing downtime and increasing reliability. The AC Contactor version is rated to 1200V, 160A (185A air cooled). A 3 Phase Full Wave SCR... (read more)
Browse Diodes Datasheets for HV Components/CKE -
Mouser Electronics, Inc.
Ohmite M Series Dual Clip Heatsinks -Expansion
M Series Dual Clip Heatsinks has been expanded. New sizes available! The Ohmite M Series Dual Clip Heatsinks for TO-264 and TO-247 packages. The M Series is a patented, high performance, low cost, configurable, scalable, and compact heat sink with a matrix clip system. This powerful heat sink provides the easiest assembly, largest surface area, and smallest footprint. The Ohmite M Series Dual Clip Heatsinks for TO-264 and To-247 are the ideal type of heat sink for high power density... (read more)
Browse Heat Sinks Datasheets for Mouser Electronics, Inc. -
Mouser Electronics, Inc.
ATS FanSINK™ Heatsinks from MOUSER
Advanced Thermal Solutions (ATS) fanSINK ™ Heatsinks feature omnidirectional air flow for optimum thermal performance independent of PCB layout. ATS fanSINK ™ Heatsinks ensure dependable long-term fan to heatsink assembly with stainless screw fan attachments. The heatsink is attached with ATS maxiGRIP ™ hardware avoiding the need for PCB mounting holes. Includes pre-assembled thermal interface material, fan not included, must be sourced separately. SUBSCRIPTION CENTER -... (read more)
Browse Heat Sinks Datasheets for Mouser Electronics, Inc. -
Mouser Electronics, Inc.
ATS MaxiFLOW™ Heatsinks from MOUSER
Advanced Thermal Solutions (ATS) maxiFLOW ™ heatsink design features a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. ATS maxiFLOW ™ heatsink features 3 attachment methods, maxiGRIP ™, thermal tape, or pushpin. MaxiGRIP ™ attachment applies steady, even pressure to the component and does not require holes in the PCB. thermal tape mounts the heatsink to the IC with a thermally conductive adhesive strip. Pushpin... (read more)
Browse Heat Sinks Datasheets for Mouser Electronics, Inc.
Parts by Number for Heat Sink Top
| Part # | Distributor | Manufacturer | Product Category | Description |
|---|---|---|---|---|
| HEAT SINK | ASAP Semiconductor | ATT | Not Provided | HEAT SINK |
| HEAT SINK STREET LIGHT | Straight Road Electronics, Inc. | COOLER MASTER USA I | Not Provided | HEAT SINK STREET LIGHT |
| HEAT-SINK)95 | National Microchip | Not Provided | Not Provided | Not Provided |
| HEAT SINK | National Microchip | T220 | Not Provided | Not Provided |
| HEAT SINK | National Microchip | TO-5 | Not Provided | Not Provided |
| HEAT-SINK | National Microchip | TO3 | Not Provided | Not Provided |
Conduct Research Top
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Copper Heat Sinks Versus Aluminum Heat Sinks - Advantages and Disadvantages (.pdf)
Aluminum heat sinks . Advantages and Disadvantages. Many designers will turn to copper as an alternative material to improve heat sink. performance when an aluminum sink may not provide enough cooling. In some cases this. switch is justified, in other cases it may not be. Following are a few rules
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Skived Fin Heat Sinks (.pdf)
ultra-fast microprocessors and other. small volume, medium Wattage heat sources skived fin heat sinks offer an. alternative to aluminum extrusions. · The Manufacturing Process. A skived fin heat sink start with a single piece of base material,. typically either copper or aluminum. A cutting tool contacts
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Evaluating Heat Sink Contact Pressure
High density, active, electronics emit energy that can raise their temperature leading to failures. Heat sinks are secured to components to dissipate their heat. For the heat sink to function properly, even contact must be achieved between the part being cooled and the heat source. This can
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Basic Training - Heat Sink (.pdf)
-(2.5c/w) = 3.5 c/w. Review Heat Sink Sizing. Heat sinks help to cool semiconductors. Most power electronics require cooling. Thermal resistance () is in degrees C/Watt. Find the needed heat sink size by: ! sa = (Tj-Ta)/Q (jc+ cs). In sizing a heat sink use sa X Watts =. temperature. Good reality
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Heat Sink Design - Aluminum Extrusions (.pdf)
aluminum heat sink need to be low in weight, high in exposed surface area and simple in design. Violation of these basic design criteria will result in less than optimized heat sinks for the specific application. Heat Sink Design Aluminum Extrusions. Heat Sink Design Aluminum Extrusions. 1
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Heat Sink Success Story
with predictable product outcome using statistical process controls. Heat Sink Success Story | ATS Automation. Skip to Main Navigation Skip to Content Customer Support. English. More Coming Soon. Contact Us | Working at ATS | Investor Relations. Main Navigation. About Us. Technology. Life
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PYROID HT Pyrolytic Graphite Thermal Management Material Heat Sink Application
A major avionics customer with a high power load application was experiencing elevated temperatures (>150 oC) and non uniform heat distribution in the base of an existing aluminum heat sink. As a result, the power device was experiencing premature, "in the field" failures which necessitated
- Thermal Resistance v.s. Heat Sink Volume
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What is heat sink? - A Word Definition From the Webopedia...
A heat sink without a fan is called a passive heat sink; a heat sink with a fan is called an active heat sink.
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Heat Sinks Future trends in heat sink design
