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Supplier: Plastronics Socket Company, Inc.
Description: Available with optional Heat Slug, Spring-Loaded Center Pin or Slug/Pin Combination Flexible socket designs - reduced cost and lead-time Integrated socket solutions - reduced risk In-house tool and mold - rapid response and turnaround Extensive catalog - easy purchase With the largest QFN catalog
- Product Type: IC Socket
- Package Type: QFN
- Mounting: Through-hole
- Features: Clamshell Socket
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Supplier: Avago Technologies
Description: This 1W Power LED Light Source is a high performance energy efficient device which can handle high thermal and high driving current. The exposed pad design enables excellent heat transfer from the package to the motherboard. Option with electrically isolated metal slug is also available. The low
- Color: Green
- Lens Type: Domed Lens
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Supplier: Avago Technologies
Description: This 1W Power LED Light Source is a high performance energy efficient device which can handle high thermal and high driving current. The exposed pad design enables excellent heat transfer from the package to the motherboard. Option with electrically isolated metal slug is also available. The White
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Supplier: Avago Technologies
Description: This 1W Power LED Light Source is a high performance energy efficient device which can handle high thermal and high driving current. The exposed pad design enables excellent heat transfer from the package to the motherboard. Option with electrically isolated metal slug is also available. The White
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Supplier: Avago Technologies
Description: This 3W Power LED Light Source is a high performance energy efficient device which can handle high thermal and high driving current. The exposed pad design enables excellent heat transfer from the package to the motherboard. Option with electrically isolated metal slug is also available. The White
- Color: Blue
- Lens Type: Domed Lens
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Supplier: Avago Technologies
Description: The ASMT-MW62-NEG00 ½W Power LED emitter is a high performance energy efficient power LED which can handle high temperature and high driving current. The exposed pad design has excellent heat transfer from the package to the motherboard. The ASMT-MW62-NEG00 metal slug is electrically
- Color: White
- Lens Type: Domed Lens
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Supplier: DME Company
Description: channel. The thermocouple equipped coil heater features a square (or flat) cross section to improve heat transfer to the core’s .312 diameter feed channel. The heated nozzle locator provides quicker and easier system start-ups, minimizes pressure loss and eliminates cold slugs in the feed
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Featured Products for Heat Slug Top
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Avago Technologies
ASMT-AW00-NRS00 1W High Power LED - AVAGO
This 1W Power LED Light Source is a high performance energy efficient device which can handle high thermal and high driving current. The exposed pad design enables excellent heat transfer from the package to the motherboard. Option with electrically isolated metal slug is also available. The Cool White Power LED is available in various color temperature ranging from 4000K to 10000K and Warm White Power LED ranging from 2600K to 4000K. The low profile package design is suitable for a wide... (read more)
Browse Light Emitting Diodes (LED) Datasheets for Avago Technologies -
Avago Technologies
1W Mini High Power LED
process. To facilitate easy pick & place assembly, the LEDs are packed in EIA-compliant tape and reel. View Data Sheet (PDF). Features: Available in Red, Amber, Green, Blue, Cool White, Neutral White and Warm White. Small footprint. Energy efficient. Direct heat transfer from metal slug to mother board. Compatible with reflow soldering process. High current operation. Long operation life. Wide viewing angle. Silicone encapsulation. Non-ESD sensitive (threshold > 16kV). MSL 1 products... (read more)
Browse Light Emitting Diodes (LED) Datasheets for Avago Technologies -
Kingbright Corporation
3W High Power SMD LED
heat dissipation with low thermal resistance of 7 deg C/W (Rth j-slug), also withstands ESD voltage up to 8000V. Furthermore, the LED features a maximum allowable junction temperature of 130°C providing designers with more design flexibility. The low power consumption, IR reflow solderable device is specially designed for automatic pick-and-place mounting process to reduce production costs. (read more)
Browse Light Emitting Diodes (LED) Datasheets for Kingbright Corporation
Conduct Research Top
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Heat Recovery Media: Monolith/Structured vs. Random Packed
Choosing a heat recovery media for an RTO is not as simple as meets the eye. There are numerous misconceptions to overcome and many variables to consider in choosing a heat recovery media; especially in regard to thermal efficiency and VOC destruction efficiency. Thermal efficiency and destruction
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Thermal Management in Embedded PC Systems (.pdf)
, but in high-power ICs a metal heat slug. or "flip chip" style packaging allow closer thermal coupling. to the silicon die for more efficient heat transport. Many. ICs, particularly processors, offer programmable power. reduction features such as dynamic clock speed control. Low-power processors may
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Theory of Rating
of standard air. air through fan in. are required to pass through the section. In passing through the section,. actual cubic feet per. however, the air will take on heat, increasing the CFM which must be. handled by the fan. The reverse would be true if the fan were drawing air. minute. through
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Performance Characteristics of a Newly Developed Ni-Mo Sinter-hardened PM Steel
Sinterhardening of PM components has been a successful and cost effective alternative to secondary heat treatment by eliminating the Heat Treatment manufacturing step. However, Sinterhardening alloys have been facing increased cost pressure due to the increases and fluctuations in the prices
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Sinter Hardening Response of Chromium PM Steels
$50,000 USD/ton[1] new. material systems are being explored. Chromium base steels are being evaluated to replace many. of these nickel containing systems due to the low cost of chromium ($1500 USD/ton)[1]. In nickel containing systems, heat treatment of admixed nickel materials or sinterhardening
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Fiber Laser Welding of High Integrity Implantable Medical Devices
, particularly used for electrical connections, have become so small and thin that the conventional Nd:YAG laser performs like a big and rough tool. The greatest challenge for welding is that the miniature components have limited heat sink ability, particularly if the components contain heat sensitive elements
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Question and Answer Regarding Induction Heating Large Billets (.pdf)
Coil. Failures series will. continue in the next. issue of Heat Treating. Progress. Part 14 of. the series will discuss. failure analysis and. prevention of. split-return induction. Fig. 1 -- Aluminum slugs rest on ceramic pedestals in vertically arranged induction coils. Courtesy of Inductoheat
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Room Temperature LED and D-Pak Type Component-Attach and Reliability Testing (.pdf)
this mismatch by bonding at were made to. room temperature. During this room surface mount the LED package to the ates a metallic bond between the LED. temperature process, the heat is only MCPCB. The 4mm center bond, called and the board pad. delivered to the solder and bondline and the center slug
Engineering Web Search: Heat Slug Top
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heat slug - Dicion?rio internet
heat slug <hardware, processor> A metal plate that helps dissipate heat away from the silicon core of a processor to the packaging or heat-sink.
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Combination of Transient Plane Source and Slug Calorimeter...
FRM were also evaluated in a high temperature electrical furnace using a simple slug calorimeter that has been described in detail [7 Its underlying
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NIST Guide to SI Units - Appendix B9. Conversion Factors
DIVIDED BY LENGTH HEAT Available Energy Coefficient of Heat Transfer Density of Heat Density of Heat Flow Rate Fuel Consumption Heat Capacity and
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Slug flow heat transfer in square microchannels
Title: Slug flow heat transfer in square microchannels Authors: V. Talimi, Y.S. Muzychka, S. Kocabiyik Abstract: While heat transfer in Taylor (slug)
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A heat transfer model for slug flow in a horizontal tube
Title: A heat transfer model for slug flow in a horizontal tube Authors: G. Sun, G.F. Hewitt, V.V. Wadekar Abstract: A new model is presented for the
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High-explosive anti-tank warhead - Wikipedia, the free...
"HEAT" redirects here. For other uses, see Heat (disambiguation).
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Heat transfer enhancement with laminar liquid-gas slug flows
in Electronic Systems (ITherm) Item Title: Heat transfer enhancement with laminar liquid-gas slug flows Publisher Name: IEEE Meeting Location: Las
- Thermal characterization of an alumina ceramic MCM with...
