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Supplier: Newark / element14
Description: HEAT SINK COMPOUND, WHT SYRINGE 1OZ; Sealant Applications:Electronics; Color:White; Dispensing Method:Syringe; Volume:1fl.oz. (US)
- Industry: Electronics
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Supplier: PENCOM
Description: For heat sinks/spreaders in virtually any commercially available material
- Features: Thermally Conductive
- Industry: Electronics
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Description: INSULCAST 147 FR is an epoxy casting system giving extremely high thermal conductivity. Several hardeners can be used to cure INSULCAST 147 FR; however, where thermal conductivity is critical, the hardeners with low ratios should be used to insure highest thermal conductivity. INSULCAST 147 FR is
- Material Type / Grade: Thermoset
- Chemical / Polymer System Type: Epoxy
- Filler Material: Unfilled
- Features: Flame Retardant (e.g. UL 94 Rated), Thermally Conductive, UL Approved
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Supplier: Quist Electronics
Description: Acts as thermal interface between a heat sink and an electronic device
- Use: Gap Filling Compound
- Form: Pad
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Contact / Pressure Sensitive (PSA), Thermosetting / Crosslinking
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Supplier: SABIC
Description: Konduit* compounds were the first thermally conductive composites commercially available. From 10 to 50 times more thermally conductive than conventional unfilled thermoplastics, Konduit compounds can conduct heat away from devices into a heat sink or the surrounding air, designed to extend product
- Chemical / Polymer System Type: Polypropylene (PP)
- Filler Material: Other
- Compound Type: Molding Resin
- Pellets: Yes
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Supplier: Epoxy Technology
Description: , are acceptable. • Suggested Applications: o PCB: Bonding heat sinks; Adhesion to Al, Cu, most metals and plastics Bonding SMDs to PCB; Adhesion to FR4, flex PCB, active and passive SMT packages; staking SMDs to PCB for double sided circuits
- Material Type / Grade: Thermoset
- Chemical / Polymer System Type: Epoxy
- Compound Type: Liquid
- Features: Thermally Conductive
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Supplier: Allied Electronics, Inc.
Description: Temperature Range: –55°C to 150°C. Electric Strength Voltage: 6,000 V, 50 Hz up to 12,000 V on special request. 10 GΩ min. and 500 V. 14 mm min. ≤80 nH. Electric Support is High Alumina Content Ceramic Metallized on the Bottom for Ideal Heat Transfer and Optimum Discharge
- Features: Heat Sink
- Category / Application: General Use
- Technology / Construction: Thick Film
- Mounting / Packaging: Surface Mount (SMT / SMD)
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Supplier: Epoxy Technology
Description: PCB: bonding aluminum heat sinks; die-attaching IC’s via COB format Optical: heat sinking laser diodes and fiber optic components; adhesive for the optical bench
- Form: Grease / Paste
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking
- Industry: Semiconductors / IC Packaging, Electronics
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Supplier: Protavic America, Inc.
Description: Filled epoxy system for high thermal applications such as heat-sink bonding. This material has 2.2 Wm°K thermal performance with supporting laser flash data. Room temperature cure.
- Material Type: Die Bonding Adhesive / Compound
- Industry: Electronics, Electrical Power / HV, Semiconductors / IC Packaging, OEM / Industrial, Other
- Features: Electrical Insulation / Dielectric
- Chemical / Polymer System Type: Epoxy (EP)
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Supplier: Hi-Tech Seals, Inc.
Description: acrylics. Dissipator® structural acrylics provide specific adhesion for bonding electrical heat sink components with high thermal conductivity. Heat trapped and not dissipated by the components can lead to premature component failure and costly repair and replacement. Thermal conductivity
- Material Type: Grease / Paste
- Industry: Electronics
- Chemical / Polymer System Type: Acrylic / Polyacrylate
- Cure Type / Technology: Two Component System
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Supplier: Device Technologies, Inc.
Description: a high ratio of thermally conductive ceramic fillers. They exhibit outstanding thermal conductivity because they conform well in the gap between the heat generating device and the heat-sink. Features and Benefits: • UL94 V-0 flammability rated • Highly compressible • Low thermal
- Substrate / Material Compatibility: Metal
- Industry: Aerospace, Electronics, Medical / Food (Sanitary / FDA), Military / Government (MIL-SPEC / GG), OEM / Industrial, Other
- Chemical / Polymer System Type: Silicone
- Filled / Reinforced: Yes
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Description: 3M™ Thermally Conductive Adhesive Transfer Tapes 8805, 8810, 8815 and 8820 are designed to provide a preferential heat-transfer path between heat-generating components and heat sinks or other cooling devices (e.g., fans, heat spreaders or heat pipes). • These tapes are tacky pressure
- Substrate / Material Compatibility: Metal
- Industry: Electronics
- Chemical / Polymer System Type: Acrylic / Polyacrylate
- Filled / Reinforced: Yes
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Supplier: Wacker Chemical Corp.
Description: Controlled volatility Almost constant properties between -50 °C and +180 °C Application Bonding of electronic parts with heat sinks Fixing electronic parts to circuit boards Heat transmission glue for ECUs and power modules
- Material Form: Polymer (Plastic / Elastomer)
- Features: Electronics / Semiconductors
- Compound Type: Thermal Compound / Heat Conductive
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
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Supplier: Ellsworth Adhesives
Description: One-part; low flow; gray thermally conductive adhesive. Bonding integrated circuit substrates; adhering lids and housings; attaching base plates and heat sinks. Bonding integrated circuit substrates; adhering lids and housings; attaching base plates and heat sinks.
- Form: Liquid
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Air Setting / Film Drying
- Industry: Electronics
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Supplier: Master Bond, Inc.
Description: conductivity measures 10 BTU•in/ft²hr°F. The volume resistivity exceeds 10x1012 ohm cm. This superior thermally conductive film product is widely employed for bonding electronic components to heat sinks along with adhering substrates into microelectronic packages. It offers more than
- Material Form: Polymer (Plastic / Elastomer)
- Features: Electronics / Semiconductors
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Specialty / Other
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Supplier: VMC Technical Assistance Corp.
Description: High performance discs that provide the best possible professional polish on the curved edges of granite, often higher than the original factory polish. Heat sintered in a mold with a durable resin compound. Designed for wet granite hand polishing, these discs work extremely well in tight curved
- Abrasive Grain / Material Type: Ceramic, Superabrasive - Diamond
- Abrasive Grain Type: Ceramic, Superabrasive - Diamond
- Type: Superabrasive Disc
Find Suppliers by Category Top
Conduct Research Top
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Managing Heat Transfer With Potting Compounds
heat build-up in an electronic assembly. Epoxies, urethanes and silicones are used to bond heat sinks, encapsulate power supplies and individual components and protect motors from overheating. Thermal conductivity (k) is the property of a material that indicates its ability to conduct heat. Air
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Power converter application notes - heat radiation in design
not be sufficient for heat dissipation in your application, using a Heat-Sink is a simple way to further lower the converter's surface temperature. Potting materials used in converters are usually heat conducting materials - silicon or resin. In some situations using natural convection the heat-resistance between
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Designing to beat the heat
the plastic and dissipates more efficiently to the air. Therefore, the temperature of the plastic drops meaning that a less expensive, lower temperature base resin can often be used. Heat transfer and thermal conductivity are not linearly related. The relationship between them, however, applies to any
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Designing to beat the heat
analyzers and industrial conveyor-belt sections. It features an integrated motor and controller with a thermally conductive plastic housing and heat sink. Replacing die-cast aluminum with thermally conductive plastic let IMS hold tighter tolerances and reduce its cost by 50%. The plastic housing
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Glass Bubbles Reduce Weight of TPO Parts (.pdf)
mix varies, and can be as much as 50 percent by weight,. resin. The positive attributes of increased stiffness and heat distortion. depending on customer requirements. Finished parts made using this. temperature (HDT) as well as decreasing coefficient of linear thermal. masterbatch glass bubble
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The ABCs of ABS
Tweaking mix ratios of acrylonitrile/butadiene/styrene in ABS resins lets designers boost a part's heat stability, chemical resistance, toughness, stiffness, and impact resistance. Edited by Jean M. Hoffman The Kiwi Too travel trailer from Jayco Inc., Middlebury, Ind., sports a durable
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B-stage Epoxy
, at a later time, be completely cured under heat and pressure. ./bcf17c79-b280-43eb-8931-a6cf2265680d www.epotek.com. Tech20. Tip. B-stage Epoxy. Definition. What > Understanding. B-staged epoxy resin is a descriptive term used to define a one component epoxy system,. B-stage Epoxy Adhesives. using
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Making Sense of High-Temperature Thermoplastics
. The housing. article.) More than 20 polyimides have been synthesized. measures 2 x 0.875 x. from amines, anhydrides and other precursors. The two. 3.75 inches and. most widely used polyimides are polyetherimide (PEI) and. provides a mounting. polyamideimide (PAI). surface for a heat. sink and cooler
Engineering Web Search: Heat Sink Resin Top
- PK119 - HQG208 Material Declaration Data Sheet (Pb-free Heat...
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PK195 - BG352 Material Declaration Data Sheet (Standard Metal...
Attach 0.004 0.06% Material Resin Trade Secret 25.00 0.001 Silver 7440-22-4 75.00 0.003 Mold 0.2374 3.32% Compound Resin Trade Secret 26.00 0.062
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Polyurethane - Wikipedia, the free encyclopedia
were obtained by incorporating pre-placed glass mats into the RIM mold cavity, also known broadly as resin injection molding or structural RIM.
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Varnish - Wikipedia, the free encyclopedia
Varnish is traditionally a combination of a drying oil, a resin, and a thinner or solvent.
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Single Edge Contact Connector 2 (S.E.C.C. 2) Thermal Interface...
3.4 Heat Sink Interface - PLGA.......................................................................................8 3.5 Heat Sink Interface -
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Intel? 945GM Express Chipset GMCH
11 3 Figure 3 0? Angle Attach Heat Sink Modifications (Generic Heat Sink Side and Bottom View)12 4 Figure 4 Airflow Temperature Measurement
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Packing Datasheet
TQFP Thin Quad Flat L-Leaded Package 0.40/0.50 HQFP QFP with Heat Sink 0.40/0.50/0.65 LCC* Leadless Chip Carrier 1.016/1.27 QFN Quad Flat Non-Leaded
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Untitled
first electric element, the second electric element, the first wiring board, the second wiring board and the heat sink are molded with a resin mold,